Mounting technology of BGA-P and BGA-T

Abstract

The BGA is not as easy to inspect or repair as other package formats. The feasibility of its practical application hinges, therefore, on the condition that its bonding rate and solder defect level is superior to that of the QFP. In order to promote the spread of BGAs, there is a pressing need to establish a process for ensuring high bonding reliability. In this report, we present the mounting test on a BGA-P with 225 pins and a BGA-T with 426 pins. We hope that this information will contribute to spurring the adoption of the BGAs.