BGA-P和BGA-T的安装技术

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI:10.1109/IEMT.1995.526197

D. Hattas, A. Wakigawa

{"title":"BGA-P和BGA-T的安装技术","authors":"D. Hattas, A. Wakigawa","doi":"10.1109/IEMT.1995.526197","DOIUrl":null,"url":null,"abstract":"The BGA is not as easy to inspect or repair as other package formats. The feasibility of its practical application hinges, therefore, on the condition that its bonding rate and solder defect level is superior to that of the QFP. In order to promote the spread of BGAs, there is a pressing need to establish a process for ensuring high bonding reliability. In this report, we present the mounting test on a BGA-P with 225 pins and a BGA-T with 426 pins. We hope that this information will contribute to spurring the adoption of the BGAs.","PeriodicalId":123707,"journal":{"name":"Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'","volume":"20 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Mounting technology of BGA-P and BGA-T\",\"authors\":\"D. Hattas, A. Wakigawa\",\"doi\":\"10.1109/IEMT.1995.526197\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The BGA is not as easy to inspect or repair as other package formats. The feasibility of its practical application hinges, therefore, on the condition that its bonding rate and solder defect level is superior to that of the QFP. In order to promote the spread of BGAs, there is a pressing need to establish a process for ensuring high bonding reliability. In this report, we present the mounting test on a BGA-P with 225 pins and a BGA-T with 426 pins. We hope that this information will contribute to spurring the adoption of the BGAs.\",\"PeriodicalId\":123707,\"journal\":{\"name\":\"Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'\",\"volume\":\"20 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1995-10-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEMT.1995.526197\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1995.526197","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 0

摘要

BGA不像其他包格式那样容易检查或修复。因此，其实际应用的可行性取决于其结合率和焊点缺陷水平是否优于QFP。为了促进BGAs的普及，迫切需要建立一种保证高键合可靠性的工艺。在本报告中，我们介绍了225引脚的BGA-P和426引脚的BGA-T的安装测试。我们希望这一信息将有助于推动通过bga。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Mounting technology of BGA-P and BGA-T

The BGA is not as easy to inspect or repair as other package formats. The feasibility of its practical application hinges, therefore, on the condition that its bonding rate and solder defect level is superior to that of the QFP. In order to promote the spread of BGAs, there is a pressing need to establish a process for ensuring high bonding reliability. In this report, we present the mounting test on a BGA-P with 225 pins and a BGA-T with 426 pins. We hope that this information will contribute to spurring the adoption of the BGAs.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'

自引率

0.00%

发文量