Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'最新文献_第5页

Technology/strategy management issues for semiconductor technology 半导体技术的技术/战略管理问题

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526210

L. Keys

{"title":"Technology/strategy management issues for semiconductor technology","authors":"L. Keys","doi":"10.1109/IEMT.1995.526210","DOIUrl":"https://doi.org/10.1109/IEMT.1995.526210","url":null,"abstract":"For more than forty years continuous improvements in semiconductor technology have driven major performance and value for money improvements into a broad range of industries. In particular both sold state memory and microprocessors have been major benefactors from design and process improvements and contributors to this widespread success and penetration of microelectronics into our lives. The resulting smaller device dimensions and larger semiconductor wafers have produced the performance benefits. The rate of device dimension reduction seems to be decreasing as we approach the 0.10 to 0.25 micron range, with capital investments approaching $1 billion dollars per facility for the 200 mm wafers increasingly coming into use. Some industry leaders forecast a $2 billion dollar next generation manufacturing facility cost as we approach the year 2000. These challenges threaten the continued expectation of device cost reduction and may herald the maturation (end) of the optical lithography technology based S-curve \"family\" progress, or change the size and/or scope of the wafer manufacturing facility need to achieve good economics. This summary paper highlights issues, trends, industry activities and needs.","PeriodicalId":123707,"journal":{"name":"Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125061449","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Managing for a future [electronics manufacturing] 管理未来[电子制造业]

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526087

M. Kelly

引用次数: 0

High-density build-up wiring boards using conventional printed wiring boards process 高密度组装线路板采用传统印刷线路板工艺

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526099

S. Itaya, H. Miyazawa, E. Morimoto, Y. Takahashi, Y. Uno, K. Nakakuki, Y. Igucki

引用次数: 1

Design for manufacturability and design for "X": concepts, applications, and perspectives 为可制造性设计和为“X”设计:概念、应用和观点

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526203

T.C. Kuo, Hongchao Zhang

引用次数: 18

Effective modeling of factory throughput times 工厂生产时间的有效建模

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526190

N. Srivarsan, K. Kempf

引用次数: 7

Applying DFM in the semiconductor industry DFM在半导体工业中的应用

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526201

K. Preston White, R. N. Athay, W. Trybula

引用次数: 9

Thermomechanical stress-strain hysteresis of Sn-Bi eutectic solder alloy Sn-Bi共晶钎料合金的热力学应力-应变滞后

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526124

C. Raeder, L. Felton, R. Messier, L. F. Coffin

引用次数: 16

Laser ablation forward deposition of metal lines for electrical interconnect repair 用于电气互连修复的金属线激光消融正向沉积

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526111

K. Tatah, A. Fukumoto, C. Thompson

引用次数: 3

The resin molded chip size package (MCSP) 树脂模制芯片尺寸封装(MCSP)

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526195

S. Tanigawa, K. Igarashi, M. Nagasawa, N. Yoshio

{"title":"The resin molded chip size package (MCSP)","authors":"S. Tanigawa, K. Igarashi, M. Nagasawa, N. Yoshio","doi":"10.1109/IEMT.1995.526195","DOIUrl":"https://doi.org/10.1109/IEMT.1995.526195","url":null,"abstract":"The resin molded chip size package (MCSP), consisting of a polyimide/Cu film carrier with metal bumps, has been developed. The CSP having area-array type electrodes connected with the printed circuit board has been developed by many semiconductor companies. We have developed a resin molded CSP. The encapsulant used for this application has also been developed; it is unlike the conventional liquid type or transfer mold type. The molding method is also new and has been indigenously developed. Two new molding methods were designed: 1) the resin-mold and the connection between the semiconductor-chip and the carrier tape with the metal bumps were simultaneously carried out using the newly developed thermo-adhesive polyimide coated on the carrier tape before the connection; 2) this approach involved laminating the sheet on the semiconductor-chip with the new polyimide adhesive. The encapsulation and the reliability of MCSP were investigated and found to be excellent (resistance to corrosion, heat and stress), equal or superior to that of the conventional surface-mounted devices.","PeriodicalId":123707,"journal":{"name":"Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132600917","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

Nitrogen reflow ovens: the effect exit temperature has on benzotriazole coated copper boards 氮气回流炉:出口温度对苯并三唑镀膜铜板的影响

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526183

S. Gutierrez, D. Saxton, R. Schluter, P. Thune

引用次数: 0