半导体技术的技术/战略管理问题

L. Keys
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引用次数: 2

摘要

四十多年来,半导体技术的不断改进推动了广泛行业的主要性能和物有所值的改进。特别是出售状态存储器和微处理器都是设计和工艺改进的主要捐助者,也是微电子技术广泛成功和渗透到我们生活中的贡献者。由此产生的更小的器件尺寸和更大的半导体晶圆产生了性能优势。当我们接近0.10到0.25微米的范围时,器件尺寸减小的速度似乎在下降,每个设施的资本投资接近10亿美元,用于越来越多地使用200毫米晶圆。一些行业领袖预测,随着我们接近2000年,下一代制造设备的成本将达到20亿美元。这些挑战威胁到器件成本降低的持续预期,并可能预示着基于s曲线“家族”进展的光学光刻技术的成熟(终结),或者改变晶圆制造设施的尺寸和/或范围,以实现良好的经济效益。这份摘要文件强调了问题、趋势、行业活动和需求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Technology/strategy management issues for semiconductor technology
For more than forty years continuous improvements in semiconductor technology have driven major performance and value for money improvements into a broad range of industries. In particular both sold state memory and microprocessors have been major benefactors from design and process improvements and contributors to this widespread success and penetration of microelectronics into our lives. The resulting smaller device dimensions and larger semiconductor wafers have produced the performance benefits. The rate of device dimension reduction seems to be decreasing as we approach the 0.10 to 0.25 micron range, with capital investments approaching $1 billion dollars per facility for the 200 mm wafers increasingly coming into use. Some industry leaders forecast a $2 billion dollar next generation manufacturing facility cost as we approach the year 2000. These challenges threaten the continued expectation of device cost reduction and may herald the maturation (end) of the optical lithography technology based S-curve "family" progress, or change the size and/or scope of the wafer manufacturing facility need to achieve good economics. This summary paper highlights issues, trends, industry activities and needs.
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