Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'最新文献_第6页

Fine pitch thermosonic wire bonding 细节距热声线键合

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526178

D. Cavasin

引用次数: 0

Fluxless flip-chip attachment techniques using the Au/Sn metallurgy 金/锡冶金无熔剂倒装片连接技术

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526085

C. Kallmayer, D. Lin, J. Kloeser, H. Oppermann, E. Zakel, H. Reichl

引用次数: 15

Process integration and optimization of GaAs MESFET and MSM based opto-electronics integrated circuit (OEIC) using statistical experimental design techniques 基于统计实验设计技术的GaAs MESFET和MSM光电集成电路(OEIC)的工艺集成与优化

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526205

J. Wang, C. Teng, J. Middleton, M. Feng

{"title":"Process integration and optimization of GaAs MESFET and MSM based opto-electronics integrated circuit (OEIC) using statistical experimental design techniques","authors":"J. Wang, C. Teng, J. Middleton, M. Feng","doi":"10.1109/IEMT.1995.526205","DOIUrl":"https://doi.org/10.1109/IEMT.1995.526205","url":null,"abstract":"Focuses on developing a manufacturable, robust, ion implanted 0.6 /spl mu/m GaAs metal-semiconductor field-effect transistor (MESFET) and metal-semiconductor-metal (MSM) based optoelectronic integrated circuit process. Our approach is to represent the OEIC process as the integration of key process modules. Each process module has well defined design parameters and statistically significant transfer characteristics. The statistically significant transfer characteristics of each process module were obtained through design of experiment (DOE) and response surface modeling (RSM), through the use of both experimental data and calibrated process simulators. These transfer characteristics are used to determine the process optimum, considering design for manufacturability (DFM). The mapping of random process variations onto device variations, are realized by these transfer characteristics and used for statistical circuit design for manufacturability. Therefore, the process yield can be enhanced at both the circuit design and the process design levels. The process capability (Cp) is assessed by these modules' transfer characteristics, as well; thus manufacturability can be incorporated into the early stage of process development. As a result, high yield OEIC transmitter and receiver chips with data transmission rates above 1 Gbit/sec have been achieved.","PeriodicalId":123707,"journal":{"name":"Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'","volume":"460 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125807752","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Design of future single wafer logic fabs 未来单晶圆逻辑晶圆厂的设计

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526127

Paul Castrucci

引用次数: 3

Advanced interconnect and low cost /spl mu/ stud BGA 先进的互连和低成本/单亩/螺柱BGA

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526199

M. Mita, G. Murakami, T. Kumakura, N. Okabe, S. Shinzawa

引用次数: 0

Lead free interconnect materials for the electronics industry 电子工业用无铅互连材料

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526121

D. Napp

{"title":"Lead free interconnect materials for the electronics industry","authors":"D. Napp","doi":"10.1109/IEMT.1995.526121","DOIUrl":"https://doi.org/10.1109/IEMT.1995.526121","url":null,"abstract":"Considerable development and research has been conducted over the last 25 years by many areas of manufacturing to reduce the use of lead and to limit human exposure to lead and products containing lead. Small levels of lead can damage the nervous system of children. Major sources of lead are ingested paint, 75%, and drinking water, 20%. The elimination of lead from all manufacturing products, whether through legislation or through tax incentives, will have a significant impact on the electronic interconnect technologies. In 1993 the National Center for Manufacturing Sciences (NCMS), a not-for-profit cooperative research consortium of more than 215 U.S. North American manufacturers, established multi-year programs. Lead Free Solder Project (LFSP) and Conductive Polymer Interconnect Project (CPIP) involving participants from industry, academia, and national laboratories. The objective of these programs is to identify lead free solder alternative replacement(s) and conductive polymeric materials for lead bearing solders in the electronics industry. The new materials must meet the interconnect performance requirements at operating environments ranging from-55 to +180 degrees centigrade. Numerous lead free alloy solders, each exhibiting unique properties, have been used by electronic manufacturers in specific applications. The major usage of conductive adhesives has been in consumer electronics and children's toys. Before any of these new lead free materials can be applied to the widely diverse electronics industry considerable research and development is required. The NCMS programs involve a study of the material properties, manufacturability, modeling and reliability predictions, economic impact, and toxicological properties.","PeriodicalId":123707,"journal":{"name":"Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131036146","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 28

Development of ultra-fine pitch ball bonding technology 超细间距球粘接技术的发展

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526177

K. Tatsumi, T. Uno, O. Kitamura, Y. Ohno, T. Katsumata, M. Furusawa

引用次数: 4

Run by run (generalized SPC) control of semiconductor processes on the production floor 对生产车间的半导体过程进行逐行(通用SPC)控制

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526093

J. D. Boyd, M. Banan

引用次数: 4

Solder bumping through Super Solder 焊料通过超级焊料碰撞

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526082

Y. Kaga, T. Amano, M. Kohno, Y. Obara

引用次数: 4

Electrical performance trade-offs in ball grid array package designs 球栅阵列封装设计中的电气性能权衡

Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future' Pub Date : 1995-10-02 DOI: 10.1109/IEMT.1995.526196

K.N. Wang, J. Adam, P.A. Dziekowicz

{"title":"Electrical performance trade-offs in ball grid array package designs","authors":"K.N. Wang, J. Adam, P.A. Dziekowicz","doi":"10.1109/IEMT.1995.526196","DOIUrl":"https://doi.org/10.1109/IEMT.1995.526196","url":null,"abstract":"Summary form only given, as follows. Many new types of ball grid array packages have been introduced or proposed in the last year as alternatives to PQFPs and PGAs. These include single and multilayer configurations for both plastic and metal BGAs based on a variety of material and process technologies. A commonly claimed advantage of all these BGAs is improved electrical performance. With continued increases in clock speed and reductions in noise margins due to voltage scaling, electrical performance will become a driving force for introduction of BGAs in many products. A detailed study of the electrical performance of a selected set of single and multilayer BGA packages was completed. The different package models were generated using a field solver and analyzed for their signal integrity characteristics using SPICE. This includes an analysis of how closely the output signals and the input signals match under varying load conditions. The design and performance of the selected BGA packages were then assessed based on initial simulation results, and a set of design guidelines to optimize electrical performance were developed. These design guidelines can then be applied based on product needs. This paper will address the electrical performance and relative complexity and cost factors facing the engineer and suggest optimal choices for the varying load conditions and chip types.","PeriodicalId":123707,"journal":{"name":"Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125137405","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1