{"title":"Run by run (generalized SPC) control of semiconductor processes on the production floor","authors":"J. D. Boyd, M. Banan","doi":"10.1109/IEMT.1995.526093","DOIUrl":null,"url":null,"abstract":"Multiple linear response surface methodology coupled with run by run (generalized SPC) control has been applied at Delco Electronics to a high volume production epitaxy deposition process. This resulted in nearly a 1.8/spl times/ improvement in process capability for thickness control. This was achieved by interfacing an IBM compatible 486 computer to Gemini II epi reactors, translating Sun workstation Matlab script code from the Massachusetts Institute of Technology into PC compatible Matlab script code, and combining this with the InTouch man machine interface (MMI) software package from Wonderware, Inc. This paper is a case study of our experience at implementing this on the production floor. We discuss the general nature of the process to show why this methodology is relatively easy to apply. Operator training was simplified, data acquisition capability was added, new enhanced modes of operation were implemented, and enhanced capability for more advanced processes is possible on equipment that did not originally provide these features.","PeriodicalId":123707,"journal":{"name":"Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1995-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Seventeenth IEEE/CPMT International Electronics Manufacturing Technology Symposium. 'Manufacturing Technologies - Present and Future'","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEMT.1995.526093","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
Multiple linear response surface methodology coupled with run by run (generalized SPC) control has been applied at Delco Electronics to a high volume production epitaxy deposition process. This resulted in nearly a 1.8/spl times/ improvement in process capability for thickness control. This was achieved by interfacing an IBM compatible 486 computer to Gemini II epi reactors, translating Sun workstation Matlab script code from the Massachusetts Institute of Technology into PC compatible Matlab script code, and combining this with the InTouch man machine interface (MMI) software package from Wonderware, Inc. This paper is a case study of our experience at implementing this on the production floor. We discuss the general nature of the process to show why this methodology is relatively easy to apply. Operator training was simplified, data acquisition capability was added, new enhanced modes of operation were implemented, and enhanced capability for more advanced processes is possible on equipment that did not originally provide these features.
Delco Electronics已将多重线性响应面方法与逐行(广义SPC)控制相结合,应用于大批量生产的外延沉积工艺。这使得厚度控制的工艺能力提高了近1.8倍。这是通过将IBM兼容的486计算机连接到Gemini II epi反应器,将麻省理工学院的Sun工作站Matlab脚本代码转换为PC兼容的Matlab脚本代码,并将其与Wonderware公司的InTouch人机界面(MMI)软件包相结合来实现的。本文是我们在生产车间实现这一目标的经验案例研究。我们将讨论该过程的一般性质,以说明为什么这种方法相对容易应用。简化了操作员培训,增加了数据采集能力,实施了新的增强操作模式,并且在最初不提供这些功能的设备上增强了更先进工艺的能力。