Fine pitch thermosonic wire bonding

Abstract

Characterization in a manufacturing environment, under normal operating conditions using standardized material, provides further information on machine performance, capillary suitability, and potential problems to be anticipated and prepared for during manufacturing implementation. The current work has focused on establishing process capability for bonding both 85 /spl mu/m (3.4 mil) and 73 /spl mu/m (2.9 mil) minimum pad dimensions on 107 /spl mu/m (4.2 mil) and 92 /spl mu/m (3.6 mil) centers, respectively. Two state-of-the-art fully automatic thermosonic gold wire bonders, from two different equipment manufacturers, were used.