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Thermal optimization of dual-sided embedded liquid cooling for high-power-density 3D HPC architectures 高功率密度3D高性能计算架构双面嵌入式液冷的热优化
IF 1.9 3区 工程技术
Microelectronics Journal Pub Date : 2025-05-03 DOI: 10.1016/j.mejo.2025.106714
Yunting Liu , Rong Fu , Meiying Su , Jun Li , Chuan Chen , Fengman Liu
{"title":"Thermal optimization of dual-sided embedded liquid cooling for high-power-density 3D HPC architectures","authors":"Yunting Liu ,&nbsp;Rong Fu ,&nbsp;Meiying Su ,&nbsp;Jun Li ,&nbsp;Chuan Chen ,&nbsp;Fengman Liu","doi":"10.1016/j.mejo.2025.106714","DOIUrl":"10.1016/j.mejo.2025.106714","url":null,"abstract":"<div><div>This study presents a thermal resistance analysis framework for 3D High-Performance Computing (HPC) architectures, evaluating memory-on-logic (MOL) and logic-on-memory (LOM) configurations with varying power delivery networks and cooling strategies. We develop an analytical model to identify temperature control limits under extreme heat flux and propose optimized cooling solutions. A novel TSV-compatible embedded microchannel fabrication process achieves a 34.21 % TSV-available silicon area ratio. Thermal simulations show that dual-sided cooling (DSC) reduces temperature rise by 72.2 % under 100 W power, with less than 10K deviation from experimental results. The optimized design maintains 41.3 kPa inlet pressure at 4.2 L/h flow rate, offering effective thermal management for high-power-density 3D HPC systems.</div></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":"161 ","pages":"Article 106714"},"PeriodicalIF":1.9,"publicationDate":"2025-05-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143911847","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Inductance-assisted high bandwidth avalanche photodiode based on hybrid genetic algorithm 基于混合遗传算法的电感辅助高带宽雪崩光电二极管
IF 1.9 3区 工程技术
Microelectronics Journal Pub Date : 2025-05-03 DOI: 10.1016/j.mejo.2025.106715
Tonghui Li, Xiaole Gong, Xiaofeng Duan, Kai Liu, Yongqing Huang
{"title":"Inductance-assisted high bandwidth avalanche photodiode based on hybrid genetic algorithm","authors":"Tonghui Li,&nbsp;Xiaole Gong,&nbsp;Xiaofeng Duan,&nbsp;Kai Liu,&nbsp;Yongqing Huang","doi":"10.1016/j.mejo.2025.106715","DOIUrl":"10.1016/j.mejo.2025.106715","url":null,"abstract":"<div><div>This paper proposes and fabricates an inductance-assisted high bandwidth avalanche photodiode (APD) based on hybrid genetic algorithm (HGA) optimization design. The APDs and meandering electrodes were accurately modeled and optimized using equivalent circuit models and HGA. The measured results of the fabricated 26 μm and 42 μm APDs demonstrate bandwidth enhancement at each gain with the help of the HGA-based meandering electrodes. The gain-bandwidth products of the two types of APDs are 306 GHz and 119 GHz, respectively. With a gain of 2.15, the bandwidths of the 26 μm and 42 μm APDs increased from 10.3 GHz to 5.5 GHz–19.5 GHz and 10.1 GHz, respectively, representing a bandwidth extension of over 90 %. The measurement results closely match the algorithm optimization results, validating the reliability of the design method. Compared to three other optimization algorithms, HGA exhibits ultra-fast convergence speed and superior optimization results. This paper provides a novel and reliable method for designing high-performance APDs, offering valuable insights for enhancing the bandwidth of optoelectronic devices.</div></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":"161 ","pages":"Article 106715"},"PeriodicalIF":1.9,"publicationDate":"2025-05-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143907752","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Behavioral modeling of power amplifiers using the boundary-equidistant sampling strategy 基于边界等距采样策略的功率放大器行为建模
IF 1.9 3区 工程技术
Microelectronics Journal Pub Date : 2025-04-30 DOI: 10.1016/j.mejo.2025.106713
Yanghui Hu , Silu Yan , Hongliang Lu , Lin Cheng , Dongyu Zhang , Ranran Zhao , Yuming Zhang
{"title":"Behavioral modeling of power amplifiers using the boundary-equidistant sampling strategy","authors":"Yanghui Hu ,&nbsp;Silu Yan ,&nbsp;Hongliang Lu ,&nbsp;Lin Cheng ,&nbsp;Dongyu Zhang ,&nbsp;Ranran Zhao ,&nbsp;Yuming Zhang","doi":"10.1016/j.mejo.2025.106713","DOIUrl":"10.1016/j.mejo.2025.106713","url":null,"abstract":"<div><div>A genetic algorithm (GA) optimized back propagation (BP) neural network based power amplifier (PA) modeling method is proposed, which employs the boundary-equidistant sampling method for dividing the training data and validation data in the case of multidimensional data. The differences in modeling accuracy before and after optimization of the BP neural network are compared, and the differences in modeling accuracy under different sampling strategies are compared. The results show that the BP neural network optimized based on GA has higher modeling accuracy. The borderless sampling method proposed in this paper not only ensures the uniformity of the sampled data, but also covers the critical data at the border.</div></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":"161 ","pages":"Article 106713"},"PeriodicalIF":1.9,"publicationDate":"2025-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143907753","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A low-power 18-bit sigma-delta digital-to-analog converter with low-temperature-drift reference 具有低温漂移基准的低功耗18位σ - δ数模转换器
IF 1.9 3区 工程技术
Microelectronics Journal Pub Date : 2025-04-30 DOI: 10.1016/j.mejo.2025.106716
Xingyuan Tong , Hao Yu , Xin Xin , Yuhua Liang
{"title":"A low-power 18-bit sigma-delta digital-to-analog converter with low-temperature-drift reference","authors":"Xingyuan Tong ,&nbsp;Hao Yu ,&nbsp;Xin Xin ,&nbsp;Yuhua Liang","doi":"10.1016/j.mejo.2025.106716","DOIUrl":"10.1016/j.mejo.2025.106716","url":null,"abstract":"<div><div>An 18-bit Σ-Δ digital-to-analog converter (DAC) with precision-trimmed bandgap reference is proposed for industrial transmitters. A bandgap reference with an 8-bit trimming DAC and a high-order compensation circuit for reducing the temperature coefficient (TC) affected by process and voltage variation was utilized, which effectively guarantees the robustness of the Σ-Δ DAC. Compared with the conventional Σ-Δ DAC, the proposed DAC replaces the on-chip digital interpolation filter (IF) by providing oversampled input digital codes, and a low-pass configurable off-chip passive RC filter is utilized for power reduction. A quantization noise randomization scheme was employed by adding pseudo-random sequences in the Σ-Δ modulator, achieving 27.22 dB improvement in signal-to-noise and distortion ratio (SNDR) with 0.045 mW increase in power consumption. The proposed Σ-Δ DAC is designed with 180 nm CMOS technology with a supply voltage of 3.3 V. Benefiting from the optimization of the filtering mode and the precision trimming technique of the bandgap reference, an SNDR of 108.01 dB was achieved with a power consumption of 0.257 mW. In the temperature range of -40–105 °C, the temperature coefficient of the DAC output was less than 25.83 ppm/°C, under different process conditions.</div></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":"161 ","pages":"Article 106716"},"PeriodicalIF":1.9,"publicationDate":"2025-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143894515","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Proposal of a multi-bit cell scheme for spin-orbit torque MRAM array to implement 16 Boolean logic operations 提出了一种实现16个布尔逻辑运算的自旋轨道转矩MRAM阵列多比特单元方案
IF 1.9 3区 工程技术
Microelectronics Journal Pub Date : 2025-04-28 DOI: 10.1016/j.mejo.2025.106711
Jie Liu , Pingfan Ning , Delin Zhang , Pingjuan Niu , Yong Jiang
{"title":"Proposal of a multi-bit cell scheme for spin-orbit torque MRAM array to implement 16 Boolean logic operations","authors":"Jie Liu ,&nbsp;Pingfan Ning ,&nbsp;Delin Zhang ,&nbsp;Pingjuan Niu ,&nbsp;Yong Jiang","doi":"10.1016/j.mejo.2025.106711","DOIUrl":"10.1016/j.mejo.2025.106711","url":null,"abstract":"<div><div>Magnetic random access memory (MRAM) is a promising applicant for universal memory in the post-Moore age, due to its beneficial characteristics in terms of energy efficiency, integration, and endurance. Spin-orbit torque (SOT) MRAM for logic-in-memory (LIM) is a highly anticipated method for processing-in-memory (PIM) to address the von Neumann bottleneck. We present a flexible SOT-MRAM array cell scheme capable of storing multiple bits and executing 16 complete Boolean logic operations. Two magnetic tunnel junctions (MTJs) utilizing SOT and voltage-controlled magnetic anisotropy (VCMA) effects, combined with three transistors, form a 3T2M cell capable of four resistance states (2-bit) for data storage, necessitating a minimum average power consumption of 2.483 fJ/bit for writing. The two operational steps of all-electrical modulation, comprising the write and logic operations, are adequate to execute the 16 Boolean logics in situ. These findings may provide a basis for the development of adaptable and programmable LIM techniques for reconfigurable digital PIM architectures.</div></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":"161 ","pages":"Article 106711"},"PeriodicalIF":1.9,"publicationDate":"2025-04-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143891633","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A new quasi-3D analytical framework for channel potential and threshold voltage in triple material gate nanosheet MOSFETs 三材料栅极纳米片mosfet通道电位和阈值电压的准三维分析框架
IF 1.9 3区 工程技术
Microelectronics Journal Pub Date : 2025-04-28 DOI: 10.1016/j.mejo.2025.106710
E. Rajalakshmi , N.B. Balamurugan , M. Suguna , D. Sriram Kumar
{"title":"A new quasi-3D analytical framework for channel potential and threshold voltage in triple material gate nanosheet MOSFETs","authors":"E. Rajalakshmi ,&nbsp;N.B. Balamurugan ,&nbsp;M. Suguna ,&nbsp;D. Sriram Kumar","doi":"10.1016/j.mejo.2025.106710","DOIUrl":"10.1016/j.mejo.2025.106710","url":null,"abstract":"<div><div>Nanosheet MOSFETs is an excellent replacement for FinFETs for sub-5 nm technology nodes because of their outstanding electrostatic control provided by their gate-all-around structure. A novel Triple Material Gate nanosheet MOSFETs is presented in this work. For the first time, an analytical model for the threshold voltage and channel potential is derived using a quasi-3D approach. Through consideration of both vertical and a lateral potential fluctuation, the proposed model effectively depicts electrostatic behavior. Ballistic transport theory is utilized to assess subthreshold swing and threshold voltage characteristics, improving the accuracy of predictions. The results demonstrate an 11.3 % drop in subthreshold swing and a 10 % reduction in threshold voltage, assuring improved device performance. The proposed TMG-NS-MOSFETs achieve a high current ON and OFF ratio of 2.4 × 10<sup>6</sup> at 20 nm gate length, ensuring excellent switching performance. A significant correlation is confirmed via validation against TCAD simulations, proving the model's dependability. This novel analytical approach advances the modeling of semiconductor devices by offering better insights into nanosheet MOSFETs electrostatics. Based on the results, new nanosheet MOSFETs designs can be incorporated into ultra-low power, high performance microelectronic circuits of the future.</div></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":"161 ","pages":"Article 106710"},"PeriodicalIF":1.9,"publicationDate":"2025-04-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143887647","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A PVT-insensitive 7T SRAM CIM macro for multibit multiplication with dynamic matching quantization circuits 一个pvt不敏感的7T SRAM CIM宏,用于动态匹配量化电路的多位乘法
IF 1.9 3区 工程技术
Microelectronics Journal Pub Date : 2025-04-26 DOI: 10.1016/j.mejo.2025.106703
Chenghu Dai , Jianhao Zhang , Ruixuan Wang , Junbo Chen , Wei Hu , Licai Hao , Wenjuan Lu , Zhiting Lin , Chunyu Peng , Xiulong Wu
{"title":"A PVT-insensitive 7T SRAM CIM macro for multibit multiplication with dynamic matching quantization circuits","authors":"Chenghu Dai ,&nbsp;Jianhao Zhang ,&nbsp;Ruixuan Wang ,&nbsp;Junbo Chen ,&nbsp;Wei Hu ,&nbsp;Licai Hao ,&nbsp;Wenjuan Lu ,&nbsp;Zhiting Lin ,&nbsp;Chunyu Peng ,&nbsp;Xiulong Wu","doi":"10.1016/j.mejo.2025.106703","DOIUrl":"10.1016/j.mejo.2025.106703","url":null,"abstract":"<div><div>Compute-in-memory (CIM) promises to solve the huge energy consumption and bandwidth limitation of multiply-and-accumulate (MAC) operation in von-Neumann architecture. However, there are still challenges for SRAM-based CIM: (i) traditional 6T SRAM has the problem of destroying internal node data when multiple rows are opened at the same time; (ii) the analog CIM faces nonlinearity and inconsistency issues; (iii) the separated ADC circuit and extra circuit take area overhead and large power consumption. In this paper, we propose 7T SRAMs (7TR and 7TL) with decoupled read and write paths. A 128 × 128 7T SRAM macro offers massively parallel with embedded SRAM array to realized analog voltage to digital output. The grouped calculation row and reference row help to reduce PVT influence, and reduce weight update frequency. The measured energy efficiency of 4bit × 4bit MAC is 36.24–71.82 TOPS/W using 0.7–0.9 V core supply.</div></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":"161 ","pages":"Article 106703"},"PeriodicalIF":1.9,"publicationDate":"2025-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143882074","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A RISC-V based SoC for blockchain data integration in IoT edge devices 基于RISC-V的SoC,用于物联网边缘设备中的区块链数据集成
IF 1.9 3区 工程技术
Microelectronics Journal Pub Date : 2025-04-24 DOI: 10.1016/j.mejo.2025.106697
Wentao Xu , Xiang Li , Qiuyan Xu , Yuxuan Zhang , Xiang Wu , Weilin Li , Ruize Wang , Gang Liang , Hao Guo
{"title":"A RISC-V based SoC for blockchain data integration in IoT edge devices","authors":"Wentao Xu ,&nbsp;Xiang Li ,&nbsp;Qiuyan Xu ,&nbsp;Yuxuan Zhang ,&nbsp;Xiang Wu ,&nbsp;Weilin Li ,&nbsp;Ruize Wang ,&nbsp;Gang Liang ,&nbsp;Hao Guo","doi":"10.1016/j.mejo.2025.106697","DOIUrl":"10.1016/j.mejo.2025.106697","url":null,"abstract":"<div><div>The widespread growth of the Internet of Things (IoT) has significantly increased the need for robust data interaction mechanisms, making data security a critical challenge. Blockchain technology, characterized by its decentralized architecture, presents an innovative solution for managing data within IoT ecosystems. A collaborative cloud-edge framework emerges as a dependable option for deploying IoT blockchains; however, energy-efficient hardware support on the edge remains insufficient. To resolve this issue, this study introduces a low-power System on Chip (SoC) integrated with a specialized secure coprocessor to handle data on-chain processes. To mitigate physical-level security risks, the SoC incorporates a trusted computing architecture based on dual RISC-V cores. Experimental results using an FPGA platform reveal that the proposed SoC achieves a 12.1-fold performance enhancement for complete data on-chain processing tasks compared to the high-performance Intel i9-13950HX CPU, with total power consumption limited to just 0.579 W.</div></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":"161 ","pages":"Article 106697"},"PeriodicalIF":1.9,"publicationDate":"2025-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143887648","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A process compatible SiC trench MOSFET integrated with double p+-polySi/SiC HJD for enhanced switching performance 一种工艺兼容的SiC沟槽MOSFET集成了双p+-多晶硅/SiC HJD,以增强开关性能
IF 1.9 3区 工程技术
Microelectronics Journal Pub Date : 2025-04-24 DOI: 10.1016/j.mejo.2025.106702
Bangmin Zhu, Jianbin Guo, Yuxing Yang, Yanghao Wang, Qingqing Sun, David Wei Zhang, Hang Xu
{"title":"A process compatible SiC trench MOSFET integrated with double p+-polySi/SiC HJD for enhanced switching performance","authors":"Bangmin Zhu,&nbsp;Jianbin Guo,&nbsp;Yuxing Yang,&nbsp;Yanghao Wang,&nbsp;Qingqing Sun,&nbsp;David Wei Zhang,&nbsp;Hang Xu","doi":"10.1016/j.mejo.2025.106702","DOIUrl":"10.1016/j.mejo.2025.106702","url":null,"abstract":"<div><div>In this article, a double polysilicon/SiC heterojunction diode (HJD) integrated SiC trench MOSFET (DHJD-TMOS) featuring an ohmic contact mesa is firstly proposed and investigated. The proposed device enables reverse current flow when the applied reverse voltage is lower than the turn-on voltage of the polysilicon/SiC HJD, achieved through precise control of the electron barrier height by optimizing the ohmic mesa width. The device architecture incorporates two key shielding features: a deep p + shield layer beneath the gate oxide and p + rings under the HJD source trenches, which collectively provide dual protection for the HJD region against high electric fields during blocking state, effectively suppressing leakage current. Comprehensive simulation results demonstrate significant performance improvements of the proposed DHJD-TMOS, including a 32 % reduction in reverse cut-in voltage and a 62 % decrease in total switching loss compared to conventional JBS-integrated MOSFETs. The high frequency figure of merits (HF-FOM) achieves an outstanding value of 64.07 mΩ⋅pF. These demonstrated device performances, as well as the good fabrication compatibility and process tolerance, making our proposed device highly attractive in future high frequency and high voltage applications.</div></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":"161 ","pages":"Article 106702"},"PeriodicalIF":1.9,"publicationDate":"2025-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143878964","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A PN-complementary current-enhancement structure LDO with fast transient response and frequency compensation capability 一种具有快速瞬态响应和频率补偿能力的pn互补电流增强结构LDO
IF 1.9 3区 工程技术
Microelectronics Journal Pub Date : 2025-04-23 DOI: 10.1016/j.mejo.2025.106701
Sujuan Liu, Aoran Ge, Xudong Sun, Junchao Zhao, Kun Liu, Peiyuan Wan
{"title":"A PN-complementary current-enhancement structure LDO with fast transient response and frequency compensation capability","authors":"Sujuan Liu,&nbsp;Aoran Ge,&nbsp;Xudong Sun,&nbsp;Junchao Zhao,&nbsp;Kun Liu,&nbsp;Peiyuan Wan","doi":"10.1016/j.mejo.2025.106701","DOIUrl":"10.1016/j.mejo.2025.106701","url":null,"abstract":"<div><div>This paper presents a novel PN-complementary current-enhancement structure (PN-CCES) designed for capacitor-less low-dropout regulators LDOs. The proposed design adopts a PN complementary cascode structure and two AC coupling networks to reduce the gate impedance of the power transistor, thereby increasing the gate charging and discharging current. Additionally, the combination of the PN complementary cascode structure and multistage Miller compensation effectively separates the two non-dominant poles away from the dominant poles, mitigating the conjugation effect and ensuring loop stability. The circuit has been implemented in a 0.18 μm BCD CMOS process, occupying an active chip area of 0.087 mm<sup>2</sup>. Simulation results demonstrate that the LDO achieves a quiescent current consumption of approximately 37.5 μA and a maximum current efficiency of 99.963 %. Under a load capacitance of 100 pF and a load current variation of 100 mA/100 ns, the recovery time is 175 ns.</div></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":"161 ","pages":"Article 106701"},"PeriodicalIF":1.9,"publicationDate":"2025-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143894514","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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