Tonghui Li, Xiaole Gong, Xiaofeng Duan, Kai Liu, Yongqing Huang
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引用次数: 0
Abstract
This paper proposes and fabricates an inductance-assisted high bandwidth avalanche photodiode (APD) based on hybrid genetic algorithm (HGA) optimization design. The APDs and meandering electrodes were accurately modeled and optimized using equivalent circuit models and HGA. The measured results of the fabricated 26 μm and 42 μm APDs demonstrate bandwidth enhancement at each gain with the help of the HGA-based meandering electrodes. The gain-bandwidth products of the two types of APDs are 306 GHz and 119 GHz, respectively. With a gain of 2.15, the bandwidths of the 26 μm and 42 μm APDs increased from 10.3 GHz to 5.5 GHz–19.5 GHz and 10.1 GHz, respectively, representing a bandwidth extension of over 90 %. The measurement results closely match the algorithm optimization results, validating the reliability of the design method. Compared to three other optimization algorithms, HGA exhibits ultra-fast convergence speed and superior optimization results. This paper provides a novel and reliable method for designing high-performance APDs, offering valuable insights for enhancing the bandwidth of optoelectronic devices.
期刊介绍:
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.
Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.