{"title":"Call for Nominations for Editor-in-Chief: IEEE Electron Device Letters","authors":"","doi":"10.1109/TSM.2025.3560206","DOIUrl":"https://doi.org/10.1109/TSM.2025.3560206","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"38 2","pages":"364-364"},"PeriodicalIF":2.3,"publicationDate":"2025-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10981910","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143896464","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Journal of Lightwave Technology Special Issue on: OFS-29","authors":"","doi":"10.1109/TSM.2025.3546539","DOIUrl":"https://doi.org/10.1109/TSM.2025.3546539","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"38 2","pages":"363-363"},"PeriodicalIF":2.3,"publicationDate":"2025-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10981904","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143896220","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Call for Papers for a Special Issue of IEEE Transactions on Materials for Electron Devices: Exploration of the Exciting world of Multifunctional Oxide-Based Electronic Devices: From Material to System-Level Applications","authors":"","doi":"10.1109/TSM.2025.3546537","DOIUrl":"https://doi.org/10.1109/TSM.2025.3546537","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"38 2","pages":"361-362"},"PeriodicalIF":2.3,"publicationDate":"2025-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10981906","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143896212","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on Ultrawide Band Gap Semiconductor Devices for RF, Power and Optoelectronic Applications","authors":"","doi":"10.1109/TSM.2025.3562408","DOIUrl":"https://doi.org/10.1109/TSM.2025.3562408","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"38 2","pages":"366-367"},"PeriodicalIF":2.3,"publicationDate":"2025-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10981903","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143896362","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"IEEE Transactions on Semiconductor Manufacturing Information for Authors","authors":"","doi":"10.1109/TSM.2025.3546541","DOIUrl":"https://doi.org/10.1109/TSM.2025.3546541","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"38 2","pages":"C3-C3"},"PeriodicalIF":2.3,"publicationDate":"2025-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10981905","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143896217","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Call for Nominations for Editor-in-Chief: IEEE Transactions on Electron Devices","authors":"","doi":"10.1109/TSM.2025.3560207","DOIUrl":"https://doi.org/10.1109/TSM.2025.3560207","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"38 2","pages":"365-365"},"PeriodicalIF":2.3,"publicationDate":"2025-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10981911","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143896219","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on Wide Band Gap Semiconductors for Automotive Applications","authors":"","doi":"10.1109/TSM.2025.3546535","DOIUrl":"https://doi.org/10.1109/TSM.2025.3546535","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"38 2","pages":"359-360"},"PeriodicalIF":2.3,"publicationDate":"2025-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10981902","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143896354","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Bill Nehrer;Duane Boning;Jeanne Paulette Bickford;Tomasz Brozek;Angelo Pinto;Soichi Inoue;David Z. Pan
{"title":"Guest Editorial Introduction to the Joint Special Issue on Semiconductor Design for Manufacturing (DFM)","authors":"Bill Nehrer;Duane Boning;Jeanne Paulette Bickford;Tomasz Brozek;Angelo Pinto;Soichi Inoue;David Z. Pan","doi":"10.1109/TSM.2025.3559200","DOIUrl":"https://doi.org/10.1109/TSM.2025.3559200","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"38 2","pages":"113-116"},"PeriodicalIF":2.3,"publicationDate":"2025-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10981975","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143896357","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Yibo Qiao;Yanning Chen;Fang Liu;Zhouzhouzhou Mei;Yuening Luo;Yining Chen;Yiyi Liao;Bo Wu;Yongfeng Deng
{"title":"RA-UNet: A New Deep Learning Segmentation Method for Semiconductor Wafer Defect Analysis on Fine-Grained Scanning Electron Microscope (SEM) Images","authors":"Yibo Qiao;Yanning Chen;Fang Liu;Zhouzhouzhou Mei;Yuening Luo;Yining Chen;Yiyi Liao;Bo Wu;Yongfeng Deng","doi":"10.1109/TSM.2025.3546296","DOIUrl":"https://doi.org/10.1109/TSM.2025.3546296","url":null,"abstract":"In the rapidly evolving field of semiconductor manufacturing, the escalating complexity of integrated circuits poses significant challenges in identifying and analyzing defects, crucial for maintaining high wafer yield. Traditional approaches are hindered by the intricate nature of defect morphology and the scarcity of high-quality scanning electron microscope (SEM) data, essential for effective algorithm training. In this study, we propose RA-UNet for fine-grained SEM defect segmentation. RA-UNet adopts a U-shaped architecture that leverages residual networks for defect feature extraction, and introduces a residual architecture and a novel attention module to enhance the network’s focus on defects. To validate the effectiveness of the proposed model, we meticulously gathered and labeled a real SEM data set from a semiconductor manufacturing factory. The results demonstrate that RA-UNet outperforms existing methods in semiconductor defect segmentation, achieving an Intersection over Union (IoU) score of 71.92%. These findings highlight its potential as an effective tool for semiconductor defect analysis.","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"38 2","pages":"185-193"},"PeriodicalIF":2.3,"publicationDate":"2025-02-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143896412","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Call for Nominations for Editor-in-Chief: IEEE Transactions on Semiconductor Manufacturing","authors":"","doi":"10.1109/TSM.2025.3540179","DOIUrl":"https://doi.org/10.1109/TSM.2025.3540179","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"38 1","pages":"111-111"},"PeriodicalIF":2.3,"publicationDate":"2025-02-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10903517","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143489055","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}