IEEE Transactions on Semiconductor Manufacturing最新文献

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Call for Nominations for Editor-in-Chief: IEEE Electron Device Letters 呼吁提名主编:IEEE电子器件快报
IF 2.3 3区 工程技术
IEEE Transactions on Semiconductor Manufacturing Pub Date : 2025-03-01 DOI: 10.1109/TSM.2025.3560206
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引用次数: 0
Journal of Lightwave Technology Special Issue on: OFS-29 光波技术杂志特刊:OFS-29
IF 2.3 3区 工程技术
IEEE Transactions on Semiconductor Manufacturing Pub Date : 2025-03-01 DOI: 10.1109/TSM.2025.3546539
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引用次数: 0
Call for Papers for a Special Issue of IEEE Transactions on Materials for Electron Devices: Exploration of the Exciting world of Multifunctional Oxide-Based Electronic Devices: From Material to System-Level Applications IEEE电子器件材料特刊征文:探索多功能氧化物基电子器件的激动人心的世界:从材料到系统级应用
IF 2.3 3区 工程技术
IEEE Transactions on Semiconductor Manufacturing Pub Date : 2025-03-01 DOI: 10.1109/TSM.2025.3546537
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引用次数: 0
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on Ultrawide Band Gap Semiconductor Devices for RF, Power and Optoelectronic Applications 《IEEE电子器件学报》特刊关于射频、功率和光电子应用的超宽带隙半导体器件的论文征集
IF 2.3 3区 工程技术
IEEE Transactions on Semiconductor Manufacturing Pub Date : 2025-03-01 DOI: 10.1109/TSM.2025.3562408
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引用次数: 0
IEEE Transactions on Semiconductor Manufacturing Information for Authors IEEE半导体制造信息汇刊
IF 2.3 3区 工程技术
IEEE Transactions on Semiconductor Manufacturing Pub Date : 2025-03-01 DOI: 10.1109/TSM.2025.3546541
{"title":"IEEE Transactions on Semiconductor Manufacturing Information for Authors","authors":"","doi":"10.1109/TSM.2025.3546541","DOIUrl":"https://doi.org/10.1109/TSM.2025.3546541","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"38 2","pages":"C3-C3"},"PeriodicalIF":2.3,"publicationDate":"2025-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10981905","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143896217","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Call for Nominations for Editor-in-Chief: IEEE Transactions on Electron Devices 《IEEE电子设备汇刊》主编提名公告
IF 2.3 3区 工程技术
IEEE Transactions on Semiconductor Manufacturing Pub Date : 2025-03-01 DOI: 10.1109/TSM.2025.3560207
{"title":"Call for Nominations for Editor-in-Chief: IEEE Transactions on Electron Devices","authors":"","doi":"10.1109/TSM.2025.3560207","DOIUrl":"https://doi.org/10.1109/TSM.2025.3560207","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"38 2","pages":"365-365"},"PeriodicalIF":2.3,"publicationDate":"2025-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10981911","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143896219","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on Wide Band Gap Semiconductors for Automotive Applications 《汽车用宽带隙半导体电子器件》特刊征文
IF 2.3 3区 工程技术
IEEE Transactions on Semiconductor Manufacturing Pub Date : 2025-03-01 DOI: 10.1109/TSM.2025.3546535
{"title":"Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on Wide Band Gap Semiconductors for Automotive Applications","authors":"","doi":"10.1109/TSM.2025.3546535","DOIUrl":"https://doi.org/10.1109/TSM.2025.3546535","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"38 2","pages":"359-360"},"PeriodicalIF":2.3,"publicationDate":"2025-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10981902","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143896354","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Guest Editorial Introduction to the Joint Special Issue on Semiconductor Design for Manufacturing (DFM) 《半导体制造设计》(DFM)联合特刊客座编辑简介
IF 2.3 3区 工程技术
IEEE Transactions on Semiconductor Manufacturing Pub Date : 2025-03-01 DOI: 10.1109/TSM.2025.3559200
Bill Nehrer;Duane Boning;Jeanne Paulette Bickford;Tomasz Brozek;Angelo Pinto;Soichi Inoue;David Z. Pan
{"title":"Guest Editorial Introduction to the Joint Special Issue on Semiconductor Design for Manufacturing (DFM)","authors":"Bill Nehrer;Duane Boning;Jeanne Paulette Bickford;Tomasz Brozek;Angelo Pinto;Soichi Inoue;David Z. Pan","doi":"10.1109/TSM.2025.3559200","DOIUrl":"https://doi.org/10.1109/TSM.2025.3559200","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"38 2","pages":"113-116"},"PeriodicalIF":2.3,"publicationDate":"2025-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10981975","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143896357","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
RA-UNet: A New Deep Learning Segmentation Method for Semiconductor Wafer Defect Analysis on Fine-Grained Scanning Electron Microscope (SEM) Images RA-UNet:一种新的深度学习分割方法,用于细粒度扫描电镜(SEM)图像的半导体晶圆缺陷分析
IF 2.3 3区 工程技术
IEEE Transactions on Semiconductor Manufacturing Pub Date : 2025-02-27 DOI: 10.1109/TSM.2025.3546296
Yibo Qiao;Yanning Chen;Fang Liu;Zhouzhouzhou Mei;Yuening Luo;Yining Chen;Yiyi Liao;Bo Wu;Yongfeng Deng
{"title":"RA-UNet: A New Deep Learning Segmentation Method for Semiconductor Wafer Defect Analysis on Fine-Grained Scanning Electron Microscope (SEM) Images","authors":"Yibo Qiao;Yanning Chen;Fang Liu;Zhouzhouzhou Mei;Yuening Luo;Yining Chen;Yiyi Liao;Bo Wu;Yongfeng Deng","doi":"10.1109/TSM.2025.3546296","DOIUrl":"https://doi.org/10.1109/TSM.2025.3546296","url":null,"abstract":"In the rapidly evolving field of semiconductor manufacturing, the escalating complexity of integrated circuits poses significant challenges in identifying and analyzing defects, crucial for maintaining high wafer yield. Traditional approaches are hindered by the intricate nature of defect morphology and the scarcity of high-quality scanning electron microscope (SEM) data, essential for effective algorithm training. In this study, we propose RA-UNet for fine-grained SEM defect segmentation. RA-UNet adopts a U-shaped architecture that leverages residual networks for defect feature extraction, and introduces a residual architecture and a novel attention module to enhance the network’s focus on defects. To validate the effectiveness of the proposed model, we meticulously gathered and labeled a real SEM data set from a semiconductor manufacturing factory. The results demonstrate that RA-UNet outperforms existing methods in semiconductor defect segmentation, achieving an Intersection over Union (IoU) score of 71.92%. These findings highlight its potential as an effective tool for semiconductor defect analysis.","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"38 2","pages":"185-193"},"PeriodicalIF":2.3,"publicationDate":"2025-02-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143896412","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Call for Nominations for Editor-in-Chief: IEEE Transactions on Semiconductor Manufacturing 呼吁提名主编:IEEE半导体制造汇刊
IF 2.3 3区 工程技术
IEEE Transactions on Semiconductor Manufacturing Pub Date : 2025-02-25 DOI: 10.1109/TSM.2025.3540179
{"title":"Call for Nominations for Editor-in-Chief: IEEE Transactions on Semiconductor Manufacturing","authors":"","doi":"10.1109/TSM.2025.3540179","DOIUrl":"https://doi.org/10.1109/TSM.2025.3540179","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"38 1","pages":"111-111"},"PeriodicalIF":2.3,"publicationDate":"2025-02-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10903517","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143489055","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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