IEEE Transactions on Semiconductor Manufacturing最新文献_第2页

Call for Nominations for Editor-in-Chief: IEEE Electron Device Letters 呼吁提名主编：IEEE电子器件快报

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IEEE Transactions on Semiconductor Manufacturing Pub Date : 2025-03-01 DOI: 10.1109/TSM.2025.3560206

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Journal of Lightwave Technology Special Issue on: OFS-29 光波技术杂志特刊：OFS-29

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IEEE Transactions on Semiconductor Manufacturing Pub Date : 2025-03-01 DOI: 10.1109/TSM.2025.3546539

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Call for Papers for a Special Issue of IEEE Transactions on Materials for Electron Devices: Exploration of the Exciting world of Multifunctional Oxide-Based Electronic Devices: From Material to System-Level Applications IEEE电子器件材料特刊征文：探索多功能氧化物基电子器件的激动人心的世界：从材料到系统级应用

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IEEE Transactions on Semiconductor Manufacturing Pub Date : 2025-03-01 DOI: 10.1109/TSM.2025.3546537

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Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on Ultrawide Band Gap Semiconductor Devices for RF, Power and Optoelectronic Applications 《IEEE电子器件学报》特刊关于射频、功率和光电子应用的超宽带隙半导体器件的论文征集

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IEEE Transactions on Semiconductor Manufacturing Pub Date : 2025-03-01 DOI: 10.1109/TSM.2025.3562408

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IEEE Transactions on Semiconductor Manufacturing Information for Authors IEEE半导体制造信息汇刊

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IEEE Transactions on Semiconductor Manufacturing Pub Date : 2025-03-01 DOI: 10.1109/TSM.2025.3546541

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Call for Nominations for Editor-in-Chief: IEEE Transactions on Electron Devices 《IEEE电子设备汇刊》主编提名公告

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IEEE Transactions on Semiconductor Manufacturing Pub Date : 2025-03-01 DOI: 10.1109/TSM.2025.3560207

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Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on Wide Band Gap Semiconductors for Automotive Applications 《汽车用宽带隙半导体电子器件》特刊征文

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IEEE Transactions on Semiconductor Manufacturing Pub Date : 2025-03-01 DOI: 10.1109/TSM.2025.3546535

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Guest Editorial Introduction to the Joint Special Issue on Semiconductor Design for Manufacturing (DFM) 《半导体制造设计》（DFM）联合特刊客座编辑简介

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IEEE Transactions on Semiconductor Manufacturing Pub Date : 2025-03-01 DOI: 10.1109/TSM.2025.3559200

Bill Nehrer;Duane Boning;Jeanne Paulette Bickford;Tomasz Brozek;Angelo Pinto;Soichi Inoue;David Z. Pan

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RA-UNet: A New Deep Learning Segmentation Method for Semiconductor Wafer Defect Analysis on Fine-Grained Scanning Electron Microscope (SEM) Images RA-UNet：一种新的深度学习分割方法，用于细粒度扫描电镜（SEM）图像的半导体晶圆缺陷分析

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IEEE Transactions on Semiconductor Manufacturing Pub Date : 2025-02-27 DOI: 10.1109/TSM.2025.3546296

Yibo Qiao;Yanning Chen;Fang Liu;Zhouzhouzhou Mei;Yuening Luo;Yining Chen;Yiyi Liao;Bo Wu;Yongfeng Deng

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A Case Study on Sputtered Chromium Sacrificial Layer for Ti2O3 Microstructure Fabrication 制备Ti2O3微结构的溅射铬牺牲层实例研究

IF 2.3 3区工程技术

IEEE Transactions on Semiconductor Manufacturing Pub Date : 2025-02-25 DOI: 10.1109/TSM.2025.3546217

Angel Regalado-Contreras;Wencel de la Cruz

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