Soumen Kar;Nicholas W. Gangi;Katrina A. Morgan;Lewis G. Carpenter;Nicholas M. Fahrenkopf;Yukta Timalsina;Christopher V. Baiocco;David Harame
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引用次数: 0
Abstract
This work evaluates thick silicon nitride (SiN) film properties using various inline and offline advanced metrology data analysis. The thick SiN films for photonic applications are typically prepared by plasma-enhanced chemical vapor deposition (PECVD) and low-pressure chemical vapor deposition (LPCVD) techniques. Our present study combines high-volume inline and high-accuracy offline metrology to best characterize our thick SiN films. The developed SiN film compositional analysis has been carried out using inline X-ray photoelectron spectroscopy (XPS) to get fast feedback on the composition and contamination of the film surface. Finally, we present a refractive index (n) comparison for annealed and unannealed PECVD/LPCVD wafers.
期刊介绍:
The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.