IEEE Transactions on Semiconductor Manufacturing

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中科院SCI期刊分区 WOS期刊分区历年影响因子历年发表投稿信息同类期刊

期刊缩写：

IEEE Trans. Semicond. Manuf.

影响因子：

2.3

ISSN：

print: 0894-6507
on-line: 1558-2345

研究领域：

工程技术-工程：电子与电气

h-index：

自引率：

11.10%

Gold OA文章占比：

4.67%

原创研究文献占比：

100.00%

SCI收录类型：

Science Citation Index Expanded (SCIE) || Scopus (CiteScore)

期刊官网：

http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=66

期刊介绍英文：

The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.

CiteScore：

CiteScore	SJR	SNIP	CiteScore排名
5.2	0.967	1.237	学科排名百分位大类：Engineering 小类：Industrial and Manufacturing Engineering 114 / 384 70% 大类：Physics and Astronomy 小类：Condensed Matter Physics 131 / 434 69% 大类：Materials Science 小类：Electronic, Optical and Magnetic Materials 89 / 284 68% 大类：Engineering 小类：Electrical and Electronic Engineering 250 / 797 68%

发文信息

中科院SCI期刊分区

大类	小类	TOP期刊	综述期刊
3区工程技术	3区物理：应用 PHYSICS, APPLIED 3区物理：凝聚态物理 PHYSICS, CONDENSED MATTER 4区工程：电子与电气 ENGINEERING, ELECTRICAL & ELECTRONIC 4区工程：制造 ENGINEERING, MANUFACTURING	否	否