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2024 Index IEEE Transactions on Semiconductor Manufacturing Vol. 37 2024 Index IEEE Transactions on Semiconductor Manufacturing Vol.
IF 2.3 3区 工程技术
IEEE Transactions on Semiconductor Manufacturing Pub Date : 2024-11-26 DOI: 10.1109/TSM.2024.3506312
{"title":"2024 Index IEEE Transactions on Semiconductor Manufacturing Vol. 37","authors":"","doi":"10.1109/TSM.2024.3506312","DOIUrl":"https://doi.org/10.1109/TSM.2024.3506312","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"649-667"},"PeriodicalIF":2.3,"publicationDate":"2024-11-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10768858","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142713825","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Call for Nominations for Editor-in-Chief: IEEE Transactions on Semiconductor Manufacturing 征集主编提名：IEEE 半导体制造学报
IF 2.3 3区 工程技术
IEEE Transactions on Semiconductor Manufacturing Pub Date : 2024-11-22 DOI: 10.1109/TSM.2024.3490742
{"title":"Call for Nominations for Editor-in-Chief: IEEE Transactions on Semiconductor Manufacturing","authors":"","doi":"10.1109/TSM.2024.3490742","DOIUrl":"https://doi.org/10.1109/TSM.2024.3490742","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"647-647"},"PeriodicalIF":2.3,"publicationDate":"2024-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10766045","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142694657","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Special Section Call for Papers: Bridging the Data Gap in Photovoltaics with Synthetic Data Generation 特别章节征稿：通过合成数据生成弥补光伏领域的数据差距
IF 2.3 3区 工程技术
IEEE Transactions on Semiconductor Manufacturing Pub Date : 2024-11-22 DOI: 10.1109/TSM.2024.3455875
{"title":"Special Section Call for Papers: Bridging the Data Gap in Photovoltaics with Synthetic Data Generation","authors":"","doi":"10.1109/TSM.2024.3455875","DOIUrl":"https://doi.org/10.1109/TSM.2024.3455875","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"645-646"},"PeriodicalIF":2.3,"publicationDate":"2024-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10765976","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142694678","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Call for Papers: Special Issue on Intelligent Sensor Systems for the IEEE Journal of Electron Devices 征稿：电气和电子工程师学会电子器件学报》智能传感器系统特刊
IF 2.3 3区 工程技术
IEEE Transactions on Semiconductor Manufacturing Pub Date : 2024-11-22 DOI: 10.1109/TSM.2024.3455873
{"title":"Call for Papers: Special Issue on Intelligent Sensor Systems for the IEEE Journal of Electron Devices","authors":"","doi":"10.1109/TSM.2024.3455873","DOIUrl":"https://doi.org/10.1109/TSM.2024.3455873","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"643-644"},"PeriodicalIF":2.3,"publicationDate":"2024-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10766043","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142694680","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Guest Editorial Special Section on Sustainability 可持续发展特刊特约编辑
IF 2.3 3区 工程技术
IEEE Transactions on Semiconductor Manufacturing Pub Date : 2024-11-22 DOI: 10.1109/TSM.2024.3485049
Oliver D. Patterson;Tomasz Brozek;Kaushik Balamukundhan;David M. Fried;Bill Nehrer;Suresh Ramarajan
{"title":"Guest Editorial Special Section on Sustainability","authors":"Oliver D. Patterson;Tomasz Brozek;Kaushik Balamukundhan;David M. Fried;Bill Nehrer;Suresh Ramarajan","doi":"10.1109/TSM.2024.3485049","DOIUrl":"https://doi.org/10.1109/TSM.2024.3485049","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"418-421"},"PeriodicalIF":2.3,"publicationDate":"2024-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10766050","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142691709","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Transactions on Semiconductor Manufacturing Information for Authors IEEE Transactions on Semiconductor Manufacturing 为作者提供的信息
IF 2.3 3区 工程技术
IEEE Transactions on Semiconductor Manufacturing Pub Date : 2024-11-22 DOI: 10.1109/TSM.2024.3455877
{"title":"IEEE Transactions on Semiconductor Manufacturing Information for Authors","authors":"","doi":"10.1109/TSM.2024.3455877","DOIUrl":"https://doi.org/10.1109/TSM.2024.3455877","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"C3-C3"},"PeriodicalIF":2.3,"publicationDate":"2024-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10765978","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142694662","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Blank Page 空白页
IF 2.3 3区 工程技术
IEEE Transactions on Semiconductor Manufacturing Pub Date : 2024-11-22 DOI: 10.1109/TSM.2024.3487439
{"title":"Blank Page","authors":"","doi":"10.1109/TSM.2024.3487439","DOIUrl":"https://doi.org/10.1109/TSM.2024.3487439","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"C4-C4"},"PeriodicalIF":2.3,"publicationDate":"2024-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10766044","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142694649","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
TechRxiv: Share Your Preprint Research With the World! TechRxiv：与世界分享您的预印本研究成果！
IF 2.3 3区 工程技术
IEEE Transactions on Semiconductor Manufacturing Pub Date : 2024-11-22 DOI: 10.1109/TSM.2024.3504213
{"title":"TechRxiv: Share Your Preprint Research With the World!","authors":"","doi":"10.1109/TSM.2024.3504213","DOIUrl":"https://doi.org/10.1109/TSM.2024.3504213","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"648-648"},"PeriodicalIF":2.3,"publicationDate":"2024-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10766042","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142694661","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Transactions on Semiconductor Manufacturing Publication Information 电气和电子工程师学会半导体制造期刊》出版信息
IF 2.3 3区 工程技术
IEEE Transactions on Semiconductor Manufacturing Pub Date : 2024-11-22 DOI: 10.1109/TSM.2024.3455869
{"title":"IEEE Transactions on Semiconductor Manufacturing Publication Information","authors":"","doi":"10.1109/TSM.2024.3455869","DOIUrl":"https://doi.org/10.1109/TSM.2024.3455869","url":null,"abstract":"","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"C2-C2"},"PeriodicalIF":2.3,"publicationDate":"2024-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10765977","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142691702","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Data-Driven Approach for Improving Energy Efficiency in a Semiconductor Manufacturing Plant 提高半导体制造厂能效的数据驱动方法
IF 2.3 3区 工程技术
IEEE Transactions on Semiconductor Manufacturing Pub Date : 2024-11-05 DOI: 10.1109/TSM.2024.3483781
Zhao Hong;Chew Ze Yong;Kosasih Lucky;Goh Jun Rong;Wang Joheng
{"title":"A Data-Driven Approach for Improving Energy Efficiency in a Semiconductor Manufacturing Plant","authors":"Zhao Hong;Chew Ze Yong;Kosasih Lucky;Goh Jun Rong;Wang Joheng","doi":"10.1109/TSM.2024.3483781","DOIUrl":"https://doi.org/10.1109/TSM.2024.3483781","url":null,"abstract":"The semiconductor industry faces increasing pressure to improve energy efficiency while maintaining competitiveness and sustainability. Apart from more conventional energy efficiency measures look at equipment modernization and process and design optimization, this paper explores the potential of data-driven approaches to address these challenges and optimize energy consumption across both the facility and manufacturing space of a semiconductor manufacture plant. By harnessing advanced analytics, machine learning algorithms, and IoT technologies, semiconductor manufacturers can gain real-time insights into energy usage patterns, and identify areas of opportunities that leads to the implementation of targeted interventions to optimize performance. The paper first looks into the challenges and measures of enabling and enhancing data visibility which is the foundation of the data-driven approach, then it examines case studies, best practices and various systematic approaches, demonstrating the transformative impact of data-driven energy efficiency measures which leads to operational efficiency, cost reduction, and environmental sustainability. Ultimately, this paper aims to provide a fresh angle into the energy efficiency study for peers in semiconductor industries to leverage in their journey towards a more sustainable and energy efficient future.","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"37 4","pages":"475-480"},"PeriodicalIF":2.3,"publicationDate":"2024-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10742890","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142691763","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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