{"title":"Effective Deep Reinforcement Learning for Dynamic Machine Allocation: A Case Study on Metal Sputtering Tools","authors":"Hsin-Tzu Hsu;Shi-Chung Chang","doi":"10.1109/TSM.2025.3579970","DOIUrl":null,"url":null,"abstract":"Dynamic Machine Allocation (DMA) is a vital aspect of production scheduling in semiconductor manufacturing. Current DMA practices heavily rely on engineers’ domain expertise and require a few days of manual adjustments in response to rapid but significant fab changes, for example, due to unfamiliar economic shifts. Slow and heuristic DMA policy adaptation very often leads to production shortfalls. To reduce dependence on human expertise and speed up quality responses to changes, we design a framework of effective deep reinforcement learning (DRL) for DMA. Design innovations of the framework include (1) a discrete-event simulator for predicting production flows among machines with state, DMA action and reward aligned to fab practices; (2) a DRL neural network output transformation module that ensures action feasibility in task compatibility and machine availability; and (3) a DRL-based, two-stage agent of DMA policy learning that integrates DRL with optimization techniques for both efficient computation and quality DMA. Operation simulation by using the DMA case and data of a metal sputtering machine group demonstrates that our DRL-based design effectively learns DMA policies in different scenarios, each within one hour. In throughput performance, learned policies surpass a traditional heuristic by 3% to 20%. Our framework and the DRL-based method designs are generic and applicable to DMA of various machine groups.","PeriodicalId":451,"journal":{"name":"IEEE Transactions on Semiconductor Manufacturing","volume":"38 3","pages":"430-438"},"PeriodicalIF":2.3000,"publicationDate":"2025-06-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Semiconductor Manufacturing","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11037289/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Dynamic Machine Allocation (DMA) is a vital aspect of production scheduling in semiconductor manufacturing. Current DMA practices heavily rely on engineers’ domain expertise and require a few days of manual adjustments in response to rapid but significant fab changes, for example, due to unfamiliar economic shifts. Slow and heuristic DMA policy adaptation very often leads to production shortfalls. To reduce dependence on human expertise and speed up quality responses to changes, we design a framework of effective deep reinforcement learning (DRL) for DMA. Design innovations of the framework include (1) a discrete-event simulator for predicting production flows among machines with state, DMA action and reward aligned to fab practices; (2) a DRL neural network output transformation module that ensures action feasibility in task compatibility and machine availability; and (3) a DRL-based, two-stage agent of DMA policy learning that integrates DRL with optimization techniques for both efficient computation and quality DMA. Operation simulation by using the DMA case and data of a metal sputtering machine group demonstrates that our DRL-based design effectively learns DMA policies in different scenarios, each within one hour. In throughput performance, learned policies surpass a traditional heuristic by 3% to 20%. Our framework and the DRL-based method designs are generic and applicable to DMA of various machine groups.
期刊介绍:
The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components, especially very large scale integrated circuits (VLSI). Manufacturing these products requires precision micropatterning, precise control of materials properties, ultraclean work environments, and complex interactions of chemical, physical, electrical and mechanical processes.