Micro and Nano Engineering最新文献_第6页

Energy dissipation in silicon nitride microbeam resonators with a 3D-printed polymer layer 三维打印聚合物层氮化硅微束谐振器的能量耗散

IF 2.8

Micro and Nano Engineering Pub Date : 2025-09-01 Epub Date: 2025-06-05 DOI: 10.1016/j.mne.2025.100300

Lucia Crocetto , Tomás Manzaneque , Murali Krishna Ghatkesar

引用次数: 0

Silicon selective etching by gold implantation: Feasibility and nanofabrication capabilities 金植入硅选择性蚀刻：可行性和纳米制造能力

IF 2.8

Micro and Nano Engineering Pub Date : 2025-09-01 Epub Date: 2025-06-28 DOI: 10.1016/j.mne.2025.100308

E. Scattolo , A. Cian , J. Llobet , X. Borrise Nogue , S. Mondal , M. Barozzi , A. Bagolini , M. Crivellari , F. Pérez-Murano , D. Giubertoni

{"title":"Silicon selective etching by gold implantation: Feasibility and nanofabrication capabilities","authors":"E. Scattolo , A. Cian , J. Llobet , X. Borrise Nogue , S. Mondal , M. Barozzi , A. Bagolini , M. Crivellari , F. Pérez-Murano , D. Giubertoni","doi":"10.1016/j.mne.2025.100308","DOIUrl":"10.1016/j.mne.2025.100308","url":null,"abstract":"<div><div>Silicon nanofabrication plays a crucial role in the development of advanced electronic, photonic, and quantum devices. Focused ion beam (FIB) milling is widely used for direct patterning at the nanoscale, but it requires high ion fluences, leading to long processing times, material redeposition, and increased contamination. In this work, we demonstrate an alternative FIB-based approach that relies on gold ion implantation at significantly lower fluences, enabling selective silicon etching while minimizing these drawbacks.</div><div>Gold ions (Au<sup>+</sup>) were implanted into silicon substrates with a kinetic energy of 35 keV, followed by wet etching in tetramethylammonium hydroxide (TMAH). We identified the process window of Au fluences between 1 × 10<sup>15</sup> and 1 × 10<sup>17</sup> ions/cm<sup>2</sup>, with secondary ion mass spectrometry (SIMS) confirming an Au concentration threshold of 3.5 × 10<sup>20</sup> atoms/cm<sup>3</sup> necessary to sustain etching resistance, value predicted also by Monte Carlo simulations (TRIDYN). This approach enables the fabrication of suspended silicon nanowires with a minimum width of 36 nm, a thickness of 20 nm, and lengths up to 8 μm, achieving aspect ratios exceeding 400, as well as more complex suspended structures likes nets which can be targeted for applications in nanoelectromechanical systems (NEMS) reaching nanowire width over pitch down to 2 %.</div><div>The proposed method presents a promising alternative to conventional silicon patterning, significantly reducing processing complexity while enhancing nanostructure resolution. The results provide new insights into ion-implantation-assisted etching mechanisms and expand the possibilities for silicon nanostructure fabrication.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"28 ","pages":"Article 100308"},"PeriodicalIF":2.8,"publicationDate":"2025-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144549877","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Optimizing reticle based high throughput i-line grayscale projection lithography for 3D structures with low surface roughness 针对低表面粗糙度的三维结构优化基于十字线的高通量i线灰度投影光刻技术

IF 3.1

Micro and Nano Engineering Pub Date : 2025-09-01 Epub Date: 2025-09-03 DOI: 10.1016/j.mne.2025.100319

S. Schermer , J. Bieling , S. DeMoor , A. Zanzal , P. Reynolds , C. Helke , J. Bonitz , A. Voigt , D. Reuter

{"title":"Optimizing reticle based high throughput i-line grayscale projection lithography for 3D structures with low surface roughness","authors":"S. Schermer , J. Bieling , S. DeMoor , A. Zanzal , P. Reynolds , C. Helke , J. Bonitz , A. Voigt , D. Reuter","doi":"10.1016/j.mne.2025.100319","DOIUrl":"10.1016/j.mne.2025.100319","url":null,"abstract":"<div><div>In this work a reticle based i-line projection grayscale stepper lithography is applied, the patterning results are analyzed and the lithographic process is optimized to obtain low surface roughness grayscale pattern. Here the low contrast resist ma-P 1211G, one type of the ma-P 1200G grayscale resist series, from micro resist technology and tailored grayscale reticles from benchmark technologies are used. The spin curve, contrast curve and layer homogeneity of the resist were measured. A low surface roughness of the generated grayscale structures is important, because the roughness will be transferred during subsequent etching steps as pattern transfer. The impact of the pixel size (within the reticle) on the resist roughness and structure fidelity after resist development was investigated. Therefore, to measure the roughness of exposed and developed structures by AFM, dedicated roughness pads were integrated into the reticle design. After evaluation of the resist roughness a DOE study for different annealing steps in order to smoothen the resist surface after development was conducted. The ideal annealing or smoothening temperature was determined to reduce the resist roughness and preserve/ retain the structure fidelity at the same time.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"28 ","pages":"Article 100319"},"PeriodicalIF":3.1,"publicationDate":"2025-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145004270","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Influence of DMSO/DMF ratio on the crystal growth and optical properties of Sn-based perovskite films DMSO/DMF比对sn基钙钛矿薄膜晶体生长和光学性能的影响

IF 2.8

Micro and Nano Engineering Pub Date : 2025-09-01 Epub Date: 2025-06-09 DOI: 10.1016/j.mne.2025.100302

Hideto Tokizawa , Xinwei Zhao , Mariko Murayama

{"title":"Influence of DMSO/DMF ratio on the crystal growth and optical properties of Sn-based perovskite films","authors":"Hideto Tokizawa , Xinwei Zhao , Mariko Murayama","doi":"10.1016/j.mne.2025.100302","DOIUrl":"10.1016/j.mne.2025.100302","url":null,"abstract":"<div><div>Perovskite solar cells (PSCs) are promising candidates for next-generation photovoltaic technology because of their high power conversion efficiency (PCE) and low production cost. However, the presence of lead in most PSCs raises concerns about their environmental impact. Tin (Sn)-based PSCs offer a less toxic alternative, but their performance still lags behind lead (Pb)-based counterparts. This study investigates the impact of solvent composition and annealing temperature on the crystal growth and optoelectronic properties of Sn-based perovskite (MA<sub>0.2</sub>FA<sub>0.8</sub>SnI<sub>3</sub>) thin films. By varying the ratio of dimethyl sulfoxide (DMSO) and <em>N</em>,<em>N</em>-dimethylformamide (DMF) in the precursor solution, we systematically controlled the crystallization process, guided by the LaMer model. X-ray diffraction (XRD) and microscopy analyses revealed that solvent ratio and annealing temperature significantly influence the crystallinity and morphology of the films. High DMSO ratios promoted larger crystal formation, while high DMF ratios induced smaller crystals. Optical characterization revealed a correlation between film morphology and band gap, with deviations from the theoretical value attributed to voids and incomplete surface coverage. Our findings demonstrate the critical role of solvent engineering in optimizing the quality of tin-based perovskite films for enhanced solar cell performance.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"28 ","pages":"Article 100302"},"PeriodicalIF":2.8,"publicationDate":"2025-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144272353","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

AI-initialized level-set inversion for lithographic mask reconstruction 用于光刻掩模重建的ai初始化水平集反演

IF 3.1

Micro and Nano Engineering Pub Date : 2025-09-01 Epub Date: 2025-08-06 DOI: 10.1016/j.mne.2025.100312

Feng-Lin Tsao , Tzu-Yu Lin , Chen Shuai , Tzu-Chun Lo , Yu-Heng Hung , Chun-Hung Lin

{"title":"AI-initialized level-set inversion for lithographic mask reconstruction","authors":"Feng-Lin Tsao , Tzu-Yu Lin , Chen Shuai , Tzu-Chun Lo , Yu-Heng Hung , Chun-Hung Lin","doi":"10.1016/j.mne.2025.100312","DOIUrl":"10.1016/j.mne.2025.100312","url":null,"abstract":"<div><div>As feature sizes in semiconductor manufacturing continue to shrink, accurate mask inspection and wafer-level prediction have become increasingly challenging. This paper presents a lithography-driven mask reconstruction framework that infers physically meaningful mask patterns from aerial images captured by mask reviewers. The proposed approach is grounded in an image formation model based on stacked pupil shift matrices and ensures physical interpretability and alignment with real lithography processes. The framework integrates a level-set-based inverse modeling approach with adaptive time-step optimization methods, including Barzilai–Borwein method and Golden Section Search, to ensure convergence efficiency and stability. To address the sensitivity of level-set methods to initialization, a deep learning-based model trained on lithography-aware data is introduced to generate accurate initial level-set functions. Additionally, an upsampling technique is employed to overcome pixel resolution limitations and to refine mask edge smoothness without increasing runtime. Experimental results demonstrate that the reconstructed masks generate aerial images that closely match those from mask reviewers. Compared with the sidelobe search, our AI-initialized method substantially improves reconstruction accuracy and convergence, especially in cases involving subresolution assist features. Furthermore, wafer-level evaluations exhibit strong alignment between simulated and actual CD variations, and matching slopes are consistently above 0.8. The proposed framework effectively bridges the gap between aerial image analysis and wafer behavior prediction, and offers a robust, scalable solution for advanced mask review and verification workflows.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"28 ","pages":"Article 100312"},"PeriodicalIF":3.1,"publicationDate":"2025-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144810657","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Transmitted electron exposure in electron beam lithography for double-side patterning of bi-layer metasurfaces on a SiNx membrane SiNx膜双层超表面双面图像化电子束光刻中的透射电子曝光

IF 3.1

Micro and Nano Engineering Pub Date : 2025-09-01 Epub Date: 2025-08-06 DOI: 10.1016/j.mne.2025.100313

Jinyu Guo , Yifei Wang , Hao Quan , Shuoqiu Tian , Qiucheng Chen , Wentao Yuan , Qingxin Wu , Kangping Liu , Yifang Chen , Qiong He , Lei Zhou

{"title":"Transmitted electron exposure in electron beam lithography for double-side patterning of bi-layer metasurfaces on a SiNx membrane","authors":"Jinyu Guo , Yifei Wang , Hao Quan , Shuoqiu Tian , Qiucheng Chen , Wentao Yuan , Qingxin Wu , Kangping Liu , Yifang Chen , Qiong He , Lei Zhou","doi":"10.1016/j.mne.2025.100313","DOIUrl":"10.1016/j.mne.2025.100313","url":null,"abstract":"<div><div>Metasheets, composed of two identical metasurfaces closely aligned to each other within a mode-coupling distance on the two opposite sides of a SiN<sub>x</sub> membrane, are of unique functionalities for effective modulation of electromagnetic waves by nanoscale metallic structures. Although the physical image is readily clear, nanofabrication of such a two-sided devices with identical patterns still remains a big challenge because of the e-beam spreading caused by forward scattering in both resists and membranes. In this work, an innovative transmitted electron beam lithography (TEBL) was developed for metasheets. Three different resist stacks were tried and compared to eliminate the pattern deviation between them. A simulation study of TEBL was systematically carried out to figure out a reliable process window for replicating identical Au-gratings on the two opposite sides. The principle behind the success of replicating two identical metasurfaces on opposite sides is analyzed. The developed TEBL in this work extends the application of electron beam lithography to double-sided patterning for novel optical devices such as metasheets.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"28 ","pages":"Article 100313"},"PeriodicalIF":3.1,"publicationDate":"2025-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144830654","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Ni-P metallization of nylon 6,6 yarns with varying twist numbers by supercritical CO2 catalyzation toward weavable devices 超临界CO2催化不同捻数尼龙6,6纱Ni-P金属化制备可织装置

IF 2.8

Micro and Nano Engineering Pub Date : 2025-09-01 Epub Date: 2025-06-16 DOI: 10.1016/j.mne.2025.100304

Kazuhiro Shibata , Tomoyuki Kurioka , Hikaru Kondo , Nao Yoshida , Wan-Ting Chiu , Chun-Yi Chen , Tso-Fu Mark Chang , Hiromichi Kurosu , Masato Sone

{"title":"Ni-P metallization of nylon 6,6 yarns with varying twist numbers by supercritical CO2 catalyzation toward weavable devices","authors":"Kazuhiro Shibata , Tomoyuki Kurioka , Hikaru Kondo , Nao Yoshida , Wan-Ting Chiu , Chun-Yi Chen , Tso-Fu Mark Chang , Hiromichi Kurosu , Masato Sone","doi":"10.1016/j.mne.2025.100304","DOIUrl":"10.1016/j.mne.2025.100304","url":null,"abstract":"<div><div>Weavable devices are innovative fabric-based electronics created by weaving yarns with various functions into a single cloth, enabling multifunctionality beyond traditional wearable devices. Electrically conductive yarns are essential for this integration, and in practical applications, yarns are prepared with varying twist numbers. This study investigates the metallization of nylon 6,6 yarns using a supercritical CO<sub>2</sub>-assisted Ni<img>P electroless plating method and examines the influence of twist numbers on metallization characteristics. The results show that increasing the twist number significantly decreases the electrical resistance of Ni-P/nylon 6,6 composite yarns, underscoring the critical role of yarn structure in electrical conductivity. Energy-dispersive X-ray spectroscopy (EDS) analysis indicates that higher twist numbers (0 T/m to 865 T/m) improve the distribution of Pd catalysts on scCO<sub>2</sub>-catalyzed nylon 6,6 yarns. Additionally, scanning electron microscope (SEM) observations and EDS analysis show that increasing the twist number leads to thicker and more uniform Ni<img>P coatings, thereby improving the electrical performance. Overall, this study demonstrates that optimizing twist number is key to improving the metallization quality and electrical properties of nylon 6,6 yarns for advanced weavable electronic applications.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"28 ","pages":"Article 100304"},"PeriodicalIF":2.8,"publicationDate":"2025-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144322776","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Stereolithography 3D printing method for multi-material hydrogel 2D photo-patterning in a microfluidic chip 微流控芯片中多材料水凝胶二维图像的立体光刻3D打印方法

IF 2.8

Micro and Nano Engineering Pub Date : 2025-06-01 Epub Date: 2025-06-02 DOI: 10.1016/j.mne.2025.100301

S. Assie-Souleille, L. Seguier, D. Gauchard, I. Drobecq, B. Franc, L. Malaquin, J. Foncy

{"title":"Stereolithography 3D printing method for multi-material hydrogel 2D photo-patterning in a microfluidic chip","authors":"S. Assie-Souleille, L. Seguier, D. Gauchard, I. Drobecq, B. Franc, L. Malaquin, J. Foncy","doi":"10.1016/j.mne.2025.100301","DOIUrl":"10.1016/j.mne.2025.100301","url":null,"abstract":"<div><div>We present a novel and straightforward method using a standard stereolithography (SLA) 3D printer for high-resolution (20 μm x-y resolution), multi-material 2D hydrogel photo-patterning directly within a microfluidic chip. The process involves sequential injections of photosensitive hydrogel into a transparent microfluidic chip coupled with sequential direct laser writing by the printer through point-by-point photopolymerization. Our approach integrates a custom miniaturized syringe pump system into the SLA printer, thereby enabling fluid management and sequential injection of different photosensitive hydrogels directly into the microfluidic environment between each laser writing sequence. This technique enables the fabrication of intricate, multi-material hydrogel patterns (e.g., PEGDA and HAMA) with high spatial resolution over areas spanning several square millimeters. Future developments will focus on expanding the range of biomaterials and incorporating cell-laden hydrogels to facilitate the creation of biologically relevant microenvironments on chip.</div><div>This study opens new possibilities for high-resolution, multi-material hydrogel patterning in microfluidics and offers a valuable platform for advancing research in microsystems engineering.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"27 ","pages":"Article 100301"},"PeriodicalIF":2.8,"publicationDate":"2025-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144204270","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Ultrasonic power and data transfer for active medical implants using adaptive beamforming 使用自适应波束形成的有源医疗植入物的超声功率和数据传输

IF 2.8

Micro and Nano Engineering Pub Date : 2025-06-01 Epub Date: 2025-04-29 DOI: 10.1016/j.mne.2025.100296

Tianhui Li , James A. Flint , Hailing Fu , Sotiris Korossis , Stephanos Theodossiades

{"title":"Ultrasonic power and data transfer for active medical implants using adaptive beamforming","authors":"Tianhui Li , James A. Flint , Hailing Fu , Sotiris Korossis , Stephanos Theodossiades","doi":"10.1016/j.mne.2025.100296","DOIUrl":"10.1016/j.mne.2025.100296","url":null,"abstract":"<div><div>Wireless power transfer provides a sustainable power source for active medical implants. Recent developments in biosensors, MEMS technologies and the advent of ubiquitous computing has opened up the potential for a millimeter-sized active medical implant for continuous health monitoring. Frequent wireless communication and data processing requires more energy than traditional active medical implants. Therefore, a continuous power source is needed. This study investigated the development of an ultrasonic power transfer (USPT) system for active medical implants. The system, comprised of a wearable and an implantable device, can transfer both power and data between the implant and the wearable. By implementing beamforming, it can adapt to misalignment between the transmitter and the receiver. In the experiments, the receiver outputs 0.16 mW after rectification, when transmitting through 0.5 cm of water. By measuring the time-of-flight (ToF) of a pulse transmitted from the receiver, implant position feedback is achieved. Data transfer is demonstrated at a rate of 1 kbit/s, across a 4 cm path in water, which is adequate for many biomedical applications.</div></div>","PeriodicalId":37111,"journal":{"name":"Micro and Nano Engineering","volume":"27 ","pages":"Article 100296"},"PeriodicalIF":2.8,"publicationDate":"2025-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143924689","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Assessing ultrasonic and optical flow velocimetry in a millifluidic device using oil-in-water emulsions as blood mimicking fluid 利用水包油乳剂作为模拟血液的液体，在微流体装置中评估超声和光流速测量

IF 2.8

Micro and Nano Engineering Pub Date : 2025-06-01 Epub Date: 2025-05-08 DOI: 10.1016/j.mne.2025.100298

Estelle Lu , Williams Flores Cisternas , Héloïse Uhl , Alexandre Chargueraud , Quentin Grimal , Guillaume Renaud , Jean-Gabriel Minonzio , Jacques Fattaccioli

引用次数: 0