2005 International Symposium on Electronics Materials and Packaging最新文献_第2页

Heat conduction in composites of thermally dissimilar materials - a methodology to economize numerical heat transfer analysis of electronic components 热异质材料复合材料中的热传导——一种节省电子元件数值传热分析的方法

2005 International Symposium on Electronics Materials and Packaging Pub Date : 2005-12-11 DOI: 10.1109/EMAP.2005.1598276

W. Nakayama

引用次数: 1

Evaluation of thermal deformation behavior in electronic package using UV moire interferometry 用紫外云纹干涉法评价电子封装的热变形行为

2005 International Symposium on Electronics Materials and Packaging Pub Date : 2005-12-11 DOI: 10.1109/EMAP.2005.1598263

Jin-Hyoung Park, Soon-Bok Lee

引用次数: 2

A study of hot spot in silicon device for stacked die packages 叠片封装硅器件中热点的研究

2005 International Symposium on Electronics Materials and Packaging Pub Date : 2005-12-11 DOI: 10.1109/EMAP.2005.1598268

J. Akiyama, M. Naeshiro, M. Amagai

{"title":"A study of hot spot in silicon device for stacked die packages","authors":"J. Akiyama, M. Naeshiro, M. Amagai","doi":"10.1109/EMAP.2005.1598268","DOIUrl":"https://doi.org/10.1109/EMAP.2005.1598268","url":null,"abstract":"Stacked die packages are currently used for mobile phones, digital cameras etc as a system-in-package, which includes memory and processor, the other ICs. A memory die is mounted on a processor die using an isolation material (silicon spacer or organic materials) in a package. Small hot spots of silicon devices are serious concern for device function errors, for instance, the difference of 30 degrees in a device affects device access speed error, etc. To study hot spots in a device, a thermal TEG chip, window tunnel and thermal simulation tool were used. After small hot spots were made in the thermal TEG chip packaged with a stacked die package, temperature differences in the device as a function of hot spot sizes were measured. After observing the correlation between experiments and models, a variety of stacked die package designs was studied for hot spot issue. For instance, the effect of die sizes, die thickness, spacer sizes, package types and material properties on thermal performance considering hot spot sizes. The study suggests stacked die package structures and material properties affect hot spot and thermal performance for stacked die packages. The results and explanation are described in this paper.","PeriodicalId":352550,"journal":{"name":"2005 International Symposium on Electronics Materials and Packaging","volume":"459 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-12-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121836069","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Formation and characterization of sputtered thin film for optimizing multilayered interconnection structure 优化多层互连结构的溅射薄膜的形成和表征

2005 International Symposium on Electronics Materials and Packaging Pub Date : 2005-12-11 DOI: 10.1109/EMAP.2005.1598257

W. Sashida, Y. Kimura

引用次数: 0

In situ observation of interfacial fracture in low-dimensional nanostructures 低维纳米结构界面断裂的原位观察

2005 International Symposium on Electronics Materials and Packaging Pub Date : 2005-12-11 DOI: 10.1109/EMAP.2005.1598235

Y. Takahashi, H. Hirakata, T. Kitamura

引用次数: 2

Dynamic characterization study of flip chip ball grid array (FCBGA) on peripheral component interconnect (PCI) board application 倒装芯片球栅阵列(FCBGA)在外围元件互连(PCI)板上应用的动态特性研究

2005 International Symposium on Electronics Materials and Packaging Pub Date : 2005-12-11 DOI: 10.1109/EMAP.2005.1598243

Wong Shaw Fong, L. W. Keat, Lee Yung Hsiang, Yap Eng Hooi, Wong Siang Woen, Hin Tze Yang, M. We

{"title":"Dynamic characterization study of flip chip ball grid array (FCBGA) on peripheral component interconnect (PCI) board application","authors":"Wong Shaw Fong, L. W. Keat, Lee Yung Hsiang, Yap Eng Hooi, Wong Siang Woen, Hin Tze Yang, M. We","doi":"10.1109/EMAP.2005.1598243","DOIUrl":"https://doi.org/10.1109/EMAP.2005.1598243","url":null,"abstract":"This paper outlines and discusses the new mechanical characterization metrologies applied on PCI board envelope. 'The dynamic responses of PCI board were monitored and characterized using accelerometer and strain gauges. PCI board performances were analyzed to differentiate its high risk areas through analysis of board strain responses to solder joint crack. Board \"strain states\" analysis methodology was introduced to provide immediate accurate board bending modes and deflection associated with experimental results. Using this methodology, it eases the board bend mode analysis which can capture the board strain performance limit at the same time. In addition, high speed camera (HSC) tool was incorporated into the evaluation to understand the boards bend history under shock test. This allows better view of the bending moment and matching to defect locations for corrective action implementation. Detailed failure analysis mapping of solder joint crack percentages was successfully gathered to support those findings. Key influences, such as thermal/mechanical enabling preload masses and shock input profiles on solder joint crack severity were conducted as well to understand the potential risk modulators for SJR performance. Furthermore, commercial simulation software analysis tool was applied to correlate the board's bend modes and predict the high risk solder joint location; which is important for product enabling solutions design. As a result, a system level stiffener solution was designed. Hence, with this characterization and validation concept, a practical stiffener solution for PCI application was validated through a special case study to improve the board SJR performance in its use condition.","PeriodicalId":352550,"journal":{"name":"2005 International Symposium on Electronics Materials and Packaging","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-12-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125336144","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Simulation of tensile deformation behavior of polymer by chain network model 用链网络模型模拟聚合物的拉伸变形行为

2005 International Symposium on Electronics Materials and Packaging Pub Date : 2005-12-11 DOI: 10.1109/EMAP.2005.1598252

A. Shinozaki, K. Kishimoto, H. Inoue

{"title":"Simulation of tensile deformation behavior of polymer by chain network model","authors":"A. Shinozaki, K. Kishimoto, H. Inoue","doi":"10.1109/EMAP.2005.1598252","DOIUrl":"https://doi.org/10.1109/EMAP.2005.1598252","url":null,"abstract":"Polymeric materials are used in semiconductors. In these days semiconductors are progressed rapidly. Some new packages are produced. The progress enables to reduction in size and weight, but needs improvements of several properties of polymeric materials at the same time. In this study, improvement of mechanical properties is focused. The mechanical properties of polymeric materials are strongly influenced by meso-scale (10/sup -9//spl sim/10/sup -3/ m) structure such as entanglement, orientation, molecular weight distribution, or chain branch, etc. However, the relationship between the meso-scale structure and macro-scale mechanical properties of polymers has not been clarified. The difficulties plaguing the task of probing the basic mechanisms governing polymer behavior stem from the complexities of the meso-scale structure that dominates the response of the material. Some complexities, chain entanglement, chain slip, and Van der Waals' force, make direct experimental identification of these mechanisms extremely difficult. In these days, many studies about problem of properties of polymer have been made by molecular dynamics. It is possible to clear the detail atomic behaviors of polymeric materials On the contrary; it is not easy to simulate the meso-scale molecular chain behaviors, because of ungodly amount of computational time. In this paper, network models of molecular chains which make easy to compose the meso-scale structure, introduced to simulate the meso-scale interactions. Some network models of molecular chains are constructed. These models have different structures. Large strain deformation of these network models is evolved via the molecular dynamics analysis improved by us.","PeriodicalId":352550,"journal":{"name":"2005 International Symposium on Electronics Materials and Packaging","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-12-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131231611","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Reliability assessments of BGA solder joints under cyclic bending loads 循环弯曲载荷下BGA焊点可靠性评估

2005 International Symposium on Electronics Materials and Packaging Pub Date : 2005-12-11 DOI: 10.1109/EMAP.2005.1598230

Il-ho Kim, Soon-Bok Lee

引用次数: 6

Effects of Au and Ni layer thicknesses on the reliability of BGA solder joints Au和Ni层厚度对BGA焊点可靠性的影响

2005 International Symposium on Electronics Materials and Packaging Pub Date : 2005-12-11 DOI: 10.1109/EMAP.2005.1598241

M. O. Alam, Y. Chan, L. Rufer

引用次数: 0

Optimization of epoxy flow for passive alignment of optical fiber arrays 光纤阵列被动对准环氧树脂流量优化

2005 International Symposium on Electronics Materials and Packaging Pub Date : 2005-12-11 DOI: 10.1109/EMAP.2005.1598249

J. Lo, C. Li, C. L. Tai, S. Lee

{"title":"Optimization of epoxy flow for passive alignment of optical fiber arrays","authors":"J. Lo, C. Li, C. L. Tai, S. Lee","doi":"10.1109/EMAP.2005.1598249","DOIUrl":"https://doi.org/10.1109/EMAP.2005.1598249","url":null,"abstract":"Alignment is very critical in optoelectronic packaging and slightly offset in any direction will affect the performance of the whole system. Optical fiber is one of the most commonly used as light transmitting medium. It is usually coupled with different components such as light source, photo-detector and waveguides. As the core diameter of glass optical fiber is usually small, active alignment is used to ensure the alignment. However, the equipment cost of active alignment is very high and the process time is long. This makes the whole alignment process very expensive and ineffective as stated in M. F. Dautartas et al. (2002) and M. W. Beranek et al. (2000). Recently, passive alignment by utilizing precisely etched V-grooves is getting more common due to its low cost and short cycle time based in P. Karioja et al. (2000) and K. Yamauchi et al. (2000). During the passive alignment process, the optical fiber may be lifted up by the buoyancy of the epoxy and hence an extra covering plate is normally required to press the fibers against the wall of V-grooves. The extra plate may introduce several problems. In this paper, an innovative method of dispensing the epoxy is presented. This introduces the self-alignment capability to the conventional passive alignment method. Also by using the new method, the extra covering plate is not required. It is found that the amount of epoxy dispensed is critically in the process. Also the viscosity of the epoxy determines the flow and hence affects the results. In this paper, the effect of the volume and viscosity of epoxy is studied. From the experimental results, the modified passive alignment method is capable of aligning multiple fibers on fiber arrays up to 8 channels up to 1 micron.","PeriodicalId":352550,"journal":{"name":"2005 International Symposium on Electronics Materials and Packaging","volume":"63 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2005-12-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124770858","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3