{"title":"Au和Ni层厚度对BGA焊点可靠性的影响","authors":"M. O. Alam, Y. Chan, L. Rufer","doi":"10.1109/EMAP.2005.1598241","DOIUrl":null,"url":null,"abstract":"A systematic experimental work has been carried out to understand the mechanism of Au diffusion to the solder interface as well as to investigate the effect of Au and Ni layer thickness on the reliability of BGA solder joint. BGA solder balls of Sn-37wt%Pb has been bonded on BGA solder bond pads of Au/electrolytic Ni/Cu by reflowing at 225/spl deg/C for 0.5 minutes. The thickness of the Ni layer was varied from 0.35 mm to 2.8 mm and the thickness of Au was varied from 0.1 mm to 1.3 mm. Solid state aging up to 1000 h at 150/spl deg/C have been carried out to simulate the ultimate interfacial reactions during an operation life of electronics devices. Cross-sectional studies of interfaces have been conducted by scanning electron microscopy (SEM) equipped with an energy dispersive X-ray (EDX) analysis to investigate the interfacial reaction phenomena. Ball shear tests have been carried out to obtain the interfacial strength and to correlate with the interfacial reaction products. After the shear tests, fracture surfaces have also been investigated to understand the fracture modes.","PeriodicalId":352550,"journal":{"name":"2005 International Symposium on Electronics Materials and Packaging","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2005-12-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Effects of Au and Ni layer thicknesses on the reliability of BGA solder joints\",\"authors\":\"M. O. Alam, Y. Chan, L. Rufer\",\"doi\":\"10.1109/EMAP.2005.1598241\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A systematic experimental work has been carried out to understand the mechanism of Au diffusion to the solder interface as well as to investigate the effect of Au and Ni layer thickness on the reliability of BGA solder joint. BGA solder balls of Sn-37wt%Pb has been bonded on BGA solder bond pads of Au/electrolytic Ni/Cu by reflowing at 225/spl deg/C for 0.5 minutes. The thickness of the Ni layer was varied from 0.35 mm to 2.8 mm and the thickness of Au was varied from 0.1 mm to 1.3 mm. Solid state aging up to 1000 h at 150/spl deg/C have been carried out to simulate the ultimate interfacial reactions during an operation life of electronics devices. Cross-sectional studies of interfaces have been conducted by scanning electron microscopy (SEM) equipped with an energy dispersive X-ray (EDX) analysis to investigate the interfacial reaction phenomena. Ball shear tests have been carried out to obtain the interfacial strength and to correlate with the interfacial reaction products. After the shear tests, fracture surfaces have also been investigated to understand the fracture modes.\",\"PeriodicalId\":352550,\"journal\":{\"name\":\"2005 International Symposium on Electronics Materials and Packaging\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2005-12-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2005 International Symposium on Electronics Materials and Packaging\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EMAP.2005.1598241\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2005 International Symposium on Electronics Materials and Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMAP.2005.1598241","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
摘要
通过系统的实验研究了Au扩散到焊点界面的机理，探讨了Au和Ni层厚度对BGA焊点可靠性的影响。将Sn-37wt%Pb的BGA焊料球焊在Au/电解Ni/Cu的BGA焊料焊盘上，在225℃/spl℃回流0.5 min。Ni层厚度在0.35 mm ~ 2.8 mm之间，Au层厚度在0.1 mm ~ 1.3 mm之间。在150/spl℃下进行了长达1000 h的固态老化，以模拟电子设备在使用寿命期间的最终界面反应。利用扫描电子显微镜(SEM)和能量色散x射线(EDX)分析对界面进行了截面研究，以研究界面反应现象。为了获得界面强度并与界面反应产物相关联，进行了球剪试验。在剪切试验后，还对断裂面进行了研究，以了解断裂模式。
Effects of Au and Ni layer thicknesses on the reliability of BGA solder joints
A systematic experimental work has been carried out to understand the mechanism of Au diffusion to the solder interface as well as to investigate the effect of Au and Ni layer thickness on the reliability of BGA solder joint. BGA solder balls of Sn-37wt%Pb has been bonded on BGA solder bond pads of Au/electrolytic Ni/Cu by reflowing at 225/spl deg/C for 0.5 minutes. The thickness of the Ni layer was varied from 0.35 mm to 2.8 mm and the thickness of Au was varied from 0.1 mm to 1.3 mm. Solid state aging up to 1000 h at 150/spl deg/C have been carried out to simulate the ultimate interfacial reactions during an operation life of electronics devices. Cross-sectional studies of interfaces have been conducted by scanning electron microscopy (SEM) equipped with an energy dispersive X-ray (EDX) analysis to investigate the interfacial reaction phenomena. Ball shear tests have been carried out to obtain the interfacial strength and to correlate with the interfacial reaction products. After the shear tests, fracture surfaces have also been investigated to understand the fracture modes.
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