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Stability of Ni/sub 3/P and its effect on the interfacial reaction between electroless Ni-P and molten tin Ni/sub /P的稳定性及其对化学镀Ni-P与熔融锡界面反应的影响
2005 International Symposium on Electronics Materials and Packaging Pub Date : 1900-01-01 DOI: 10.1109/EMAP.2005.1598244
K. Chen, C. Liu, D. Whalley, D. Hutt
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