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2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)最新文献

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Enforcing Causality and Passivity of Neural Network Models of Broadband S-Parameters 宽带s参数神经网络模型的强制因果性和被动性
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI: 10.1109/EPEPS47316.2019.193234
H. Torun, A. C. Durgun, K. Aygün, M. Swaminathan
{"title":"Enforcing Causality and Passivity of Neural Network Models of Broadband S-Parameters","authors":"H. Torun, A. C. Durgun, K. Aygün, M. Swaminathan","doi":"10.1109/EPEPS47316.2019.193234","DOIUrl":"https://doi.org/10.1109/EPEPS47316.2019.193234","url":null,"abstract":"This paper proposes a method to ensure that S-Parameters generated using neural network (NN) models are physically consistent and can be safely used in subsequent time-domain simulations. This is achieved by introducing causality and passivity enforcement layers as the last two layers of the NN, while minimizing their computational overhead to the training and inference of the NN model. Proposed technique is demonstrated on learning the mapping from 13 dimensional geometrical parameters of a differential plated through hole (PTH) in package core to its corresponding broadband S-Parameters up to 100 GHz.","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129275919","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Fast and Accurate Radiation Calculations for Printed Circuit Boards and Packages 用于印刷电路板和封装的快速准确的辐射计算
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI: 10.1109/EPEPS47316.2019.193239
G. Zhu, Xin Xu, W. Thiel, Ryan Schimizzi
{"title":"Fast and Accurate Radiation Calculations for Printed Circuit Boards and Packages","authors":"G. Zhu, Xin Xu, W. Thiel, Ryan Schimizzi","doi":"10.1109/EPEPS47316.2019.193239","DOIUrl":"https://doi.org/10.1109/EPEPS47316.2019.193239","url":null,"abstract":"Hybrid 2.5-D field solvers have been successfully applied to the analysis of high-speed printed circuit boards (PCB) and electronic packages. To enable electromagnetic interference and electromagnetic compatibility analysis, the solver needs to calculate the electromagnetic radiation in the near-field and far-field regions of the structure efficiently and accurately. We present two enhancements to the radiation calculations. The first is to use fast algorithms to accelerate the near-field and far-field calculations and the second is to correct the trace radiations by including the effect of the dielectric substrate. We demonstrate the accuracy and efficiency of these enhancements with three simulation examples.","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124863960","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
High-Dimensional Parameterized Macromodeling with Guaranteed Stability 具有保证稳定性的高维参数化宏观建模
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI: 10.1109/EPEPS47316.2019.193203
A. Zanco, S. Grivet-Talocia
{"title":"High-Dimensional Parameterized Macromodeling with Guaranteed Stability","authors":"A. Zanco, S. Grivet-Talocia","doi":"10.1109/EPEPS47316.2019.193203","DOIUrl":"https://doi.org/10.1109/EPEPS47316.2019.193203","url":null,"abstract":"We introduce a Radial Basis Function (RBF) parameterized macromodeling algorithm, specifically designed for high-dimensional parameters. As opposed to standard approaches, the adopted RBF model representation has the potential to scale very favorably when the number of model parameters increases, since the number of model coefficients is not related to the dimension of the embedding parameter space. A transmission-line example with up to seven parameters is used to demonstrate the proposed approach.","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115359900","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Processing-in-memory in High Bandwidth Memory (PIM-HBM) Architecture with Energy-efficient and Low Latency Channels for High Bandwidth System 高带宽系统中具有高能效和低延迟信道的PIM-HBM结构中的内存处理
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI: 10.1109/EPEPS47316.2019.193209
Seongguk Kim, Subin Kim, Kyungjun Cho, Taein Shin, Hyunwook Park, Daehwan Lho, Shinyoung Park, Kyungjune Son, Gapyeol Park, Joungho Kim
{"title":"Processing-in-memory in High Bandwidth Memory (PIM-HBM) Architecture with Energy-efficient and Low Latency Channels for High Bandwidth System","authors":"Seongguk Kim, Subin Kim, Kyungjun Cho, Taein Shin, Hyunwook Park, Daehwan Lho, Shinyoung Park, Kyungjune Son, Gapyeol Park, Joungho Kim","doi":"10.1109/EPEPS47316.2019.193209","DOIUrl":"https://doi.org/10.1109/EPEPS47316.2019.193209","url":null,"abstract":"In this paper, for the first time, we propose a processing-in-memory in high bandwidth memory (PIM-HBM) architecture for high bandwidth systems with low dynamic random-access memory (DRAM) access costs. The main concept of the proposed PIM-HBM architecture is to embed processing units into a logic base of high bandwidth memory (HBM) to decrease the energy consumption and latency of interconnections as the physical length between core and DRAM decreases. To verify the proposed PIM-HBM architecture, we designed on-chip and on-interposer I/O channels using a CMOS 0.18 µm process. We extracted channel parasitic using an electromagnetic (EM) solver and performed a SPICE simulation to compare the system performance of the proposed architecture with the conventional HBM. As a result, the performance of the proposed PIM-HBM architecture is successfully verified by reducing energy consumption and latency of interconnections by 77 % and 79 % compared to the conventional HBM system.","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114314207","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
Signal Integrity Considerations of PCB Wiring in Tightly Pitched Module Pin Fields of High Speed Channels 高速通道紧密倾斜模块引脚场中PCB布线的信号完整性考虑
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI: 10.1109/EPEPS47316.2019.193216
J. Myers, J. Hejase, Junyan Tang, S. Chun, W. Becker, D. Dreps
{"title":"Signal Integrity Considerations of PCB Wiring in Tightly Pitched Module Pin Fields of High Speed Channels","authors":"J. Myers, J. Hejase, Junyan Tang, S. Chun, W. Becker, D. Dreps","doi":"10.1109/EPEPS47316.2019.193216","DOIUrl":"https://doi.org/10.1109/EPEPS47316.2019.193216","url":null,"abstract":"Effects of PCB wiring in tightly pitched module pin fields on high speed channel signal integrity are evaluated in this paper. Three different module orthogonal pin pitches are considered: 0.8mm, 1.06mm and 1.27mm. Each of the pin pitch scenarios is represented through corresponding PCB via and PCB pin area wiring models. Frequency domain SI metrics, at 16GHz, of a full end to end channel including the different tightly pitched module PCB wiring scenarios are quantified, compared and discussed. Additionally, full channel time domain eye simulations carried out at 32Gb/s are used to evaluate effects on eye opening and correlate with the frequency domain observations.","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131243383","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
EPEPS 2019 Sessions EPEPS 2019 年会议
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI: 10.1109/epeps47316.2019.9073192
{"title":"EPEPS 2019 Sessions","authors":"","doi":"10.1109/epeps47316.2019.9073192","DOIUrl":"https://doi.org/10.1109/epeps47316.2019.9073192","url":null,"abstract":"","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134152434","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Crosstalk Analysis in MWCNTs using a Closed-Form Matrix Rational Approximation Technique 基于封闭矩阵有理逼近技术的MWCNTs串扰分析
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI: 10.1109/EPEPS47316.2019.193210
Amit Kumar, B. Kaushik, Sourajeet Roy, R. Achar
{"title":"Crosstalk Analysis in MWCNTs using a Closed-Form Matrix Rational Approximation Technique","authors":"Amit Kumar, B. Kaushik, Sourajeet Roy, R. Achar","doi":"10.1109/EPEPS47316.2019.193210","DOIUrl":"https://doi.org/10.1109/EPEPS47316.2019.193210","url":null,"abstract":"This paper presents a matrix rational approximation (MRA) based method for crosstalk modeling in multiwall carbon nanotube (MWCNT) on-chip interconnect networks. The main feature of the proposed model is that it approximates the transfer function matrix of the MWCNT network in the frequency domain as a rational function derived in a closed-form manner from predetermined Padé coefficients and per-unit-length interconnect parameters. This rational function model can be directly converted into time-domain, free of any numerical integration techniques, and is consequently more efficient than SPICE simulations.","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114168762","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Moments-Based Sensitivity Analysis of X-Parameters with respect to Linear and Nonlinear Circuit Components 基于力矩的线性和非线性电路元件x参数灵敏度分析
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI: 10.1109/EPEPS47316.2019.193208
Marco T. Kassis, D. Tannir, Raffi Toukhtarian, R. Khazaka
{"title":"Moments-Based Sensitivity Analysis of X-Parameters with respect to Linear and Nonlinear Circuit Components","authors":"Marco T. Kassis, D. Tannir, Raffi Toukhtarian, R. Khazaka","doi":"10.1109/EPEPS47316.2019.193208","DOIUrl":"https://doi.org/10.1109/EPEPS47316.2019.193208","url":null,"abstract":"The X-parameters of a nonlinear structure or circuit block relate the different harmonics of the incident power waves to the reflected ones in the frequency domain. Recently, a moments based approach for the computation of the X-parameters sensitivity has been developed. In this manuscript, we build on those results and present an efficient and accurate moments based method for the sensitivity analysis with respect to both linear and nonlinear circuit parameters. The proposed method allows for the accurate and efficient computation of X-parameter sensitivity without the need for brute force perturbation.","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114444286","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Design and Analysis of a 10 Gbps USB 3.2 Gen 2 Type-C Connector for TV Set-Top Box 电视机顶盒用10gbps USB 3.2 Gen 2 Type-C连接器的设计与分析
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI: 10.1109/EPEPS47316.2019.193241
Kyungjune Son, Sumin Choi, D. Jung, Keunwoo Kim, Gapyeol Park, Daehwan Lho, Hyunwook Park, Shinyoung Park and, Joungho Kim, Y. Cho, Byung-Rak Park, Seong-Joon Choi
{"title":"Design and Analysis of a 10 Gbps USB 3.2 Gen 2 Type-C Connector for TV Set-Top Box","authors":"Kyungjune Son, Sumin Choi, D. Jung, Keunwoo Kim, Gapyeol Park, Daehwan Lho, Hyunwook Park, Shinyoung Park and, Joungho Kim, Y. Cho, Byung-Rak Park, Seong-Joon Choi","doi":"10.1109/EPEPS47316.2019.193241","DOIUrl":"https://doi.org/10.1109/EPEPS47316.2019.193241","url":null,"abstract":"Recently, various high-speed connectors are used for the data transmission. With the high data rate, it is important to design the high-speed connectors considering not only mechanical but also electrical characteristics. In this paper, we propose a 10 Gbps USB 3.2 Gen 2 Type-C connector for TV set-top box. For the high-speed data transmission, the signal integrity (SI) including characteristic impedance, insertion loss and return loss should be considered. We verified the improved SI performance of proposed connector based on time-domain and frequency domain simulation using 3-D electromagnetic (EM) solver. Furthermore, with the proposed connector design, it shows superior SI characteristics at 20 Gbps which is expected to next generation connector’s data rate.","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124128697","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A Reduced-Domain Layered-Medium Integral-Equation Method for Electronic Packages 电子封装的一种简化域分层介质积分方程法
2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI: 10.1109/EPEPS47316.2019.193213
Chang Liu, A. Yılmaz
{"title":"A Reduced-Domain Layered-Medium Integral-Equation Method for Electronic Packages","authors":"Chang Liu, A. Yılmaz","doi":"10.1109/EPEPS47316.2019.193213","DOIUrl":"https://doi.org/10.1109/EPEPS47316.2019.193213","url":null,"abstract":"A reduced-domain layered-medium integral-equation method that models the finite thickness, finite conductivity, and surface roughness of large metallizations via layered-medium Green’s functions is presented. Using a package-scale benchmark interconnect structure, the method is shown to lower the computational cost and complexity of network parameter extraction when an FFT-accelerated iterative solver is used (as it improves matrix conditioning and reduces number of unknowns) without compromising accuracy.","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127983234","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
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