用于印刷电路板和封装的快速准确的辐射计算

2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI:10.1109/EPEPS47316.2019.193239

G. Zhu, Xin Xu, W. Thiel, Ryan Schimizzi

{"title":"用于印刷电路板和封装的快速准确的辐射计算","authors":"G. Zhu, Xin Xu, W. Thiel, Ryan Schimizzi","doi":"10.1109/EPEPS47316.2019.193239","DOIUrl":null,"url":null,"abstract":"Hybrid 2.5-D field solvers have been successfully applied to the analysis of high-speed printed circuit boards (PCB) and electronic packages. To enable electromagnetic interference and electromagnetic compatibility analysis, the solver needs to calculate the electromagnetic radiation in the near-field and far-field regions of the structure efficiently and accurately. We present two enhancements to the radiation calculations. The first is to use fast algorithms to accelerate the near-field and far-field calculations and the second is to correct the trace radiations by including the effect of the dielectric substrate. We demonstrate the accuracy and efficiency of these enhancements with three simulation examples.","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Fast and Accurate Radiation Calculations for Printed Circuit Boards and Packages\",\"authors\":\"G. Zhu, Xin Xu, W. Thiel, Ryan Schimizzi\",\"doi\":\"10.1109/EPEPS47316.2019.193239\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Hybrid 2.5-D field solvers have been successfully applied to the analysis of high-speed printed circuit boards (PCB) and electronic packages. To enable electromagnetic interference and electromagnetic compatibility analysis, the solver needs to calculate the electromagnetic radiation in the near-field and far-field regions of the structure efficiently and accurately. We present two enhancements to the radiation calculations. The first is to use fast algorithms to accelerate the near-field and far-field calculations and the second is to correct the trace radiations by including the effect of the dielectric substrate. We demonstrate the accuracy and efficiency of these enhancements with three simulation examples.\",\"PeriodicalId\":304228,\"journal\":{\"name\":\"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"volume\":\"3 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS47316.2019.193239\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS47316.2019.193239","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

混合2.5维现场求解器已成功应用于高速印刷电路板(PCB)和电子封装的分析。为了进行电磁干扰和电磁兼容性分析，求解器需要高效准确地计算结构近场和远场区域的电磁辐射。我们提出了对辐射计算的两个改进。一是利用快速算法加速近场和远场计算，二是通过考虑介电基片的影响来校正微量辐射。我们通过三个仿真实例证明了这些增强的准确性和效率。

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Fast and Accurate Radiation Calculations for Printed Circuit Boards and Packages

Hybrid 2.5-D field solvers have been successfully applied to the analysis of high-speed printed circuit boards (PCB) and electronic packages. To enable electromagnetic interference and electromagnetic compatibility analysis, the solver needs to calculate the electromagnetic radiation in the near-field and far-field regions of the structure efficiently and accurately. We present two enhancements to the radiation calculations. The first is to use fast algorithms to accelerate the near-field and far-field calculations and the second is to correct the trace radiations by including the effect of the dielectric substrate. We demonstrate the accuracy and efficiency of these enhancements with three simulation examples.

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2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

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