高速通道紧密倾斜模块引脚场中PCB布线的信号完整性考虑

2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI:10.1109/EPEPS47316.2019.193216

J. Myers, J. Hejase, Junyan Tang, S. Chun, W. Becker, D. Dreps

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引用次数: 0

摘要

本文评估了紧密倾斜模块引脚场中PCB布线对高速通道信号完整性的影响。考虑三种不同的模块正交引脚间距:0.8mm, 1.06mm和1.27mm。每个引脚间距场景都通过相应的PCB通孔和PCB引脚面积布线模型来表示。在16GHz的频域SI指标，一个完整的端到端通道，包括不同的紧密倾斜模块PCB布线方案进行了量化，比较和讨论。此外，采用32Gb/s的全通道时域人眼模拟来评估对睁眼的影响，并与频域观测结果相关联。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Signal Integrity Considerations of PCB Wiring in Tightly Pitched Module Pin Fields of High Speed Channels

Effects of PCB wiring in tightly pitched module pin fields on high speed channel signal integrity are evaluated in this paper. Three different module orthogonal pin pitches are considered: 0.8mm, 1.06mm and 1.27mm. Each of the pin pitch scenarios is represented through corresponding PCB via and PCB pin area wiring models. Frequency domain SI metrics, at 16GHz, of a full end to end channel including the different tightly pitched module PCB wiring scenarios are quantified, compared and discussed. Additionally, full channel time domain eye simulations carried out at 32Gb/s are used to evaluate effects on eye opening and correlate with the frequency domain observations.

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2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

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