A Reduced-Domain Layered-Medium Integral-Equation Method for Electronic Packages

Abstract

A reduced-domain layered-medium integral-equation method that models the finite thickness, finite conductivity, and surface roughness of large metallizations via layered-medium Green’s functions is presented. Using a package-scale benchmark interconnect structure, the method is shown to lower the computational cost and complexity of network parameter extraction when an FFT-accelerated iterative solver is used (as it improves matrix conditioning and reduces number of unknowns) without compromising accuracy.