Seongguk Kim, Subin Kim, Kyungjun Cho, Taein Shin, Hyunwook Park, Daehwan Lho, Shinyoung Park, Kyungjune Son, Gapyeol Park, Joungho Kim
{"title":"高带宽系统中具有高能效和低延迟信道的PIM-HBM结构中的内存处理","authors":"Seongguk Kim, Subin Kim, Kyungjun Cho, Taein Shin, Hyunwook Park, Daehwan Lho, Shinyoung Park, Kyungjune Son, Gapyeol Park, Joungho Kim","doi":"10.1109/EPEPS47316.2019.193209","DOIUrl":null,"url":null,"abstract":"In this paper, for the first time, we propose a processing-in-memory in high bandwidth memory (PIM-HBM) architecture for high bandwidth systems with low dynamic random-access memory (DRAM) access costs. The main concept of the proposed PIM-HBM architecture is to embed processing units into a logic base of high bandwidth memory (HBM) to decrease the energy consumption and latency of interconnections as the physical length between core and DRAM decreases. To verify the proposed PIM-HBM architecture, we designed on-chip and on-interposer I/O channels using a CMOS 0.18 µm process. We extracted channel parasitic using an electromagnetic (EM) solver and performed a SPICE simulation to compare the system performance of the proposed architecture with the conventional HBM. As a result, the performance of the proposed PIM-HBM architecture is successfully verified by reducing energy consumption and latency of interconnections by 77 % and 79 % compared to the conventional HBM system.","PeriodicalId":304228,"journal":{"name":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":"{\"title\":\"Processing-in-memory in High Bandwidth Memory (PIM-HBM) Architecture with Energy-efficient and Low Latency Channels for High Bandwidth System\",\"authors\":\"Seongguk Kim, Subin Kim, Kyungjun Cho, Taein Shin, Hyunwook Park, Daehwan Lho, Shinyoung Park, Kyungjune Son, Gapyeol Park, Joungho Kim\",\"doi\":\"10.1109/EPEPS47316.2019.193209\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, for the first time, we propose a processing-in-memory in high bandwidth memory (PIM-HBM) architecture for high bandwidth systems with low dynamic random-access memory (DRAM) access costs. The main concept of the proposed PIM-HBM architecture is to embed processing units into a logic base of high bandwidth memory (HBM) to decrease the energy consumption and latency of interconnections as the physical length between core and DRAM decreases. To verify the proposed PIM-HBM architecture, we designed on-chip and on-interposer I/O channels using a CMOS 0.18 µm process. We extracted channel parasitic using an electromagnetic (EM) solver and performed a SPICE simulation to compare the system performance of the proposed architecture with the conventional HBM. As a result, the performance of the proposed PIM-HBM architecture is successfully verified by reducing energy consumption and latency of interconnections by 77 % and 79 % compared to the conventional HBM system.\",\"PeriodicalId\":304228,\"journal\":{\"name\":\"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"10\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEPS47316.2019.193209\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS47316.2019.193209","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Processing-in-memory in High Bandwidth Memory (PIM-HBM) Architecture with Energy-efficient and Low Latency Channels for High Bandwidth System
In this paper, for the first time, we propose a processing-in-memory in high bandwidth memory (PIM-HBM) architecture for high bandwidth systems with low dynamic random-access memory (DRAM) access costs. The main concept of the proposed PIM-HBM architecture is to embed processing units into a logic base of high bandwidth memory (HBM) to decrease the energy consumption and latency of interconnections as the physical length between core and DRAM decreases. To verify the proposed PIM-HBM architecture, we designed on-chip and on-interposer I/O channels using a CMOS 0.18 µm process. We extracted channel parasitic using an electromagnetic (EM) solver and performed a SPICE simulation to compare the system performance of the proposed architecture with the conventional HBM. As a result, the performance of the proposed PIM-HBM architecture is successfully verified by reducing energy consumption and latency of interconnections by 77 % and 79 % compared to the conventional HBM system.