电子封装的一种简化域分层介质积分方程法

2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) Pub Date : 2019-10-01 DOI:10.1109/EPEPS47316.2019.193213

Chang Liu, A. Yılmaz

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引用次数: 2

摘要

提出了一种简化域层状介质积分方程方法，利用层状介质格林函数对大型金属化层的有限厚度、有限电导率和表面粗糙度进行建模。使用封装规模的基准互连结构，该方法被证明在使用fft加速迭代求解器(因为它改善了矩阵调理并减少了未知数数量)时降低了网络参数提取的计算成本和复杂性，而不会影响准确性。

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A Reduced-Domain Layered-Medium Integral-Equation Method for Electronic Packages

A reduced-domain layered-medium integral-equation method that models the finite thickness, finite conductivity, and surface roughness of large metallizations via layered-medium Green’s functions is presented. Using a package-scale benchmark interconnect structure, the method is shown to lower the computational cost and complexity of network parameter extraction when an FFT-accelerated iterative solver is used (as it improves matrix conditioning and reduces number of unknowns) without compromising accuracy.

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来源期刊

2019 IEEE 28th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

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