Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)最新文献

Investigation of InP/InGaAs pnp /spl delta/-doped heterojunction bipolar transistor InP/InGaAs pnp /spl δ /掺杂异质结双极晶体管的研究

Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850) Pub Date : 2004-11-15 DOI: 10.1109/ESSDER.2004.1356584

J. Tsai, King-Poul Zhu, Ying-Cheng Chu, S. Chiu

引用次数: 1

Low voltage and low power aspects of data converter design 低电压和低功耗方面的数据转换器设计

Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850) Pub Date : 2004-11-15 DOI: 10.1109/ESSDER.2004.1356478

Qiuting Huang

引用次数: 11

The 1/f noise versus sheet resistance in poly-Si is similar to poly-SiGe resistors and Au-layers 多晶硅中的1/f噪声与薄片电阻类似于多晶硅电阻和au层

Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850) Pub Date : 2004-11-15 DOI: 10.1109/ESSDER.2004.1356565

L. Vandamme, H. Casier

引用次数: 28

Impact of STI-induced stress, inverse narrow width effect, and statistical V/sub TH/ variations on leakage currents in 120 nm CMOS sti诱导应力、逆窄宽度效应和统计V/sub TH/变化对120nm CMOS漏电流的影响

Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850) Pub Date : 2004-11-15 DOI: 10.1109/ESSDER.2004.1356573

C. Pacha, B. Martin, K. von Arnim, R. Brederlow, D. Schmitt-Landsiedel, P. Seegebrecht, J. Berthold, R. Thewes

引用次数: 55

Low power digital circuit design 低功耗数字电路设计

Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850) Pub Date : 2004-11-15 DOI: 10.1109/ESSDER.2004.1356476

T. Sakurai

引用次数: 11

Investigation about the high-temperature impact-ionization coefficient in silicon 硅中高温冲击电离系数的研究

Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850) Pub Date : 2004-11-15 DOI: 10.1109/ESSDER.2004.1356535

S. Reggiani, M. Rudan, E. Gnani, G. Baccarani

引用次数: 17

A novel method for forming gate spacer and its effects on the W/WN/sub x//poly-Si gate stack 一种新的栅极间隔层形成方法及其对W/WN/sub / x/多晶硅栅极叠加的影响

Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850) Pub Date : 2004-11-15 DOI: 10.1109/ESSDER.2004.1356497

Yong Soo Kim, K. Lim, Jae-Geun Oh, S. Jang, Heung-Jae Cho, Jun-Mo Yang, J. Suh, Su-Ock Chung, Soo-Young Park, Hong-Seon Yang, H. Sohn, Jin-Woong Kim

引用次数: 0

Analysis of the back gate effect on the breakdown behaviour of SOI LDMOS transistors 后门效应对SOI LDMOS晶体管击穿行为的影响分析

Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850) Pub Date : 2004-11-15 DOI: 10.1109/ESSDER.2004.1356537

S. Schwantes, T. Florian, M. Graf, F. Dietz, V. Dudek

引用次数: 10

Universal integrated PIN photodetector 通用集成PIN光电探测器

Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850) Pub Date : 2004-11-15 DOI: 10.1109/ESSDER.2004.1356561

K. Oberhauser, A. Nemecek, C. Sunder, H. Zimmermann

引用次数: 7

On ambient intelligence, needful things and process technologies 关于环境智能、必需品和过程技术

Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850) Pub Date : 2004-11-15 DOI: 10.1109/ESSDER.2004.1356475

C. van der Poel, F. Pessolano, R. Roovers, F. Widdershoven, G. van de Walle, E. Aarts, P. Christie

{"title":"On ambient intelligence, needful things and process technologies","authors":"C. van der Poel, F. Pessolano, R. Roovers, F. Widdershoven, G. van de Walle, E. Aarts, P. Christie","doi":"10.1109/ESSDER.2004.1356475","DOIUrl":"https://doi.org/10.1109/ESSDER.2004.1356475","url":null,"abstract":"The ongoing miniaturization of electronic circuits and the corresponding exponential increase in embedded computational power is reaching the point where it becomes viable to integrate electronics into people environments. Ambient intelligence refers to an electronic environment that is sensitive and responsive to the presence of people. Such an environment should be (1) ubiquitous: surrounding the user by a multitude of interconnected systems; (2) transparent: integrated and hidden into the background; (3) intelligent: adapting to the people that live in it. The potential to distribute functionality over a network of devices is determined by the power resources of the device and upon considering these demands it appears helpful to further classify in-home ambient intelligence \"devices\" into three distinct classes: the \"watt-node\", \"milli-watt-node\", and \"micro-watt-node\". In this paper we try to map the system needs associated with these nodes, differing by orders of magnitude with respect to the amount of information to be processed as well as the available power, on to requirements for Si process technology choices.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124741443","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 11