K. Torii, T. Kawahara, R. Mitsuhashi, H. Ohji, A. Mutoh, S. Miyazaki, H. Kitajima, T. Arikado
{"title":"Time-dependent dielectric breakdown of HfAlOx/SiON gate dielectric","authors":"K. Torii, T. Kawahara, R. Mitsuhashi, H. Ohji, A. Mutoh, S. Miyazaki, H. Kitajima, T. Arikado","doi":"10.1109/ESSDER.2004.1356496","DOIUrl":"https://doi.org/10.1109/ESSDER.2004.1356496","url":null,"abstract":"The breakdown characteristics of HfAlOx/SiON layered gate dielectrics were investigated. In the case of nCap accumulation or pFET inversion, the majority carrier type is hole and the time to breakdown (T/sub BD/) under constant voltage stress (CVS) is determined by the SiON breakdown. In the case of pCap accumulation or nFET inversion, the gate current and breakdown voltage is limited by the SiON, while the T/sub BD/ is determined by the HfAlOx breakdown. The incident electron energy is found to be an important factor on the T/sub BD/ distribution.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128214329","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
V. Kilchytska, N. Collaert, R. Rooyackers, D. Lederer, J. Raskin, D. Flandre
{"title":"Perspective of FinFETs for analog applications","authors":"V. Kilchytska, N. Collaert, R. Rooyackers, D. Lederer, J. Raskin, D. Flandre","doi":"10.1109/ESSDER.2004.1356489","DOIUrl":"https://doi.org/10.1109/ESSDER.2004.1356489","url":null,"abstract":"FinFETs are known to be one of the most promising technological solutions to create high-performance ultra-scaled Si MOSFETs. In this paper, we present the first detailed experimental investigation of the analog performance of FinFETs with channel lengths down to 50 nm. We demonstrate that such devices have very strong potential for analog applications, mainly thanks to a super-high value of the Early voltage and hence intrinsic gain, which they can provide. The impact of fin width on device characteristics is also analysed. We show that the narrowest devices appear as the most promising, since they operate in the fully-depleted regime, even possibly in volume inversion.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129613360","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Soo-jin Hong, Young Pil Kim, J. Heo, Gook-Hyun Yon, G. H. Buh, Y. Shin, U. Chung, J. Moon
{"title":"Electrical analysis on the drain current of the ultra shallow junction by laser annealing","authors":"Soo-jin Hong, Young Pil Kim, J. Heo, Gook-Hyun Yon, G. H. Buh, Y. Shin, U. Chung, J. Moon","doi":"10.1109/ESSDER.2004.1356509","DOIUrl":"https://doi.org/10.1109/ESSDER.2004.1356509","url":null,"abstract":"We applied non-melt laser anneal to the CMOS as an alternative method to activate the source/drain junction dopant. By simple changing of the spike anneal to the laser anneal, it was found that the short channel effect (SCE) is suppressed remarkably. The drive current of the device with the laser anneal is improved for the long channel transistor but degraded for the short channel transistor, compared to the spike anneal. We showed that the drive current is directly related to the overlap capacitance at short channel. And using a forward bias method, we found out that the current degradation is caused by the contact resistance.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129621538","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Self-aligned recessed source/drain ultra-thin body SOI MOSFET technology","authors":"Zhikuan Zhang, S. Zhang, M. Chan","doi":"10.1109/ESSDER.2004.1356549","DOIUrl":"https://doi.org/10.1109/ESSDER.2004.1356549","url":null,"abstract":"In this work, a self-aligned recessed source/drain (ReS/D) ultra-thin body (UTB) SOI MOS technology is proposed and demonstrated. The thick diffusion regions of the ReS/D are placed on a recessed trench, which is patterned on the buried oxide and go under the SOI film. The new structure reduces the parasitic source/drain resistance without increasing the gate-to-drain Miller capacitance, which is the major advantage over the elevated source/drain structure. The scalability of the UTB MOSFETs and the larger design window due to reduced parasitics are demonstrated. Fabrication details and experimental results are presented.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"56 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127175869","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Physical modeling and prediction of the matching properties of MOSFETs","authors":"J. Croon, S. Decoutere, W. Sansen, H. Maes","doi":"10.1109/ESSDER.2004.1356522","DOIUrl":"https://doi.org/10.1109/ESSDER.2004.1356522","url":null,"abstract":"A physical model is presented that describes the matching properties of the MOS transistor. Fluctuations in channel doping, fixed oxide charge, gate doping, and oxide thickness are taken into account. A good agreement is demonstrated between the model and the mismatch in the drain current and transconductance of a 0.13 /spl mu/m technology. Fluctuations in the channel doping are found to be the dominating effect. These affect the transistor through the threshold voltage directly, and through Coulomb scattering. A prediction is made concerning the matching properties of future technologies. It is expected that the fluctuations in the threshold voltage remain constant at A/sub 0/(/spl Delta/V/sub T/)=3 mV/spl mu/m, independently of the technology generation.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127542910","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
J. Hooker, N. Pérez, P. Alén, M. Ritala, M. Leskela, F. Roozeboom, J.G.M. van Berkurn, E. Naburgh, F.C. van den Heuvel, J. Maes
{"title":"Work function stability of thermal ALD Ta(Si)N gate electrodes on HfO/sub 2/ [CMOS device applications]","authors":"J. Hooker, N. Pérez, P. Alén, M. Ritala, M. Leskela, F. Roozeboom, J.G.M. van Berkurn, E. Naburgh, F.C. van den Heuvel, J. Maes","doi":"10.1109/ESSDER.2004.1356494","DOIUrl":"https://doi.org/10.1109/ESSDER.2004.1356494","url":null,"abstract":"Ta(Si)N films deposited by thermal atomic layer deposition (ALD) have been investigated as potential gate electrode materials in advanced CMOS devices. The work function (/spl Phi//sub m/) of these films was determined by high-frequency capacitance-voltage measurements (HF-CV) on a thickness series of ALD HfO/sub 2/. Depositing films at 400 and 500/spl deg/C with an optimized pulse sequence, two films with Si content of 3 and 8 at%, respectively, were studied. Both Ta(Si)N films gave /spl Phi//sub m/ of 4.7/spl plusmn/0.1 eV, also, after high-temperature thermal treatment, with the 400/spl deg/C deposition giving more reliable electrical performance.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"131 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130779432","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
J. Hartwich, L. Dreeskornfeld, F. Hofmann, J. Kretz, E. Landgraf, R. J. Luyken, M. Specht, M. Stadele, T. Schulz, W. Rosner, L. Risch
{"title":"Off current adjustment in ultra-thin SOI MOSFETs","authors":"J. Hartwich, L. Dreeskornfeld, F. Hofmann, J. Kretz, E. Landgraf, R. J. Luyken, M. Specht, M. Stadele, T. Schulz, W. Rosner, L. Risch","doi":"10.1109/ESSDER.2004.1356550","DOIUrl":"https://doi.org/10.1109/ESSDER.2004.1356550","url":null,"abstract":"This work reports a detailed study of nanoscale ultra-thin (UT) SOI MOSFETs for low power applications. Partially depleted (PD) and fully depleted (FD) NMOS and PMOS devices with a wide range of gate lengths down to 25 nm and silicon thicknesses of 25 nm and 16 nm have been analysed. Gate oxide thicknesses of 2.5 nm and 1.8 nm have also been compared. We demonstrate off current adjustment by channel implantation whereby, together with work function engineering, a suitable solution for multiple Vt SOI CMOS technology could be provided.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130781270","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
S. Severi, K. Henson, R. Lindsay, B. Pawlak, K. De Meyer
{"title":"Channel engineering towards a full low temperature process solution for the 45 nm technology node [NMOS transistors]","authors":"S. Severi, K. Henson, R. Lindsay, B. Pawlak, K. De Meyer","doi":"10.1109/ESSDER.2004.1356530","DOIUrl":"https://doi.org/10.1109/ESSDER.2004.1356530","url":null,"abstract":"This work analyses the impact of junctions formed by solid phase epitaxial re-growth (SPER) on the electrical characteristics of NMOS transistors. These ultra shallow junctions allow us to control the short channel effects (SCE) and to improve the transistor performance down to 30 nm channel lengths. We demonstrate the viability of an ultra low temperature process, enabling the activation of B halo and S/D junction dopant. We also show that the junction leakage can be reduced with the SPER process, compared with the standard spike anneal junction.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"258 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132055632","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
C. Ortolland, S. Orain, J. Rosa, P. Morin, F. Arnaud, M. Woo, A. Poncet, P. Stolk
{"title":"Electrical characterization and mechanical modeling of process induced strain in 65 nm CMOS technology","authors":"C. Ortolland, S. Orain, J. Rosa, P. Morin, F. Arnaud, M. Woo, A. Poncet, P. Stolk","doi":"10.1109/ESSDER.2004.1356508","DOIUrl":"https://doi.org/10.1109/ESSDER.2004.1356508","url":null,"abstract":"In this paper, we present a study of the effects of strained contact etch stop layer on 65 nm CMOS transistor performance. It is found that the nitride layer above the transistor can improve the transistor drive current by 8.5% for NMOS and 6% for PMOS. By combining a complete electrical analysis, mechanical modeling and quantum simulations, we have obtained a detailed understanding of how transistor layout rules influence the strain enhancements.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130509768","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
B. de Jaeger, M. Houssa, A. Satta, S. Kubicek, P. Verheyen, J. Van Steenbergen, J. Croon, B. Kaczer, S. Van Elshocht, A. Delabie, E. Kunnen, E. Sleeckx, I. Teerlinck, R. Lindsay, T. Schram, T. Chiarella, R. Degraeve, T. Conard, J. Poortmans, G. Winderickx, W. Boullart, M. Schaekers, P. Mertens, M. Caymax, W. Vandervorst, E. Van Moorhem, S. Biesemans, K. De Meyer, L. Ragnarsson, S. Lee, G. Kota, G. Raskin, P. Mijlemans, J. Autran, V. Afanas’ev, A. Stesmans, M. Meuris, M. Heyns
{"title":"Ge deep sub-micron pFETs with etched TaN metal gate on a high-k dielectric, fabricated in a 200mm silicon prototyping line","authors":"B. de Jaeger, M. Houssa, A. Satta, S. Kubicek, P. Verheyen, J. Van Steenbergen, J. Croon, B. Kaczer, S. Van Elshocht, A. Delabie, E. Kunnen, E. Sleeckx, I. Teerlinck, R. Lindsay, T. Schram, T. Chiarella, R. Degraeve, T. Conard, J. Poortmans, G. Winderickx, W. Boullart, M. Schaekers, P. Mertens, M. Caymax, W. Vandervorst, E. Van Moorhem, S. Biesemans, K. De Meyer, L. Ragnarsson, S. Lee, G. Kota, G. Raskin, P. Mijlemans, J. Autran, V. Afanas’ev, A. Stesmans, M. Meuris, M. Heyns","doi":"10.1109/ESSDER.2004.1356521","DOIUrl":"https://doi.org/10.1109/ESSDER.2004.1356521","url":null,"abstract":"We report for the first time on deep sub-micron Ge pFETs with physical gate lengths down to 0.151 /spl mu/m. The devices are made using a silicon-like process flow, with a directly etched gate stack consisting of TaN gate on an ALD or MOCVD HfO/sub 2/ dielectric. Promising drive currents are found. Various issues such as the severe short channel effects (SCE), the increased diode leakage compared to Si and the high amount of interface states (N/sub it/) are addressed. The need for an alternative Ge substrate pre-treatment and subsequent high-k gate dielectric deposition to push EOT values below 1 nm is illustrated.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"2011 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121545564","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}