Jan Genoe, S. Steudel, S. De Vusser, S. Verlaak, D. Janssen, P. Heremans
{"title":"Bias stress in pentacene transistors measured by four probe transistor structures","authors":"Jan Genoe, S. Steudel, S. De Vusser, S. Verlaak, D. Janssen, P. Heremans","doi":"10.1109/ESSDER.2004.1356577","DOIUrl":"https://doi.org/10.1109/ESSDER.2004.1356577","url":null,"abstract":"This paper deals with operational lifetime measurements of organic field-effect transistors. The organic semiconductor under study is pentacene. We apply DC stress conditions on these structures, and monitor the output characteristics of the TFTs during stress as well as during recovery after stress. The transistor structures have been modified to incorporate two voltage-measurement probes in the channel in addition to the source and drain contacts. This results in a 4-probe configuration, that allows us to measure the voltage drop in the intrinsic transistor channel separately from the voltage drop over the source and the drain contact regions. This phenomenological study is a first step towards a comprehensive model for degradation of bias stress in organic field-effect transistors.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"50 220","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113961158","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
M. Stadele, R. J. Luyken, M. Roosz, M. Specht, W. Rosner, L. Dreeskornfeld, J. Hartwich, F. Hofmann, J. Kretz, E. Landgraf, L. Risch
{"title":"A comprehensive study of corner effects in tri-gate transistors","authors":"M. Stadele, R. J. Luyken, M. Roosz, M. Specht, W. Rosner, L. Dreeskornfeld, J. Hartwich, F. Hofmann, J. Kretz, E. Landgraf, L. Risch","doi":"10.1109/ESSDER.2004.1356515","DOIUrl":"https://doi.org/10.1109/ESSDER.2004.1356515","url":null,"abstract":"We have performed extensive 2D and 3D device simulations to assess the impact of gate and drain voltages, channel doping, discrete impurity effects, and the device dimensions on the electron density accumulation in the corner regions of tri-gate transistors. For channel doping concentrations higher than 10/sup 18/ cm/sup -3/, these 'corner effects' are found to dominate the device behavior. They are most pronounced in the subthreshold regime and significantly reduced in short devices with rounded corners, thin gate oxides, and narrow channels.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"80 11-12","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134362764","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
R. Clerc, M. Ferrier, F. Daugé, G. Ghibaudo, F. Boeuf, T. Skotnicki
{"title":"Investigations on possible occurrence of ballistic transport in different NMOS architectures","authors":"R. Clerc, M. Ferrier, F. Daugé, G. Ghibaudo, F. Boeuf, T. Skotnicki","doi":"10.1109/ESSDER.2004.1356533","DOIUrl":"https://doi.org/10.1109/ESSDER.2004.1356533","url":null,"abstract":"This paper examines the performance of different NMOS devices (strained and unstrained bulk silicon, undoped single gate and double gate strained or unstrained SOI or SON devices) in the full ballistic regime of transport. The realism of this full ballistic transport assumption is also discussed, showing that even considering the most challenging structures, full ballistic transport will probably not be reached until channel length is lower than 10 nm.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133043245","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Space-charge-limited current conductions in La/sub 2/O/sub 3/ thin films deposited by e-beam evaporation after low temperature dry-nitrogen annealing [gate oxide applications]","authors":"Y. Kim, S. Ohmi, K. Tsutsui, H. Iwai","doi":"10.1109/ESSDER.2004.1356493","DOIUrl":"https://doi.org/10.1109/ESSDER.2004.1356493","url":null,"abstract":"Lanthanum oxide (La/sub 2/O/sub 3/) was deposited by e-beam evaporation on n-Si(100), and annealed at 200/spl deg/C in dry-nitrogen ex-situ for 5 min. From the applied voltage and temperature dependences of the current of the gate oxide, it has been shown that the main conduction mechanisms are SCLC (space-charge-limited current) and Schottky conductions at low and high applied voltages, respectively. Trap levels in the oxide band gap, composed of both exponential and localized distributions, were extracted by using the differential method. The dielectric constant obtained from Schottky conduction was 27 and was consistent with the C-V results.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"150 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130374045","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Vertical tunnel field-effect transistor with bandgap modulation and workfunction engineering","authors":"K. Bhuwalka, J. Schulze, I. Eisele","doi":"10.1109/ESSDER.2004.1356534","DOIUrl":"https://doi.org/10.1109/ESSDER.2004.1356534","url":null,"abstract":"A MBE grown vertical tunnel FET, based on band-to-band tunneling, has already been proposed. Based on Si, it showed some remarkable properties. However, it failed to meet the technology requirements in terms of on-current and threshold voltage. Improvement in the n-channel device performance by bandgap modulation at the tunneling junction using a thin /spl delta/p/sup +/ SiGe layer has been shown. However, as the germanium mole fraction is increased in SiGe, even though the on-current threshold voltage and sub-threshold swing, S, all show improved behavior, the leakage current is seen to increase significantly as tunneling probability becomes significant even at zero gate bias. In this work, we further present the improvement in the device performance using gate workfunction engineering along with bandgap modulation at the tunnel junction. As bandgap modulation leads to improved S and can be scaled to below 60 mV/dec independent of temperature we show, by means of 2D computer simulations, that it is possible to achieve very low off-currents and very high on-currents for the tunnel FET.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123175558","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
F. Zappa, S. Tisa, A. Gulinatti, A. Gallivanoni, S. Cova
{"title":"Monolithic CMOS detector module for photon counting and picosecond timing","authors":"F. Zappa, S. Tisa, A. Gulinatti, A. Gallivanoni, S. Cova","doi":"10.1109/ESSDER.2004.1356559","DOIUrl":"https://doi.org/10.1109/ESSDER.2004.1356559","url":null,"abstract":"A monolithic optoelectronic module for counting and timing single optical photons has been designed and fabricated in CMOS technology. It integrates a single-photon avalanche diode (SPAD) of 12 /spl mu/m-diameter with a complete active-quenching and active-reset circuit. The detector operates in Geiger-mode biased above breakdown level, with overvoltage adjustable up to 20 V. The on-chip electronics detects the rise of the current triggered by a photogenerated carrier, then swiftly quenches the avalanche by controlling the SPAD bias voltage, and finally resets the detector after a hold-off time (adjustable from 0 to 350 ns). In a chip of 700 /spl mu/m/spl times/1,000 /spl mu/m, the overall performance is comparable or better than that of macroscopic modules available from leading industries.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"158 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125189680","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Influence of self heating in a BiCMOS on SOI technology","authors":"E. Haralson, B. Malm, T. Johansson, M. Ostling","doi":"10.1109/ESSDER.2004.1356558","DOIUrl":"https://doi.org/10.1109/ESSDER.2004.1356558","url":null,"abstract":"Self heating in a 0.25 /spl mu/m BiCMOS technology, with different isolation structures, is characterized. Thermal resistance values for single- and multiple-emitter devices are extracted and reported. The dependence of the thermal resistance on the emitter aspect ratio is critical to take into consideration when determining the isolation scheme for devices. 2D electro-thermal simulations are performed and compared to experimental results. The impact of metallization on the self-heating in the device is examined through simulations.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"36 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129328050","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Mobility issues in ultra-thin SOI MOSFETs: thickness variations, GIFBE and coupling effects","authors":"A. Ohata, M. Cassé, S. Cristoloveanu, T. Poiroux","doi":"10.1109/ESSDER.2004.1356500","DOIUrl":"https://doi.org/10.1109/ESSDER.2004.1356500","url":null,"abstract":"The impact of film thickness variation and ultrathin gate oxide on the carrier mobility is investigated in 10-15 nm thick SOI MOSFETs. Once the parasitic resistance effect was eliminated, the mobility is independent of SOI thickness. A difference between front and back channel mobility is observed and discussed. In SOI MOSFETs with ultra-thin gate oxide, gate-induced floating body effects occur, leading to mobility overestimation, in particular at low temperature. In ultra-thin SOI films, super-coupling between the front and back channels can also be responsible for a mobility misevaluation.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"115 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121961758","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
R. El Farhane, A. Pouydebasque, C. Laviron, P. Morin, F. Arnaud, P. Stolk, F. Boeuf, T. Skotnicki, D. Bensahel, A. Halimaoui
{"title":"Successful integration of an ultra low thermal budget process solution based on solid phase epitaxy for sub-50nm CMOS technologies","authors":"R. El Farhane, A. Pouydebasque, C. Laviron, P. Morin, F. Arnaud, P. Stolk, F. Boeuf, T. Skotnicki, D. Bensahel, A. Halimaoui","doi":"10.1109/ESSDER.2004.1356507","DOIUrl":"https://doi.org/10.1109/ESSDER.2004.1356507","url":null,"abstract":"We demonstrate in this paper the viability of an ultra-low thermal budget CMOS process enabling the formation of ultra shallow junctions with competitive transistor characteristics. In particular, it is shown that the use of self-amorphizing implants for the source/drain (S/D) leads to a good transistor performance without significantly deteriorating the diode leakage. Moreover, it is proved that specific attention must be paid to salicidation with an ultra low thermal budget. Since the highest temperature used after gate definition is 700/spl deg/C, this process is perfectly suitable for the integration of temperature sensitive modules such as high-k dielectrics, metal gates or strained channels.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"74 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131728387","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
K. Akarvardar, S. Cristoloveanu, P. Gentil, B. Blalock, B. Dufrene, M. Mojarradi
{"title":"Depletion-all-around in SOI G/sup 4/-FETs: a conduction mechanism with high performance","authors":"K. Akarvardar, S. Cristoloveanu, P. Gentil, B. Blalock, B. Dufrene, M. Mojarradi","doi":"10.1109/ESSDER.2004.1356528","DOIUrl":"https://doi.org/10.1109/ESSDER.2004.1356528","url":null,"abstract":"Only in 4-gate SOI transistors (G/sup 4/-FETs) can the channel be surrounded by depletion regions induced by independent vertical MOS gates and lateral JFET gates. The majority carriers flow in the film volume, far from interfaces and junctions. We show that inversion layers, formed at the front and back interface, enable the junction gates to have enhanced control on the volume channel. High performance is experimentally demonstrated in terms of transconductance, subthreshold swing and g/sub m//I/sub d/ ratio. The basic mechanism, which involves a specific 2D gate coupling, is explained with a simple analytical model and simulations.","PeriodicalId":287103,"journal":{"name":"Proceedings of the 30th European Solid-State Circuits Conference (IEEE Cat. No.04EX850)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2004-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124029178","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}