Digest of Papers. Microprocesses and Nanotechnology 2001. 2001 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.01EX468)最新文献

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CMOS design challenges to power wall CMOS设计面临功率墙的挑战
T. Kuroda
{"title":"CMOS design challenges to power wall","authors":"T. Kuroda","doi":"10.1109/IMNC.2001.984030","DOIUrl":"https://doi.org/10.1109/IMNC.2001.984030","url":null,"abstract":"CMOS power dissipation has been increasing due to the increase in power density. The power dissipation increased fourfold every three years until the early 1990's, due to a constant voltage scaling. Recently, a constant field scaling has been applied to reduce power dissipation, where the power density is increased proportional to the 0.7th power of scaling factor, resulting in power increase by twice every 6.5 years. It is considered that the power dissipation of CMOS chips will steadily be increased as a natural result of device scaling. Technology scaling will become difficult due to the power wall. On the other hand, future computer and communications technology will require further reduction in power dissipation. Since no new energy efficient device technology is on the horizon, low power CMOS design should be challenged. This paper discusses what and how much designers can do for CMOS power reduction.","PeriodicalId":202620,"journal":{"name":"Digest of Papers. Microprocesses and Nanotechnology 2001. 2001 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.01EX468)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129657134","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 45
Synchrotron radiation micro lithography and etching (SMILE) for MEMS fabrication 用于MEMS制造的同步辐射微光刻和蚀刻(SMILE)
S. Sugiyama
{"title":"Synchrotron radiation micro lithography and etching (SMILE) for MEMS fabrication","authors":"S. Sugiyama","doi":"10.1109/IMNC.2001.984190","DOIUrl":"https://doi.org/10.1109/IMNC.2001.984190","url":null,"abstract":"High aspect ratio microstructure technology (HARMST) is an important technology in order to realize 3-D MEMS. Fine scale HARMST enables processing on a sub-micron scale. If this process is made practicable, application of MEMS can be extended to the optical wavelength region. We are studying two approaches of HARMST using synchrotron radiation microlithography and etching (SMILE) techniques.","PeriodicalId":202620,"journal":{"name":"Digest of Papers. Microprocesses and Nanotechnology 2001. 2001 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.01EX468)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130674850","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Field emission from nano-protrusion fabricated using nano-stamp technique 利用纳米印记技术制备纳米突起的场发射
A. Baba, K. Tsubaki, T. Asano
{"title":"Field emission from nano-protrusion fabricated using nano-stamp technique","authors":"A. Baba, K. Tsubaki, T. Asano","doi":"10.1109/IMNC.2001.984157","DOIUrl":"https://doi.org/10.1109/IMNC.2001.984157","url":null,"abstract":"In this paper, we report the fabrication of aligned nano-protrusion using a nano-stamp technique. The field emission characteristic from the nano-protrusion array also reports.","PeriodicalId":202620,"journal":{"name":"Digest of Papers. Microprocesses and Nanotechnology 2001. 2001 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.01EX468)","volume":"613 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123267801","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Monte Carlo simulation of substrate photoelectrons in hard X-ray lithography and the effect of buffer layer 硬x射线光刻中衬底光电子的蒙特卡罗模拟及缓冲层的影响
In-Beom Park, O. Kim
{"title":"Monte Carlo simulation of substrate photoelectrons in hard X-ray lithography and the effect of buffer layer","authors":"In-Beom Park, O. Kim","doi":"10.1109/IMNC.2001.984130","DOIUrl":"https://doi.org/10.1109/IMNC.2001.984130","url":null,"abstract":"Hard X-ray lithography was introduced for 50 nm generation and beyond due to its shorter wavelength and higher resolution than the soft X-ray (Khan et al, 1999). Photoelectron blur increases in hard X-ray lithography because more photo and Auger electrons are generated at the resist-substrate interface and the resist photoabsorption decreases as photon energy increases from soft X-ray to hard X-ray. This blur, due to secondary electrons at the line edge, is considered to cause pattern degradation. In this paper, Monte Carlo simulation of photo and Auger electrons for this harder spectrum of 2.36 keV average energy was carried out based on Murata's model (Murata et al, IEEE Trans. Electron Dev. vol. ED-32, p. 1694, 1985) and the work of Seo et al (J. Vac. Sci. Technol. B vol. 18, no. 6, p. 3349, 2000). Energy loss density and electron trajectories for 200,000 photons were calculated and plotted in a 200 nm thick TDUR-N908 resist on a W and Si substrate without a buffer layer and with buffer layers of various thickness (Si/sub 3/N/sub 4/ and SiO/sub 2/) on a W substrate between resist and substrate. The buffer layers are 10 nm buffer (10 nm Si/sub 3/N/sub 4/), 30 nm buffer (10 nm Si/sub 3/N/sub 4/+20 nm SiO/sub 2/) and 70nm buffer (10 nm Si/sub 3/N/sub 4/+60 nm SiO/sub 2/).","PeriodicalId":202620,"journal":{"name":"Digest of Papers. Microprocesses and Nanotechnology 2001. 2001 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.01EX468)","volume":"67 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114774830","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Characteristics of optical thin film filters containing nanometer-size particles 含有纳米级粒子的光学薄膜滤光片的特性
S. Nonaka, T. Suda, H. Oda
{"title":"Characteristics of optical thin film filters containing nanometer-size particles","authors":"S. Nonaka, T. Suda, H. Oda","doi":"10.1109/IMNC.2001.984162","DOIUrl":"https://doi.org/10.1109/IMNC.2001.984162","url":null,"abstract":"In this study, several kinds of single-layer optical thin film filters which contain many nanometer-size particles are analyzed by solving Maxwell equations. Typical characteristics of the filters are disclosed, taking into considerations of both effects of surface plasmon and polariton in the nano-particles and polariton in the dielectric thin film; especially the very narrow bandpass property. These significant features are reduced to dipole plasmon and polariton resonances of the nano particles and the layer.","PeriodicalId":202620,"journal":{"name":"Digest of Papers. Microprocesses and Nanotechnology 2001. 2001 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.01EX468)","volume":"114 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122056650","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Fabrication of channel waveguides in 2D photonic crystals of Si nanopillars 硅纳米柱二维光子晶体中通道波导的制备
T. Tada, V. Poborchii, T. Kanayama
{"title":"Fabrication of channel waveguides in 2D photonic crystals of Si nanopillars","authors":"T. Tada, V. Poborchii, T. Kanayama","doi":"10.1109/IMNC.2001.984202","DOIUrl":"https://doi.org/10.1109/IMNC.2001.984202","url":null,"abstract":"Photonic crystals (PCs) consist of periodic dielectric structures, which produce photonic band gaps (PBGs) where propagation of light is forbidden. PCs have inspired great interest because they can be applied for a lot of attractive optical devices such as lossless dielectric mirrors and resonant cavities. One of the promising applications is an optical waveguide composed of a line defect in PC. Introduction of a line defect gives rise to a localized defect state in the PBG, where the light is allowed to propagate. Thus the line defect acts as an optical waveguide. Here we present the fabrication of channel waveguides in 2D photonic crystals of Si nanopillars and their optical properties.","PeriodicalId":202620,"journal":{"name":"Digest of Papers. Microprocesses and Nanotechnology 2001. 2001 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.01EX468)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129815222","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Approaching to chemical stability of embedded material for attenuated phase-shifting mask and application of high transmittance AttPSM for sub-0.1 /spl mu/m contact hole pattern in 193 nm lithography 衰减相移掩模埋入材料的化学稳定性探讨及193nm光刻中0.1 /spl μ m以下接触孔模式高透射率AttPSM的应用
Cheng‐Ming Lin
{"title":"Approaching to chemical stability of embedded material for attenuated phase-shifting mask and application of high transmittance AttPSM for sub-0.1 /spl mu/m contact hole pattern in 193 nm lithography","authors":"Cheng‐Ming Lin","doi":"10.1109/IMNC.2001.984128","DOIUrl":"https://doi.org/10.1109/IMNC.2001.984128","url":null,"abstract":"In order to provide good resolution enhancing efficiency and productivity, embedded materials for phase shifting masks must meet many criteria, including phase shift of 180°, exposure durability (Smith et al, 1996), etc. However, the most important property of embedded materials is chemical stability, including cleaning, exposure and environmental durability. We develop the correlation between chemical compositions and sputtering conditions of thin films for approaches to embedded materials with better chemical stability. This paper reports the utilization of AlSi/sub x/O/sub y/ as a new bi-layer high transmittance (T⩾15%) embedded material for attenuated phase-shifting mask (AttPSM) in 193 nm.","PeriodicalId":202620,"journal":{"name":"Digest of Papers. Microprocesses and Nanotechnology 2001. 2001 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.01EX468)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121208570","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Preparation of thick PZT film by electrostatic spray deposition (ESD) for the application in micro-system technology 应用静电喷涂沉积(ESD)制备厚PZT薄膜用于微系统技术
Jian Lu, J. Chu, Wenhao Huang, Zhimin Ping
{"title":"Preparation of thick PZT film by electrostatic spray deposition (ESD) for the application in micro-system technology","authors":"Jian Lu, J. Chu, Wenhao Huang, Zhimin Ping","doi":"10.1109/IMNC.2001.984159","DOIUrl":"https://doi.org/10.1109/IMNC.2001.984159","url":null,"abstract":"As one of the most useful functional materials, PZT films are of great interest in micro-systems for the fabrication of microsensors and microactuators. In this paper, we introduce a new deposition method for thick PZT film preparation, named \"electrostatic spray deposition (ESD)\", using sol-gel solution as precursors. It offers the advantages of high film growth rate, easy control of film compositions, simple setup and low cost. Our results proved that it is a promising method for thick PZT film preparation with relatively good piezoelectric properties.","PeriodicalId":202620,"journal":{"name":"Digest of Papers. Microprocesses and Nanotechnology 2001. 2001 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.01EX468)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121219163","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Analysis of resist LER for the patterns replicated by proximity X-ray lithography 近距离x射线光刻复制图案的抗蚀剂LER分析
Y. Kikuchi, T. Taguchi, H. Matsunaga
{"title":"Analysis of resist LER for the patterns replicated by proximity X-ray lithography","authors":"Y. Kikuchi, T. Taguchi, H. Matsunaga","doi":"10.1109/IMNC.2001.984192","DOIUrl":"https://doi.org/10.1109/IMNC.2001.984192","url":null,"abstract":"The critical dimensions (CD) of LSI patterns are becoming 100 nm and narrower, and the requirement for CD control in lithography is becoming less than 10 nm. At such dimensions line edge roughness (LER) of resist patterns cannot be overlooked. This paper discusses the dependence of pattern image on LER, by comparison of observed roughness and measured dissolution rates of experimental resists with calculated images.","PeriodicalId":202620,"journal":{"name":"Digest of Papers. Microprocesses and Nanotechnology 2001. 2001 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.01EX468)","volume":"75 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128173926","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Resolution of 1:1 electron stepper lithography based on patterned cold cathode 基于图案化冷阴极的1:1电子步进光刻分辨率
H. Hongo, Y. Ochiai, H. Kawaura
{"title":"Resolution of 1:1 electron stepper lithography based on patterned cold cathode","authors":"H. Hongo, Y. Ochiai, H. Kawaura","doi":"10.1109/IMNC.2001.984061","DOIUrl":"https://doi.org/10.1109/IMNC.2001.984061","url":null,"abstract":"Feasibility of 1:1 electron stepper lithography based on a patterned cold cathode is investigated. The beam spread of electrons emitted from a metal-insulator-semiconductor (MIS) cold cathode was estimated to be approximately 23 nm. Therefore, the electron stepper lithography method should achieve a resolution below 50 nm.","PeriodicalId":202620,"journal":{"name":"Digest of Papers. Microprocesses and Nanotechnology 2001. 2001 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.01EX468)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127317998","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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