用于MEMS制造的同步辐射微光刻和蚀刻(SMILE)

Digest of Papers. Microprocesses and Nanotechnology 2001. 2001 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.01EX468) Pub Date : 2001-10-31 DOI:10.1109/IMNC.2001.984190

S. Sugiyama

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引用次数: 6

摘要

高纵横比微结构技术是实现三维微机电系统的一项重要技术。精细尺度HARMST能够在亚微米尺度上进行加工。如果该工艺可行，MEMS的应用可以扩展到光波长区域。我们正在研究同步辐射微光刻和蚀刻(SMILE)技术的两种方法。

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Synchrotron radiation micro lithography and etching (SMILE) for MEMS fabrication

High aspect ratio microstructure technology (HARMST) is an important technology in order to realize 3-D MEMS. Fine scale HARMST enables processing on a sub-micron scale. If this process is made practicable, application of MEMS can be extended to the optical wavelength region. We are studying two approaches of HARMST using synchrotron radiation microlithography and etching (SMILE) techniques.

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Digest of Papers. Microprocesses and Nanotechnology 2001. 2001 International Microprocesses and Nanotechnology Conference (IEEE Cat. No.01EX468)

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