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2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)最新文献

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Distributed face cooling scheme for tiny laser power scale-up 微型激光功率放大的分布式面冷却方案
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI: 10.23919/LTB-3D.2017.7947404
A. Kausas, Lihe Zheng, T. Taira
{"title":"Distributed face cooling scheme for tiny laser power scale-up","authors":"A. Kausas, Lihe Zheng, T. Taira","doi":"10.23919/LTB-3D.2017.7947404","DOIUrl":"https://doi.org/10.23919/LTB-3D.2017.7947404","url":null,"abstract":"In this work, we have compared the performance of single rod crystal to a newly developed Distributed Face Cooling (DFC) structure which was made by surface activated bonding technology and allowed to combine transparent heatsink to a gain crystal at room temperature. The Sapphire and Nd3+:YAG crystal plates were combined in this fashion to produce nine crystal chip which was further used to obtain CW output. Slope efficiencies obtained in this experiment were 27% and 64% for single rod and DFC structure, respectively. This is the first demonstration of distributed face cooling system outperformed conventionally single rod system.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"67 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121262319","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Temporary wafer carrier for thin wafer handling 用于薄晶片搬运的临时晶片载体
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI: 10.23919/LTB-3D.2017.7947457
V. Masteika, T. Rogers, R. Santilli
{"title":"Temporary wafer carrier for thin wafer handling","authors":"V. Masteika, T. Rogers, R. Santilli","doi":"10.23919/LTB-3D.2017.7947457","DOIUrl":"https://doi.org/10.23919/LTB-3D.2017.7947457","url":null,"abstract":"We present a novel design of re-usable wafer carrier for safe manual or robotic handling of wafers from tens of μm in thickness. The carrier wafer stack then remains stable through a wide variety temperature, pressure and chemical environments. The carried wafer can then be easily debonded in a bespoke debonding tool with no residue or cleaning steps.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"285 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123830374","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Low temperature Cu/In bonding for 3D integration 低温Cu/In键合用于3D集成
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI: 10.23919/LTB-3D.2017.7947413
I. Panchenko, Steffen Bickel, Jörg Meyer, Maik Müller, J. Wolf
{"title":"Low temperature Cu/In bonding for 3D integration","authors":"I. Panchenko, Steffen Bickel, Jörg Meyer, Maik Müller, J. Wolf","doi":"10.23919/LTB-3D.2017.7947413","DOIUrl":"https://doi.org/10.23919/LTB-3D.2017.7947413","url":null,"abstract":"This study represents the results of Cu/In bonding based on solid-liquid interdiffusion (SLID) principle for 3D integration. Fine-pitch interconnects were successfully fabricated at the bonding temperature of 170 °C. The final microstructure of the interconnects consists of Cu and Cu/In intermetallic compounds (IMCs) and it is described in detail. The influence of the isothermal storage on the microstructure development is investigated as well.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130983358","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Effects of electromagnetic radiation exposure on direct Cu bonding 电磁辐射暴露对铜直接键合的影响
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI: 10.23919/LTB-3D.2017.7947439
Jenn-Ming Song, Sin-Yong Liang, Po-Hao Chiang, Shang-Kun Huang, Y. Chiu, D. Tarng, C. Hung
{"title":"Effects of electromagnetic radiation exposure on direct Cu bonding","authors":"Jenn-Ming Song, Sin-Yong Liang, Po-Hao Chiang, Shang-Kun Huang, Y. Chiu, D. Tarng, C. Hung","doi":"10.23919/LTB-3D.2017.7947439","DOIUrl":"https://doi.org/10.23919/LTB-3D.2017.7947439","url":null,"abstract":"An innovative pre-treatment to enhance Cu-to-Cu bonding through the exposure of electromagnetic radiations including flash light and near infrared rays is first proposed in this study. Short period of electromagnetic radiation exposure can significantly improve the bonding strength. It can be ascribed to the sudden heating/cooling and thus compressive residual stresses which enhance the diffusion of copper atoms and direct bonding.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116311115","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Stacking wafer with multi-stepped silicon micro-trenches to deposit superconducting material for magnetic energy storage 用多级硅微沟槽堆叠晶片，沉积超导材料，用于磁能存储
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI: 10.23919/LTB-3D.2017.7947453
C. Hsu, S. Kumagai, M. Sasaki, Y. Suzuki, T. Hioki, J. Noh, O. Takai, H. Watanabe, H. Doy, T. Motohiro
{"title":"Stacking wafer with multi-stepped silicon micro-trenches to deposit superconducting material for magnetic energy storage","authors":"C. Hsu, S. Kumagai, M. Sasaki, Y. Suzuki, T. Hioki, J. Noh, O. Takai, H. Watanabe, H. Doy, T. Motohiro","doi":"10.23919/LTB-3D.2017.7947453","DOIUrl":"https://doi.org/10.23919/LTB-3D.2017.7947453","url":null,"abstract":"A 45m-long spiral trench is fabricated as the coil mold for the compact superconducting magnetic energy storage. Multiple patterning can reduce the disconnection caused by the defects. The wafers are polished. Single NbN coil is confirmed to show the superconducting performance.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114441091","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Gas cluster ion beam irradiation for wafer bonding 气团离子束辐照用于晶圆键合
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI: 10.23919/LTB-3D.2017.7947401
N. Toyoda, Tomoya Sasaki, S. Ikeda, I. Yamada
{"title":"Gas cluster ion beam irradiation for wafer bonding","authors":"N. Toyoda, Tomoya Sasaki, S. Ikeda, I. Yamada","doi":"10.23919/LTB-3D.2017.7947401","DOIUrl":"https://doi.org/10.23919/LTB-3D.2017.7947401","url":null,"abstract":"Preliminary experiments of gas cluster ion beam (GCIB) irradiation for wafer bonding were conducted. Unique irradiation effects of GCIB, such as low-damage irradiation and surface smoothing effects, will be beneficial for surface activated bonding. From XPS, AFM measurements, Ar-GCIB irradiation at oblique incidence removed native oxide on Cu films efficiently without roughening. Cu-Cu bond increased with the acceleration voltage of Ar-GCIB. There is a correlation between the bond strength and the contact angle reduction due to surface smoothing and oxide removal by Ar-GCIB.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134036700","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Feasibility study on ultrafine-pitch Cu-Cu bonding using directed self-assembly (DSA) 定向自组装超细间距Cu-Cu键合的可行性研究
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI: 10.23919/LTB-3D.2017.7947440
M. Murugesan, T. Fukushima, K. Mori, H. Hashimoto, J. Bea, M. Koyanagi
{"title":"Feasibility study on ultrafine-pitch Cu-Cu bonding using directed self-assembly (DSA)","authors":"M. Murugesan, T. Fukushima, K. Mori, H. Hashimoto, J. Bea, M. Koyanagi","doi":"10.23919/LTB-3D.2017.7947440","DOIUrl":"https://doi.org/10.23919/LTB-3D.2017.7947440","url":null,"abstract":"A feasibility study was carried out for self-formation of metal wiring between LSI chips containing ultrafine-pitch Cu landing pads by employing a new concept of directed self-assembly (DSA) phenomena. Preliminary results suggest that it is highly feasible to electrically interconnect two LSI chips having Cu landing pads at 3μm pitch interval. Electrical contact between the flip-chip bonded dies was self-formed by dispersed Sn nano-dots in PS-b-PMMA (2:1) copolymer mixture after vacuum annealing at 280 °C.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"411 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122865675","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Hydrogen radical treatment for surface oxide removal from copper 氢自由基法去除铜表面氧化物
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI: 10.23919/LTB-3D.2017.7947468
S. Shin, E. Higurashi, K. Furuyama, T. Suga
{"title":"Hydrogen radical treatment for surface oxide removal from copper","authors":"S. Shin, E. Higurashi, K. Furuyama, T. Suga","doi":"10.23919/LTB-3D.2017.7947468","DOIUrl":"https://doi.org/10.23919/LTB-3D.2017.7947468","url":null,"abstract":"Hydrogen radicals were used to remove the oxide layer of copper metal. Successful removal of the oxide layer was detected using X-ray photoelectron spectroscopy (XPS), where the visible color change has occurred after the treatment. Period of re-oxidization was further analyzed which then was compared to argon ion beam and fast atom beam (FAB) treatment. The approach has introduced a highly promising technique to remove oxide layers of metals.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126637124","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
N2-plasma activated bonding for GaInAsP/SOI hybrid lasers GaInAsP/SOI混合激光器的n2等离子体激活键合
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI: 10.23919/LTB-3D.2017.7947425
N. Nishiyama, Y. Hayashi, Jun-ichi Suzuki, S. Arai
{"title":"N2-plasma activated bonding for GaInAsP/SOI hybrid lasers","authors":"N. Nishiyama, Y. Hayashi, Jun-ichi Suzuki, S. Arai","doi":"10.23919/LTB-3D.2017.7947425","DOIUrl":"https://doi.org/10.23919/LTB-3D.2017.7947425","url":null,"abstract":"Bonding conditions and characteristics of N2-plasma activated bonding for GaInAsP/SOI hybrid lasers are explained. SEM and TEM images reveal high quality bonding interface and less damage quantum wells, which are enough to realize hybrid lasers.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114065700","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Automatic Maszara testing jig 自动Maszara测试夹具
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI: 10.23919/LTB-3D.2017.7947458
V. Masteika, T. Rogers, R. Santilli, S. Fraser, M. Y. A. Aioubi
{"title":"Automatic Maszara testing jig","authors":"V. Masteika, T. Rogers, R. Santilli, S. Fraser, M. Y. A. Aioubi","doi":"10.23919/LTB-3D.2017.7947458","DOIUrl":"https://doi.org/10.23919/LTB-3D.2017.7947458","url":null,"abstract":"We have produced a new, automated Maszara testing tool. This tool can be used to measure the bond strength across the entire interface of a bonded wafer pair and produce a bond strength map. The tool can also be used for IR inspection.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122148547","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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