V. Masteika, T. Rogers, R. Santilli, S. Fraser, M. Y. A. Aioubi
{"title":"自动Maszara测试夹具","authors":"V. Masteika, T. Rogers, R. Santilli, S. Fraser, M. Y. A. Aioubi","doi":"10.23919/LTB-3D.2017.7947458","DOIUrl":null,"url":null,"abstract":"We have produced a new, automated Maszara testing tool. This tool can be used to measure the bond strength across the entire interface of a bonded wafer pair and produce a bond strength map. The tool can also be used for IR inspection.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Automatic Maszara testing jig\",\"authors\":\"V. Masteika, T. Rogers, R. Santilli, S. Fraser, M. Y. A. Aioubi\",\"doi\":\"10.23919/LTB-3D.2017.7947458\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We have produced a new, automated Maszara testing tool. This tool can be used to measure the bond strength across the entire interface of a bonded wafer pair and produce a bond strength map. The tool can also be used for IR inspection.\",\"PeriodicalId\":183993,\"journal\":{\"name\":\"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"volume\":\"22 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2017-05-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/LTB-3D.2017.7947458\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/LTB-3D.2017.7947458","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
We have produced a new, automated Maszara testing tool. This tool can be used to measure the bond strength across the entire interface of a bonded wafer pair and produce a bond strength map. The tool can also be used for IR inspection.