用于薄晶片搬运的临时晶片载体

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2017-05-01 DOI:10.23919/LTB-3D.2017.7947457

V. Masteika, T. Rogers, R. Santilli

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引用次数: 0

摘要

我们提出了一种可重复使用的晶圆载体的新设计，用于安全地手动或机器人处理几十μm厚度的晶圆。然后，载体晶圆堆在各种温度、压力和化学环境下保持稳定。然后，携带的晶圆片可以在定制的脱粘工具中轻松脱粘，没有残留物或清洁步骤。

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Temporary wafer carrier for thin wafer handling

We present a novel design of re-usable wafer carrier for safe manual or robotic handling of wafers from tens of μm in thickness. The carrier wafer stack then remains stable through a wide variety temperature, pressure and chemical environments. The carried wafer can then be easily debonded in a bespoke debonding tool with no residue or cleaning steps.

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2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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