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2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)最新文献

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3-Layered Au/SiO2 hybrid bonding with 6-μm-pitch au electrodes for 3D structured image sensors 6 μm间距Au电极的3层Au/SiO2杂化键合用于三维结构图像传感器
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2016-08-24 DOI: 10.1149/07509.0103ECST
Y. Honda, M. Goto, T. Watabe, K. Hagiwara, M. Nanba, Y. Iguchi, T. Saraya, M. Kobayashi, E. Higurashi, H. Toshiyoshi, T. Hiramoto
{"title":"3-Layered Au/SiO2 hybrid bonding with 6-μm-pitch au electrodes for 3D structured image sensors","authors":"Y. Honda, M. Goto, T. Watabe, K. Hagiwara, M. Nanba, Y. Iguchi, T. Saraya, M. Kobayashi, E. Higurashi, H. Toshiyoshi, T. Hiramoto","doi":"10.1149/07509.0103ECST","DOIUrl":"https://doi.org/10.1149/07509.0103ECST","url":null,"abstract":"A three-layered daisy-chain test device in which each layer is electrically interconnected with 6-μm-pitch Au electrodes is fabricated using a direct-bonding technique. The experimental results show a series of electrical interconnections exceeding 986,000 contacts, with the Au contact resistance for a single connection being approximately 92.8 mΩ.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-08-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127614730","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Study on low temperature Cu bonding and temporary bond/de-bond for RDL-first fan-out panel level package RDL-first扇形面板级封装低温铜键合及临时键合/脱键的研究
2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 1900-01-01 DOI: 10.23919/LTB-3D.2017.7947414
C. Ko, Kai-Ming Yang, Jim-Wein Lin, Chih-Lun Wang, T. Chou, Yu-Tao Yang, Ting-Yang Yu, Yu-Hua Chen, Kuan-Neng Chen, T. Tseng
{"title":"Study on low temperature Cu bonding and temporary bond/de-bond for RDL-first fan-out panel level package","authors":"C. Ko, Kai-Ming Yang, Jim-Wein Lin, Chih-Lun Wang, T. Chou, Yu-Tao Yang, Ting-Yang Yu, Yu-Hua Chen, Kuan-Neng Chen, T. Tseng","doi":"10.23919/LTB-3D.2017.7947414","DOIUrl":"https://doi.org/10.23919/LTB-3D.2017.7947414","url":null,"abstract":"In this study, Cu-Cu bonding with pillar-concave structure on a polymer layer was investigated to realize better bonding quality at lower temperature, while a low-stress release layer for temporary bond and de-bond by laser ablation was demonstrated to handle a glass panel for re-distribution layer (RDL) process. The low temperature technology can be potentially applied for RDL-first fan-out panel level package (FOPLP).","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129793745","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
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