6 μm间距Au电极的3层Au/SiO2杂化键合用于三维结构图像传感器

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 2016-08-24 DOI:10.1149/07509.0103ECST

Y. Honda, M. Goto, T. Watabe, K. Hagiwara, M. Nanba, Y. Iguchi, T. Saraya, M. Kobayashi, E. Higurashi, H. Toshiyoshi, T. Hiramoto

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引用次数: 4

摘要

采用直接键合技术制备了三层雏菊链测试装置，雏菊链每层与6 μm间距的Au电极电互连。实验结果表明，一系列电互连超过986,000个触点，单个连接的Au触点电阻约为92.8 mΩ。

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3-Layered Au/SiO2 hybrid bonding with 6-μm-pitch au electrodes for 3D structured image sensors

A three-layered daisy-chain test device in which each layer is electrically interconnected with 6-μm-pitch Au electrodes is fabricated using a direct-bonding technique. The experimental results show a series of electrical interconnections exceeding 986,000 contacts, with the Au contact resistance for a single connection being approximately 92.8 mΩ.

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2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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