RDL-first扇形面板级封装低温铜键合及临时键合/脱键的研究

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Pub Date : 1900-01-01 DOI:10.23919/LTB-3D.2017.7947414

C. Ko, Kai-Ming Yang, Jim-Wein Lin, Chih-Lun Wang, T. Chou, Yu-Tao Yang, Ting-Yang Yu, Yu-Hua Chen, Kuan-Neng Chen, T. Tseng

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引用次数: 2

摘要

在本研究中，研究了在聚合物层上采用柱凹结构的Cu-Cu键合，以在较低温度下实现更好的键合质量，同时展示了一种用于激光烧蚀的临时键合和脱键的低应力释放层，以处理玻璃面板的再分布层(RDL)工艺。低温技术可以潜在地应用于RDL-first扇出面板级封装(FOPLP)。

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Study on low temperature Cu bonding and temporary bond/de-bond for RDL-first fan-out panel level package

In this study, Cu-Cu bonding with pillar-concave structure on a polymer layer was investigated to realize better bonding quality at lower temperature, while a low-stress release layer for temporary bond and de-bond by laser ablation was demonstrated to handle a glass panel for re-distribution layer (RDL) process. The low temperature technology can be potentially applied for RDL-first fan-out panel level package (FOPLP).

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来源期刊

2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)

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