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Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium最新文献

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Surface mount solder joint reliability controlling the thermal expansion 表面贴装焊点的热膨胀控制可靠
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI: 10.1109/EEMTS.1988.75955
W. Engelmaier
{"title":"Surface mount solder joint reliability controlling the thermal expansion","authors":"W. Engelmaier","doi":"10.1109/EEMTS.1988.75955","DOIUrl":"https://doi.org/10.1109/EEMTS.1988.75955","url":null,"abstract":"The reliability of the solder joints of surface-mounted assemblies is a continuing concern. This concern stems from the very complex and little understood nature of the interacting mechanisms underlying thermally induced solder joint fatigue combined with the highly varying nature of accelerated reliability testing and the frequently contradictory results. The nature of the problem is discussed. The different types of surface-mount attachments are highlighted in the context of accelerated reliability test results. Accelerated reliability test concerns are discussed and testing options given. Options for increased solder-joint reliability are also suggested.<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1988-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116711925","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Laser interconnections on silicon 硅上的激光互连
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI: 10.1109/EEMTS.1988.75941
G. Nicolas
{"title":"Laser interconnections on silicon","authors":"G. Nicolas","doi":"10.1109/EEMTS.1988.75941","DOIUrl":"https://doi.org/10.1109/EEMTS.1988.75941","url":null,"abstract":"Laser techniques for reconfiguration (i.e. cutting or linking) of aluminum conductors on silicon wafer-scale integrated circuits are discussed.<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1988-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122636438","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Sockets: considerations as an alternative to direct surface mounting of components 插座:考虑作为直接表面安装组件的替代方案
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI: 10.1109/EEMTS.1988.75962
P. Pellerite, D. Suhl
{"title":"Sockets: considerations as an alternative to direct surface mounting of components","authors":"P. Pellerite, D. Suhl","doi":"10.1109/EEMTS.1988.75962","DOIUrl":"https://doi.org/10.1109/EEMTS.1988.75962","url":null,"abstract":"Because the surface mounting process results in plastic package cracking, it has been suggested that sockets be used to avoid the problem. The authors examine the reliability of plastic leaded chip carriers (PLCCs) in two commonly used sockets. Components are found to have different planarity problems than are commonly found in surface-mount assembly. The engineering factors considered in choosing the appropriate leadframe material must change when sockets are used. There are also serious vibration-induced problems which limit the number of manufacturing application areas in which sockets may be of reliable use. Restraining clips placed over the devices were examined to determine if simple modifications could be implemented to improve the vibration-induced problems. Dissimilar coatings between the package leads and the socket contacts are examined and discussed, as is the environmental stress range over which these sockets are of practical use in a manufacturing environment.<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1988-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123393039","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Surface mounting: experiences in the telecommunication field 表面安装:有电信领域的经验
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI: 10.1109/EEMTS.1988.75956
G. Castelli, P. Costa
{"title":"Surface mounting: experiences in the telecommunication field","authors":"G. Castelli, P. Costa","doi":"10.1109/EEMTS.1988.75956","DOIUrl":"https://doi.org/10.1109/EEMTS.1988.75956","url":null,"abstract":"The authors' experience with surface-mounting technology (SMT) is discussed. Vapor phase reflow and wave soldering are considered as well as design rules, printed circuit boards, solder creams, and assembly. Emphasis is given to the correlation between process parameters and yields and it is shown how many standards that are peculiar to through hole mounting result in unacceptable yields for SMT assembly processes.<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1988-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129349621","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Manufacturing technology and the role of manufacturing research 制造技术与制造研究的作用
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI: 10.1109/EEMTS.1988.75968
A. J. Blodgett, B. Crowder
{"title":"Manufacturing technology and the role of manufacturing research","authors":"A. J. Blodgett, B. Crowder","doi":"10.1109/EEMTS.1988.75968","DOIUrl":"https://doi.org/10.1109/EEMTS.1988.75968","url":null,"abstract":"The complexity and the importance of manufacturing technologies and the role of manufacturing research in the advancement of technology are described. Leverage areas for timely introduction of products to manufacturing and scale-up to volume manufacturing are identified. Examples of several manufacturing research projects at IBM are given to illustrate key points.<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1988-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123573469","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Glass-ceramic on metal substrates for high performance packaging 用于高性能封装的金属基板玻璃陶瓷
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI: 10.1109/EEMTS.1988.75943
E. A. Logan, D. Holland, J. Thorp, G. Partridge
{"title":"Glass-ceramic on metal substrates for high performance packaging","authors":"E. A. Logan, D. Holland, J. Thorp, G. Partridge","doi":"10.1109/EEMTS.1988.75943","DOIUrl":"https://doi.org/10.1109/EEMTS.1988.75943","url":null,"abstract":"Several glass-ceramic on metal coatings have been evaluated to address the need for a high thermal conductivity substrate. The substrate materials have been chosen and processed to given them thermal expansion coefficients which are similar to that of silicon, thus avoiding the creation of stresses in the device during thermal cycling. The thermal expansion matching of the glass-ceramic to the metal is achieved by the controlled crystallization of phases of known thermal expansion coefficients. This has been confirmed by X-ray and microstructural examination of a lithium aluminosilicate type glass-ceramic on copper/Invar/copper and of a magnesium aluminosilicate type glass-ceramic on molybdenum and on tungsten give values for the relative permittivity of the glass-ceramic layer of 5.9 and 5.8 respectively and values for tan delta between 10/sup -3/ and 10/sup -2/.<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1988-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121171960","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Simulation and analysis of in-line thermal and microwave curing of TAB encapsulants TAB包封剂在线热和微波固化的仿真与分析
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI: 10.1109/EEMTS.1988.75951
R. Pennisi
{"title":"Simulation and analysis of in-line thermal and microwave curing of TAB encapsulants","authors":"R. Pennisi","doi":"10.1109/EEMTS.1988.75951","DOIUrl":"https://doi.org/10.1109/EEMTS.1988.75951","url":null,"abstract":"A commercially available epoxy encapsulant was crosslinked using several curing profiles. The thermal and dielectric properties were characterized during and after the curing process. The results were used to develop an efficient curing profile using inline infrared- and microwave-assisted curing ovens.<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"17 7","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1988-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114126711","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
High density interconnection for VLSI devices VLSI器件的高密度互连
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI: 10.1109/EEMTS.1988.75960
J. Ashe, S. Tyler
{"title":"High density interconnection for VLSI devices","authors":"J. Ashe, S. Tyler","doi":"10.1109/EEMTS.1988.75960","DOIUrl":"https://doi.org/10.1109/EEMTS.1988.75960","url":null,"abstract":"A brief review is given of current packaging technologies, including media and package formats. Esprit 958, a large-area multichip module, is described and its development outlined. Esprit 958's fabrication is detailed, a transmission-line analysis is presented, and electrical modeling and testing results are given. Also, thermal and environmental considerations are discussed.<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"120 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1988-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114333280","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Advances in IC packaging, interconnect and assembly 集成电路封装、互连和组装的进展
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1900-01-01 DOI: 10.1109/EEMTS.1988.75959
M. Sage
{"title":"Advances in IC packaging, interconnect and assembly","authors":"M. Sage","doi":"10.1109/EEMTS.1988.75959","DOIUrl":"https://doi.org/10.1109/EEMTS.1988.75959","url":null,"abstract":"The increases in size and density of ICs and how these significantly impact the current and widely used technologies of IC packaging, printed-circuit boards (PCBs) and hybrids are considered. Because these areas are reaching their technical and cost limits in advanced systems, novel technologies are needed to advance further. One such technology is the multichip module, a hybrid for wafer-scale integration. In multichip modules, rather than forcing PCB and thick-film technology to higher densities, IC manufacturing processes are used to bridge the feature size gap. The opportunity to purchase wafers and select good dies could make this technology a less expensive assembly approach than surface-mounting technology (SMT). The ability to mix IC technologies and exercise more efficient thermal management makes this development a major stepping stone towards wafer-scale integration. Emphasis is placed on its impact on the PCB and thick-film hybrid industries.<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121809524","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Hybrid circuit technology: the organization of an automatic manufacturing line 混合电路技术:组织一条自动化生产线
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1900-01-01 DOI: 10.1109/EEMTS.1988.75963
A. Stefano, R. Rino
{"title":"Hybrid circuit technology: the organization of an automatic manufacturing line","authors":"A. Stefano, R. Rino","doi":"10.1109/EEMTS.1988.75963","DOIUrl":"https://doi.org/10.1109/EEMTS.1988.75963","url":null,"abstract":"The main problems encountered during the definition of an automatic hybrid circuit manufacturing line are discussed. Different layouts are described; each solution has advantages and disadvantages. The choice has to be made according to the volumes, mix, and complexity of the products. Some standards of judgement are provided. A line designed and installed to produce large-volume, medium-mix automotive hybrid circuits is shown.<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127080183","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
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