Advances in IC packaging, interconnect and assembly

Abstract

The increases in size and density of ICs and how these significantly impact the current and widely used technologies of IC packaging, printed-circuit boards (PCBs) and hybrids are considered. Because these areas are reaching their technical and cost limits in advanced systems, novel technologies are needed to advance further. One such technology is the multichip module, a hybrid for wafer-scale integration. In multichip modules, rather than forcing PCB and thick-film technology to higher densities, IC manufacturing processes are used to bridge the feature size gap. The opportunity to purchase wafers and select good dies could make this technology a less expensive assembly approach than surface-mounting technology (SMT). The ability to mix IC technologies and exercise more efficient thermal management makes this development a major stepping stone towards wafer-scale integration. Emphasis is placed on its impact on the PCB and thick-film hybrid industries.<>