VLSI器件的高密度互连

Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI:10.1109/EEMTS.1988.75960

J. Ashe, S. Tyler

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引用次数: 3

摘要

简要回顾了当前的包装技术，包括媒体和包装格式。介绍了一种大面积多芯片模块Esprit 958，并概述了其发展概况。详细介绍了Esprit 958的制作过程，对其进行了传输在线分析，给出了电气建模和测试结果。此外，还讨论了热和环境方面的考虑。

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High density interconnection for VLSI devices

A brief review is given of current packaging technologies, including media and package formats. Esprit 958, a large-area multichip module, is described and its development outlined. Esprit 958's fabrication is detailed, a transmission-line analysis is presented, and electrical modeling and testing results are given. Also, thermal and environmental considerations are discussed.<>

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Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium

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