表面安装:有电信领域的经验

Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI:10.1109/EEMTS.1988.75956

G. Castelli, P. Costa

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引用次数: 0

摘要

讨论了作者在表面贴装技术(SMT)方面的经验。汽相回流焊和波峰焊被认为以及设计规则，印刷电路板，焊料膏和组装。重点讨论了工艺参数与良率之间的关系，并说明了通孔安装特有的许多标准导致SMT组装工艺的良率不可接受。

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Surface mounting: experiences in the telecommunication field

The authors' experience with surface-mounting technology (SMT) is discussed. Vapor phase reflow and wave soldering are considered as well as design rules, printed circuit boards, solder creams, and assembly. Emphasis is given to the correlation between process parameters and yields and it is shown how many standards that are peculiar to through hole mounting result in unacceptable yields for SMT assembly processes.<>

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Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium

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