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Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium最新文献

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Adhesive bonding of large surface mounted devices 大型表面安装装置的粘接
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI: 10.1109/EEMTS.1988.75958
J. Wondergem, R. Zwiers
{"title":"Adhesive bonding of large surface mounted devices","authors":"J. Wondergem, R. Zwiers","doi":"10.1109/EEMTS.1988.75958","DOIUrl":"https://doi.org/10.1109/EEMTS.1988.75958","url":null,"abstract":"Wave soldering of large surface-mounted devices requires special adhesives to hold the components position after placement, during transportation, and during the soldering process. The uncured adhesive has to withstand the shear stress on the uncured joint which results from the acceleration and deceleration of the substrates during transportation. The forces acting on components when they are handled are discussed. The friction force, the surface tension, and the yield stress of the adhesive can compensate for the shear stress. Adhesives with a high yield stress, although difficult to prepare and apply, are desirable in large-volume placement equipment.<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1988-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126841935","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Compound properties in correlation to dynamic-mechanical measurements of process regulated molding technology 与工艺调节成型工艺动态力学测量相关的复合性能
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI: 10.1109/EEMTS.1988.75949
G. Draeger, M. Maier, F. Quella
{"title":"Compound properties in correlation to dynamic-mechanical measurements of process regulated molding technology","authors":"G. Draeger, M. Maier, F. Quella","doi":"10.1109/EEMTS.1988.75949","DOIUrl":"https://doi.org/10.1109/EEMTS.1988.75949","url":null,"abstract":"The increasing demand for better reliability of encapsulated VLSI requires process-regulated manufacturing, which includes the rheology of materials and the design of the tool. Some typical examples for the optimization are given. For an evaluation of stress formation by different molding compounds, the suitability of shear modulus and thermal expansion, especially of their product vs. temperature, is discussed. The limitations of these values are shown and do some suggestions for the extension of the measurements e.g. to aging are made.<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1988-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129556965","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
The mechanism of plastic package cracking in SMT and two solutions SMT中塑料封装开裂的机理及两种解决方法
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI: 10.1109/EEMTS.1988.75972
D. Suhl, M. Kirloskar, T. Steiner
{"title":"The mechanism of plastic package cracking in SMT and two solutions","authors":"D. Suhl, M. Kirloskar, T. Steiner","doi":"10.1109/EEMTS.1988.75972","DOIUrl":"https://doi.org/10.1109/EEMTS.1988.75972","url":null,"abstract":"Package cracks due to the heat stress of surface mounting technology (SMT) procedures in low cost plastic packages present a severe long-term reliability hazard. It is shown that the dominant cracking mechanism is moisture expansion due to concentration of water vapor at the back surface of the die paddle, and at the front surface of the silicon die. Experimental results are used to discuss and compare each of the commonly assumed cracking mechanisms and to evaluate each solution for its probability of successfully eliminating the plastic-leaded chip-carrier cracking problem. Two methods which have vastly improved resistance to plastic package cracking are demonstrated. One is the elimination of the die paddle through the use of wire-bondable tape. The second is the use of lead-frame surface treatments prior to encapsulation to eliminate the moisture concentration at the backside of the die paddle.<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1988-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129999360","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
IC's manufacturing trends IC的制造趋势
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI: 10.1109/EEMTS.1988.75965
J. Lazzari
{"title":"IC's manufacturing trends","authors":"J. Lazzari","doi":"10.1109/EEMTS.1988.75965","DOIUrl":"https://doi.org/10.1109/EEMTS.1988.75965","url":null,"abstract":"Three concepts for clean rooms for manufacturing integrated circuits are discussed. These are a robotic cart system, a cassette track system, and the SMIF system, in which wafers are transported and loaded in tight boxes. The cart system is criticized as only slightly reducing the number of people in the clean room, and hence only slightly improving the cleanliness. The cassette track system is seen as a major improvement in cleanliness, but is not flexible; the SMIF system leaves particles in an electrostatic field to stick on the wafers. It is concluded that none of these technologies is ideal for clean-room manufacturing.<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"315 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1988-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127041155","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Experimental results for 100 mu m pitch TAB technology 100 μ m间距TAB技术的试验结果
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI: 10.1109/EEMTS.1988.75953
M. Sugimoto, T. Yoshida, Y. Sumi, H. Hasegawa, K. Wada
{"title":"Experimental results for 100 mu m pitch TAB technology","authors":"M. Sugimoto, T. Yoshida, Y. Sumi, H. Hasegawa, K. Wada","doi":"10.1109/EEMTS.1988.75953","DOIUrl":"https://doi.org/10.1109/EEMTS.1988.75953","url":null,"abstract":"Fine line, high pin count TAB (tape automated bonding) has been demonstrated using a 13-mm/sup 2/ test die with 100 mu m pitch, and 484 gold bumps. Gold-tin eutectic bonding was carried out on the test die for both ILB (inner lead bonding) and OLB (outer lead bonding).<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"164 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1988-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132087344","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Molded circuit interconnects: electronic packaging in the third dimension 模制电路互连:三维电子封装
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI: 10.1109/EEMTS.1988.75961
R. Zeiler
{"title":"Molded circuit interconnects: electronic packaging in the third dimension","authors":"R. Zeiler","doi":"10.1109/EEMTS.1988.75961","DOIUrl":"https://doi.org/10.1109/EEMTS.1988.75961","url":null,"abstract":"Molded circuit interconnects are high-performance injection-molded thermoplastic devices with electrical and mechanical functions, incorporating printed-circuit boards, chip carriers, connectors, and structural elements. The change from a flat board or ceramic substrate to a molded three-dimensional part permits more original packaging solutions, with less parts, less assembly steps and lower total system cost. Selection of the right thermoplast material allows high-temperature, high-frequency applications and use where high-speed signal transmission is important. Produced by injection molding and selectively metallized, the parts have precise circuit traces, holes, and shapes, which is especially important for surface mount device (SMD) applications; they also have all the flexibility and three-dimensional capabilities expected from the molding process. Recessed circuitry and chip placement allows low-profile, high-density circuits, including chip-on-board applications.<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1988-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132652077","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Think of relative TCR or tolerance instead of absolute 考虑相对TCR或容忍度而不是绝对容忍度
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI: 10.1109/EEMTS.1988.75944
C. Delautre
{"title":"Think of relative TCR or tolerance instead of absolute","authors":"C. Delautre","doi":"10.1109/EEMTS.1988.75944","DOIUrl":"https://doi.org/10.1109/EEMTS.1988.75944","url":null,"abstract":"It is pointed out that relative temperature coefficients of resistance (TCR) and/or tolerances of circuits should be specified rather than absolute TCRs lower than 50 p.p.m./ degrees C and absolute tolerances lower than +or-0.5%. This is in the interest of both supplier and customer. To illustrate this, very long-term results are given.<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"2014 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1988-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125684697","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Finite element analysis of microelectronic components-state of the art 微电子元件的有限元分析——最新进展
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI: 10.1109/EEMTS.1988.75954
A. Schaller
{"title":"Finite element analysis of microelectronic components-state of the art","authors":"A. Schaller","doi":"10.1109/EEMTS.1988.75954","DOIUrl":"https://doi.org/10.1109/EEMTS.1988.75954","url":null,"abstract":"The finite-element method has proven very effective in a variety of analyses in the electronics areas. As the components become more and more complex and are packed closer together in smaller volumes, the heat and vibration environments become more intense. Powerful general-purpose programs such as the ANSYS package that use the finite-element method provide engineers with a valuable simulation tool available on a wide range of computers, from PCs for linear statics and dynamics to supercomputers for 3-D fluid-flow analyses. The use of ANSYS is described for board-level simulation and analysis of free convection heat transfer in packaging.<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1988-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115223156","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
SMT-development and production of automotive electronics smt -汽车电子产品的开发和生产
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI: 10.1109/EEMTS.1988.75964
E. Preuss, H. Kinzler
{"title":"SMT-development and production of automotive electronics","authors":"E. Preuss, H. Kinzler","doi":"10.1109/EEMTS.1988.75964","DOIUrl":"https://doi.org/10.1109/EEMTS.1988.75964","url":null,"abstract":"Surface-mounting technology, using miniaturized components and fully mechanized insertion, has made a significant contribution to efforts to keep costs down, to improve quality, and to reduce size and weight of automotive electronics. The development of a trip computer for BMW cars shows clearly the improvements when compared with the first computer generation of 1980. There are significant reductions in the area of the printed board, the number of discrete components, the number of ICs, current consumption, and greater quality in the display (alphanumeric LCD vs. 7-segment LED) and adjustment (automated in software vs. hardware trimming).<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1988-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115998370","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Surface mount solder joint reliability controlling the thermal expansion 表面贴装焊点的热膨胀控制可靠
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI: 10.1109/EEMTS.1988.75955
W. Engelmaier
{"title":"Surface mount solder joint reliability controlling the thermal expansion","authors":"W. Engelmaier","doi":"10.1109/EEMTS.1988.75955","DOIUrl":"https://doi.org/10.1109/EEMTS.1988.75955","url":null,"abstract":"The reliability of the solder joints of surface-mounted assemblies is a continuing concern. This concern stems from the very complex and little understood nature of the interacting mechanisms underlying thermally induced solder joint fatigue combined with the highly varying nature of accelerated reliability testing and the frequently contradictory results. The nature of the problem is discussed. The different types of surface-mount attachments are highlighted in the context of accelerated reliability test results. Accelerated reliability test concerns are discussed and testing options given. Options for increased solder-joint reliability are also suggested.<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1988-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116711925","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
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