The mechanism of plastic package cracking in SMT and two solutions

D. Suhl, M. Kirloskar, T. Steiner
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引用次数: 3

Abstract

Package cracks due to the heat stress of surface mounting technology (SMT) procedures in low cost plastic packages present a severe long-term reliability hazard. It is shown that the dominant cracking mechanism is moisture expansion due to concentration of water vapor at the back surface of the die paddle, and at the front surface of the silicon die. Experimental results are used to discuss and compare each of the commonly assumed cracking mechanisms and to evaluate each solution for its probability of successfully eliminating the plastic-leaded chip-carrier cracking problem. Two methods which have vastly improved resistance to plastic package cracking are demonstrated. One is the elimination of the die paddle through the use of wire-bondable tape. The second is the use of lead-frame surface treatments prior to encapsulation to eliminate the moisture concentration at the backside of the die paddle.<>
SMT中塑料封装开裂的机理及两种解决方法
在低成本塑料封装中,由于表面贴装技术(SMT)过程中的热应力导致的封装裂纹对可靠性造成严重的长期危害。结果表明:硅模后表面和硅模前表面的水蒸气集中,导致硅模开裂的主要机理是水分膨胀。实验结果用于讨论和比较每个通常假设的开裂机制,并评估其成功消除塑料导致的芯片载体开裂问题的每种解决方案的概率。演示了两种大大提高塑料包装抗裂性的方法。一是通过使用钢丝粘接胶带消除模桨。第二是在封装之前使用铅框表面处理,以消除模桨背面的水分浓度。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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