Experimental results for 100 mu m pitch TAB technology

Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI:10.1109/EEMTS.1988.75953

M. Sugimoto, T. Yoshida, Y. Sumi, H. Hasegawa, K. Wada

引用次数: 1

Abstract

Fine line, high pin count TAB (tape automated bonding) has been demonstrated using a 13-mm/sup 2/ test die with 100 mu m pitch, and 484 gold bumps. Gold-tin eutectic bonding was carried out on the test die for both ILB (inner lead bonding) and OLB (outer lead bonding).<>

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100 μ m间距TAB技术的试验结果

细线，高引脚计数TAB(胶带自动粘接)已使用13毫米/sup 2/ 100亩间距的测试模具和484个金凸起进行了演示。在试验模上对内铅焊和外铅焊进行了金-锡共晶焊

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium

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