与工艺调节成型工艺动态力学测量相关的复合性能

Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI:10.1109/EEMTS.1988.75949

G. Draeger, M. Maier, F. Quella

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引用次数: 2

摘要

对封装VLSI更高可靠性的需求日益增长，需要工艺调节制造，包括材料的流变学和工具的设计。给出了一些典型的优化实例。为了评估不同成型化合物的应力形成，讨论了剪切模量和热膨胀的适用性，特别是它们的产品对温度的适用性。指出了这些测量值的局限性，并对扩展这些测量值提出了一些建议，例如老化。

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Compound properties in correlation to dynamic-mechanical measurements of process regulated molding technology

The increasing demand for better reliability of encapsulated VLSI requires process-regulated manufacturing, which includes the rheology of materials and the design of the tool. Some typical examples for the optimization are given. For an evaluation of stress formation by different molding compounds, the suitability of shear modulus and thermal expansion, especially of their product vs. temperature, is discussed. The limitations of these values are shown and do some suggestions for the extension of the measurements e.g. to aging are made.<>

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Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium

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