Molded circuit interconnects: electronic packaging in the third dimension

Abstract

Molded circuit interconnects are high-performance injection-molded thermoplastic devices with electrical and mechanical functions, incorporating printed-circuit boards, chip carriers, connectors, and structural elements. The change from a flat board or ceramic substrate to a molded three-dimensional part permits more original packaging solutions, with less parts, less assembly steps and lower total system cost. Selection of the right thermoplast material allows high-temperature, high-frequency applications and use where high-speed signal transmission is important. Produced by injection molding and selectively metallized, the parts have precise circuit traces, holes, and shapes, which is especially important for surface mount device (SMD) applications; they also have all the flexibility and three-dimensional capabilities expected from the molding process. Recessed circuitry and chip placement allows low-profile, high-density circuits, including chip-on-board applications.<>