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Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium最新文献

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Solder joints reliability of surface mounted components: a requirement for new quality insurance procedures 表面安装组件的焊点可靠性:新质量保险程序的要求
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1900-01-01 DOI: 10.1109/EEMTS.1988.75971
M. Auray, P. Catherine, J. Joly
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引用次数: 1
Mounting open-via-chip-carriers (for 100 to 300 inputs/outputs i.c.) 安装开孔芯片载波(100至300个输入/输出电路)
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1900-01-01 DOI: 10.1109/EEMTS.1988.75948
C. Val, X. Saint-martin
{"title":"Mounting open-via-chip-carriers (for 100 to 300 inputs/outputs i.c.)","authors":"C. Val, X. Saint-martin","doi":"10.1109/EEMTS.1988.75948","DOIUrl":"https://doi.org/10.1109/EEMTS.1988.75948","url":null,"abstract":"Techniques for the efficient soldering of open-via chip-carriers (OVCC) to substrates are discussed. The development is described of OVCCs for the encapsulation of integrated circuits with 300 inputs/outputs.<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123977858","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Management of a flexible SMD PCB production workshop 柔性贴片PCB生产车间的管理
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1900-01-01 DOI: 10.1109/EEMTS.1988.75969
C. Schoffit, J.J. Seneze
{"title":"Management of a flexible SMD PCB production workshop","authors":"C. Schoffit, J.J. Seneze","doi":"10.1109/EEMTS.1988.75969","DOIUrl":"https://doi.org/10.1109/EEMTS.1988.75969","url":null,"abstract":"The management of a flexible surface-mount device printed-circuit board assembly shop is discussed. The emphasis is on flexibility with regard to product diversity and with regard to production changes. Important parameters and solutions to key questions are presented.<<ETX>>","PeriodicalId":137899,"journal":{"name":"Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116316575","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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