表面安装组件的焊点可靠性:新质量保险程序的要求

Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1900-01-01 DOI:10.1109/EEMTS.1988.75971

M. Auray, P. Catherine, J. Joly

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引用次数: 1

摘要

j型导联元件焊点的热力学模拟可以优化安装过程，并在进行资格测试之前提供信心和节省时间。执行焊点检查的困难和成本已经导致他们被新的质量保险程序所取代。第一个实验结果是有希望的。

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Solder joints reliability of surface mounted components: a requirement for new quality insurance procedures

Thermomechanical simulation of solder joints of J-leaded components has permitted optimizations of the mounting process and provided confidence and time-saving before running qualification tests. The difficulties and the cost of performing solder joint inspection have led to their replacement by novel quality insurance procedures. The first experimental results are promising.<>

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Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium

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