安装开孔芯片载波(100至300个输入/输出电路)

Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1900-01-01 DOI:10.1109/EEMTS.1988.75948

C. Val, X. Saint-martin

引用次数: 0

摘要

讨论了开孔芯片载体(OVCC)与衬底的高效焊接技术。描述了用于封装具有300个输入/输出的集成电路的ovcc的发展。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Mounting open-via-chip-carriers (for 100 to 300 inputs/outputs i.c.)

Techniques for the efficient soldering of open-via chip-carriers (OVCC) to substrates are discussed. The development is described of OVCCs for the encapsulation of integrated circuits with 300 inputs/outputs.<>

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来源期刊

Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium

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