微电子元件的有限元分析——最新进展

Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI:10.1109/EEMTS.1988.75954

A. Schaller

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引用次数: 3

摘要

有限元方法已被证明在电子领域的各种分析中是非常有效的。随着组件变得越来越复杂，并且在更小的体积中包装得越来越紧密，热和振动环境变得更加激烈。强大的通用程序，如使用有限元方法的ANSYS软件包，为工程师提供了一个有价值的模拟工具，可用于各种计算机，从用于线性静力学和动力学的pc到用于三维流体流动分析的超级计算机。介绍了利用ANSYS对封装内自由对流传热进行板级模拟和分析的方法

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Finite element analysis of microelectronic components-state of the art

The finite-element method has proven very effective in a variety of analyses in the electronics areas. As the components become more and more complex and are packed closer together in smaller volumes, the heat and vibration environments become more intense. Powerful general-purpose programs such as the ANSYS package that use the finite-element method provide engineers with a valuable simulation tool available on a wide range of computers, from PCs for linear statics and dynamics to supercomputers for 3-D fluid-flow analyses. The use of ANSYS is described for board-level simulation and analysis of free convection heat transfer in packaging.<>

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Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium

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