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硅上的激光互连

Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI:10.1109/EEMTS.1988.75941
G. Nicolas
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引用次数: 0

摘要

讨论了硅晶圆级集成电路上铝导体重构(即切割或连接)的激光技术。
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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Laser interconnections on silicon
Laser techniques for reconfiguration (i.e. cutting or linking) of aluminum conductors on silicon wafer-scale integrated circuits are discussed.<>
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Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium
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