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TAB包封剂在线热和微波固化的仿真与分析

Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium Pub Date : 1988-06-13 DOI:10.1109/EEMTS.1988.75951
R. Pennisi
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引用次数: 1

摘要

一种市售环氧密封剂使用几种固化型材进行交联。在固化过程中和固化后对其热性能和介电性能进行了表征。结果被用来开发一个有效的固化轮廓使用在线红外和微波辅助固化炉。
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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Simulation and analysis of in-line thermal and microwave curing of TAB encapsulants
A commercially available epoxy encapsulant was crosslinked using several curing profiles. The thermal and dielectric properties were characterized during and after the curing process. The results were used to develop an efficient curing profile using inline infrared- and microwave-assisted curing ovens.<>
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Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium
Fourth IEEE/CHMT European International Electronic Manufacturing Technology Symposium
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